rs8754xp

PARTNUMBER	PACKAGE	BODY SIZE(NOM)
RS8751	SOT23-5	2.90mm×1.60mm
RS8752	SOP8	4.90mm×3.90mm
RS8752	MSOP8	3.00mm×3.00mm
RS8752	TSSOP8	3.00mm×4.40mm
RS8754	SOP14	8.65mm×3.90mm
RS8754	TSSOP14	5.00mm×4.40mm

Version	Change Date	Change Item
C.1	2023/03/02	Added the TAPE AND REEL INFORMATION
C.2	2023/04/17	Update Figure12, Figure13 curve in 7.5 TYPICAL CHARACTERISTICS
C.3	2024/01/16	1. Update Package Information 2. Add MSL on Page [email protected] Version
C.3.1	2024/02/29	Modify packaging naming

Orderable Device	Package Type	Pin	Channel	Op Temp(°C)	Device Marking(2)	MSL(3)	Package Qty
RS8751XF	SOT23-5	5	1	-40°C ~125°C	8751	MSL3	Tape and Reel,3000
RS8751BXF	SOT23-5	5	1	-40°C ~125°C	8751B	MSL3	Tape and Reel,3000
RS8752XK	SOP8	8	2	-40°C ~125°C	RS8752	MSL3	Tape and Reel,4000
RS8752XM	MSOP8	8	2	-40°C ~125°C	RS8752	MSL3	Tape and Reel,4000
RS8752XQ	TSSOP8	8	2	-40°C ~125°C	RS8752	MSL3	Tape and Reel,4000
RS8754XP	SOP14	14	4	-40°C ~125°C	RS8754	MSL3	Tape and Reel,4000
RS8754XQ	TSSOP14	14	4	-40°C ~125°C	RS8754	MSL3	Tape and Reel,4000

Table 5 · 4 columns × 14 rows · p.6–6 · CSV

NAME	PIN	I/O(1)	DESCRIPTION
NAME	SOP14/TSSOP14	I/O(1)	DESCRIPTION
-INA	2	I	Inverting input, channel A
+INA	3	I	Noninverting input, channel A
-INB	6	I	Inverting input, channel B
+INB	5	I	Noninverting input, channel B
-INC	9	I	Inverting input, channel C
+INC	10	I	Noninverting input, channel C
-IND	13	I	Inverting input, channel D
+IND	12	I	Noninverting input, channel D
OUTA	1	O	Output, channel A
OUTB	7	O	Output, channel B
OUTC	8	O	Output, channel C
OUTD	14	O	Output, channel D
V-	11	-	Negative (lowest) power supply
V+	4	-	Positive (highest) power supply

Table 6 · 14 columns × 23 rows · p.7–7 · CSV

							MIN		MAX				UNIT
Voltage	Voltage	Supply, VS =(V+) -(V-)	Supply, VS =(V+) -(V-)	Supply, VS =(V+) -(V-)	Supply, VS =(V+) -(V-)	Supply, VS =(V+) -(V-)			7	7	7	7	V
Voltage	Voltage	Signal input pin(2)	Signal input pin(2)	Signal input pin(2)	Signal input pin(2)	Signal input pin(2)	(V-)-0.5	(V-)-0.5	(V+) +0.5	(V+) +0.5	(V+) +0.5	(V+) +0.5	V
Voltage	Voltage	Signal output pin(3)	Signal output pin(3)	Signal output pin(3)	Signal output pin(3)	Signal output pin(3)	(V-)-0.5	(V-)-0.5	(V+) +0.5	(V+) +0.5	(V+) +0.5	(V+) +0.5	V
Current	Current	Signal input pin(2)	Signal input pin(2)	Signal input pin(2)	Signal input pin(2)	Signal input pin(2)	-10	-10	10	10	10	10	mA
Current	Current	Signal output pin(3)	Signal output pin(3)	Signal output pin(3)	Signal output pin(3)	Signal output pin(3)	-150	-150	150	150	150	150	mA
Current	Current	Output short-circuit(4)	Output short-circuit(4)	Output short-circuit(4)	Output short-circuit(4)	Output short-circuit(4)	Continuous	Continuous	Continuous	Continuous	Continuous	Continuous
θJA	θJA	Package thermal impedance(5)	Package thermal impedance(5)	Package thermal impedance(5)	SOT23-5	SOT23-5			230	230	230	230	°C/W
θJA	θJA	Package thermal impedance(5)	Package thermal impedance(5)	Package thermal impedance(5)	SOP8	SOP8			110	110	110	110	°C/W
θJA	θJA	Package thermal impedance(5)	Package thermal impedance(5)	Package thermal impedance(5)	MSOP8	MSOP8			170	170	170	170	°C/W
θJA	θJA	Package thermal impedance(5)	Package thermal impedance(5)	Package thermal impedance(5)	SOP14	SOP14			105	105	105	105	°C/W
θJA	θJA	Package thermal impedance(5)	Package thermal impedance(5)	Package thermal impedance(5)	TSSOP14	TSSOP14			90	90	90	90	°C/W
θJA	θJA	Package thermal impedance(5)	Package thermal impedance(5)	Package thermal impedance(5)	TSSOP8	TSSOP8			240	240	240	240	°C/W
Temperature	Temperature	Operating range, TA	Operating range, TA	Operating range, TA	Operating range, TA	Operating range, TA	-40	-40	125	125	125	125	°C
Temperature	Temperature	Junction, TJ (6)	Junction, TJ (6)	Junction, TJ (6)	Junction, TJ (6)	Junction, TJ (6)	-40	-40	150	150	150	150	°C
Temperature	Temperature	Storage, Tstg	Storage, Tstg	Storage, Tstg	Storage, Tstg	Storage, Tstg	-65	-65	150	150	150	150	°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.	(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be current-limited to ±150mA or less. (4) Short-circuit to ground, one amplifier per package. (5) The package thermal impedance is calculated in accordance with JESD-51. (6) The maximum power dissipation is a function of TJ(MAX) , RθJA , and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA ) / RθJA . All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
											VALUE	VALUE	UNIT
V(ESD)	Electrostatic discharge	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	±5000	±5000	V
V(ESD)	Electrostatic discharge	Electrostatic discharge	Machine Model (MM)	Machine Model (MM)	Machine Model (MM)	Machine Model (MM)	Machine Model (MM)	Machine Model (MM)	Machine Model (MM)	Machine Model (MM)	±400	±400	V
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)	(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted)
						MIN	MIN	NOM	NOM	MAX	MAX	UNIT	UNIT
Supply voltage, VS = (V+) -(V-)	Supply voltage, VS = (V+) -(V-)	Supply voltage, VS = (V+) -(V-)	Supply voltage, VS = (V+) -(V-)	Single-supply	Single-supply	2.5	2.5			5.5	5.5	V	V
Supply voltage, VS = (V+) -(V-)	Supply voltage, VS = (V+) -(V-)	Supply voltage, VS = (V+) -(V-)	Supply voltage, VS = (V+) -(V-)	Dual-supply	Dual-supply	±1.25	±1.25			±2.75	±2.75	V	V

Table 7 · 7 columns × 27 rows · p.8–8 · CSV

PARAMETER		CONDITIONS	RS8751, RS8752, RS8754
PARAMETER		CONDITIONS	MIN(2)	TYP(3)	MAX(2)	UINT
POWER SUPPLY
VS	Operating Voltage Range		2.5		5.5	V
IQ	Quiescent Current Per Amplifier			2.9	3.5	mA
PSRR	Power-Supply Rejection Ratio	VS =2.5V to 5.5V, VCM =(V-)+0.5V	70	90		dB
INPUT	INPUT	INPUT	INPUT	INPUT	INPUT	INPUT
VOS	Input Offset Voltage	VCM =Vs/2	-7.5	±1.5	7.5	mV
ΔVos/ΔT	Input Offset Voltage Average Drift	VCM =Vs/2, TA = -40°C to 125°C		±4		uV/°C
IB	Input Bias Current(4) (5)			±1	±10	pA
IOS	Input Offset Current(4)			±1	±10	pA
VCM	Common-Mode Voltage Range	VS = 5V	-0.2		3.9	V
CMRR	Common-Mode Rejection Ratio	VS = 5.5V, VCM =-0.2V to 3.5V	66	85		dB
OUTPUT	OUTPUT	OUTPUT	OUTPUT	OUTPUT	OUTPUT	OUTPUT
AOL	Open-Loop Voltage Gain	Vs=5.0V, RL =1KΩ, Vo=Vs-0.2V	95	110		dB
AOL	Open-Loop Voltage Gain	Vs=5.0V, RL =150Ω, Vo=Vs-0.3V	78	85		dB
	Output Swing From Rail	RL =1KΩ		23		mV
IOUT	Output Current Source(6) (7)			85		mA
IOUT	Output Current Sink(6) (7)			125		mA
FREQUENCY RESPONSE	FREQUENCY RESPONSE	FREQUENCY RESPONSE	FREQUENCY RESPONSE	FREQUENCY RESPONSE	FREQUENCY RESPONSE	FREQUENCY RESPONSE
	Small-Signal Bandwidth	VOUT =100mVpp, G=1		250		MHz
		VOUT =100mVpp, G=2		130		MHz
		VOUT =100mVpp, G=5		33		MHz
		VOUT =100mVpp, G=10		15		MHz
SR	Slew Rate(8)			180		V/us
GBP	Gain-Bandwidth Product			250		MHz
PM	Phase Margin			62		°
NOISE	NOISE	NOISE	NOISE	NOISE	NOISE	NOISE
en p-p	Input Voltage Noise	f = 0.1 Hz to 10 Hz		13		uVpp
en	Input Voltage Noise Density	f = 1 MHz		8		nV/√Hz

Table 8 · 4 columns × 3 rows · p.9–9 · CSV

	1 Gain=2		8
Gain (dB)	-1 0	R L=10KΩL =10KΩ	Gain (dB) 2 4 6
Normalized	-2 R RL=50Ω L =50Ω -3 RL =150Ω -4 RL =1KΩ		Normalized -6 -4 -2 0
	-5		-8
	1M 10M	100M 1000M	1M

Table 9 · 4 columns × 3 rows · p.9–9 · CSV

Gain (dB) 2 4 6	VS = 5V, G=2, RF =887		CL =100P
Normalized -6 -4 -2 0			CL =47PCL =6P
-8
	1M	10M	100M 1000M

Table 10 · 3 columns × 2 rows · p.9–9 · CSV

2
Gain (dB) -4 -2 0		RL =10KΩ
Normalized -10 -8 -6	RL =150Ω RL =50Ω	RL =1KΩVS = 5V,

(dB)	0.2
Gain	0
Normalized	-0.2-0.4

-12 L		G=2,
-14		RF =887
10M	100M

Table 13 · 2 columns × 2 rows · p.10–10 · CSV

150	130
145	120
Current(mA) 140 135 130 125	Current(mA) 100 110 90

		2.2 nF
562	6.19 k
	330 pF	RS875X

Table 15 · 5 columns × 2 rows · p.15–15 · CSV

VIN A	+	VIN B	+
RG		VOUT A RG		VOUT B
	RF		RF

Table 16 · 5 columns × 2 rows · p.15–15 · CSV

Us e low-ESR, ceramic bypass capacitor. Place as	GND	VS-	Ground (GND) plane on another layer	Keep in put traces short and ru n the input traces as far away from the supply lines
clos e to the device				as possible.
as possible.

Table 17 · 14 columns × 16 rows · p.17–17 · CSV

A1										A
A1
A1
A1		L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ
Symbol	Symbol	Symbol	Symbol	Symbol	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Inches	Dimensions In Inches
Symbol	Symbol	Symbol	Symbol	Symbol	Min	Min	Min	Min	Min	Min	Max	Min	Max
A(1)	A(1)	A(1)	A(1)	A(1)	0.820	0.820	0.820	0.820	0.820	0.820	1.100	0.032	0.043
A1	A1	A1	A1	A1	0.020	0.020	0.020	0.020	0.020	0.020	0.150	0.001	0.006
A2	A2	A2	A2	A2	0.750	0.750	0.750	0.750	0.750	0.750	0.950	0.030	0.037
b	b	b	b	b	0.250	0.250	0.250	0.250	0.250	0.250	0.380	0.010	0.015
c	c	c	c	c	0.090	0.090	0.090	0.090	0.090	0.090	0.230	0.004	0.009
D(1)	D(1)	D(1)	D(1)	D(1)	2.900	2.900	2.900	2.900	2.900	2.900	3.100	0.114	0.122
e	e	e	e	e	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.026(BSC)(2)	0.026(BSC)(2)
E(1)	E(1)	E(1)	E(1)	E(1)	2.900	2.900	2.900	2.900	2.900	2.900	3.100	0.114	0.122
E1	E1	E1	E1	E1	4.750	4.750	4.750	4.750	4.750	4.750	5.050	0.187	0.199
L	L	L	L	L	0.400	0.400	0.400	0.400	0.400	0.400	0.800	0.016	0.031
θ	θ	θ	θ	θ	0°	0°	0°	0°	0°	0°	6°	0°	6°

Table 18 · 19 columns × 18 rows · p.19–19 · CSV

A1											A C
A1											A C	A C	A C
A1											A C	A C	A C
A1
A1		L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ	L θ
Symbol	Symbol	Symbol	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Inches	Dimensions In Inches	Dimensions In Inches	Dimensions In Inches	Dimensions In Inches	Dimensions In Inches
Symbol	Symbol	Symbol	Min	Min	Min	Min	Min	Min	Min	Min	Min	Max	Min	Min	Max	Max	Max	Max
A(1)	A(1)	A(1)										1.200			0.047	0.047	0.047	0.047
A1	A1	A1	0.050	0.050	0.050	0.050	0.050	0.050	0.050	0.050	0.050	0.150	0.002	0.002	0.006	0.006	0.006	0.006
A2	A2	A2	0.800	0.800	0.800	0.800	0.800	0.800	0.800	0.800	0.800	1.050	0.031	0.031	0.041	0.041	0.041	0.041
b	b	b	0.190	0.190	0.190	0.190	0.190	0.190	0.190	0.190	0.190	0.300	0.007	0.007	0.012	0.012	0.012	0.012
c	c	c	0.090	0.090	0.090	0.090	0.090	0.090	0.090	0.090	0.090	0.200	0.004	0.004	0.008	0.008	0.008	0.008
D(1)	D(1)	D(1)	2.900	2.900	2.900	2.900	2.900	2.900	2.900	2.900	2.900	3.100	0.114	0.114	0.122	0.122	0.122	0.122
E(1)	E(1)	E(1)	4.300	4.300	4.300	4.300	4.300	4.300	4.300	4.300	4.300	4.500	0.169	0.169	0.177	0.177	0.177	0.177
E1	E1	E1	6.250	6.250	6.250	6.250	6.250	6.250	6.250	6.250	6.250	6.550	0.246	0.246	0.258	0.258	0.258	0.258
e	e	e	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.650(BSC)(2)	0.026(BSC)(2)	0.026(BSC)(2)	0.026(BSC)(2)	0.026(BSC)(2)	0.026(BSC)(2)	0.026(BSC)(2)
L	L	L	0.500	0.500	0.500	0.500	0.500	0.500	0.500	0.500	0.500	0.700	0.020	0.020	0.028	0.028	0.028	0.028
H	H	H	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.25(TYP)	0.01(TYP)	0.01(TYP)	0.01(TYP)	0.01(TYP)	0.01(TYP)	0.01(TYP)
θ	θ	θ	1°	1°	1°	1°	1°	1°	1°	1°	1°	7°	1°	1°	7°	7°	7°	7°

Table 4 · 5 columns × 6 rows · p.6–6 · CSV

-IN A	2	A D-+ + -	13	-IN D
+IN A	3		12	+IN D
V+	4		11	V-
+IN B	5		10	+IN C
-IN B	6	-+ + -B C	9	-IN C
OUT B	7		8	OUT C
		SOP14/TSSOP14

Table 19 · 18 columns × 25 rows · p.20–20 · CSV

E1A2 A1											5.2 2.2
E1A2 A1	E1A2 A1	E1A2 A1									5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2
E1A2 A1	E1A2 A1	E1A2 A1											5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2
E1A2 A1	E1A2 A1	E1A2 A1											5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2
E1A2 A1	E1A2 A1	E1A2 A1											5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2
E1A2 A1	E1A2 A1	E1A2 A1									5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2
E1A2 A1	E1A2 A1	E1A2 A1									5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2	5.2 2.2
E1A2 A1	E1A2 A1	E1A2 A1	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ
E1A2 A1	E1A2 A1	E1A2 A1	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ
E1A2 A1	E1A2 A1	E1A2 A1	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ
E1A2 A1	E1A2 A1	E1A2 A1	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ
E1A2 A1	E1A2 A1	E1A2 A1	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ
E1A2 A1	E1A2 A1	E1A2 A1	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ	D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A c L θ
Symbol	Symbol	Symbol	Symbol	Symbol	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Millimeters	Dimensions In Inches	Dimensions In Inches	Dimensions In Inches	Dimensions In Inches
Symbol	Symbol	Symbol	Symbol	Symbol	Min	Min	Min	Min	Min	Min	Min	Min	Max	Min	Min	Max	Max
A(1)	A(1)	A(1)	A(1)	A(1)	1.350	1.350	1.350	1.350	1.350	1.350	1.350	1.350	1.750	0.053	0.053	0.069	0.069
A1	A1	A1	A1	A1	0.100	0.100	0.100	0.100	0.100	0.100	0.100	0.100	0.250	0.004	0.004	0.010	0.010
A2	A2	A2	A2	A2	1.350	1.350	1.350	1.350	1.350	1.350	1.350	1.350	1.550	0.053	0.053	0.061	0.061
b	b	b	b	b	0.330	0.330	0.330	0.330	0.330	0.330	0.330	0.330	0.510	0.013	0.013	0.020	0.020
c	c	c	c	c	0.170	0.170	0.170	0.170	0.170	0.170	0.170	0.170	0.250	0.007	0.007	0.010	0.010
D(1)	D(1)	D(1)	D(1)	D(1)	4.800	4.800	4.800	4.800	4.800	4.800	4.800	4.800	5.000	0.189	0.189	0.197	0.197
e	e	e	e	e	1.270(BSC)(2)	1.270(BSC)(2)	1.270(BSC)(2)	1.270(BSC)(2)	1.270(BSC)(2)	1.270(BSC)(2)	1.270(BSC)(2)	1.270(BSC)(2)	1.270(BSC)(2)	0.050(BSC)(2)	0.050(BSC)(2)	0.050(BSC)(2)	0.050(BSC)(2)
E	E	E	E	E	5.800	5.800	5.800	5.800	5.800	5.800	5.800	5.800	6.200	0.228	0.228	0.244	0.244
E1(1)	E1(1)	E1(1)	E1(1)	E1(1)	3.800	3.800	3.800	3.800	3.800	3.800	3.800	3.800	4.000	0.150	0.150	0.157	0.157
L	L	L	L	L	0.400	0.400	0.400	0.400	0.400	0.400	0.400	0.400	1.270	0.016	0.016	0.050	0.050
θ	θ	θ	θ	θ	0°	0°	0°	0°	0°	0°	0°	0°	8°	0°	0°	8°	8°

Table 20 · 14 columns × 6 rows · p.22–22 · CSV

NOTE: The picture KEY PARAMETER
NOTE: The picture KEY PARAMETER	Reel Width(W1) DIRECTION OF FEED is only for reference. Please make the object as the standard. LIST OF TAPE AND REEL
Package Type		Reel Diameter			Reel Width (mm)	A0 (mm)	B0 (mm)	K0 (mm)	P0 (mm)	P1 (mm)	P2 (mm)	W (mm)	Pin1 Quadrant
SOT23-5	SOT23-5	7’’	7’’	7’’	9.5	3.20	3.20	1.40	4.0	4.0	2.0	8.0	Q3
MSOP8	MSOP8	13’’	13’’	13’’	12.4	5.20	3.30	1.50	4.0	8.0	2.0	12.0	Q1
TSSOP14	TSSOP14	13’’	13’’	13’’	12.4	6.95	5.60	1.20	4.0	8.0	2.0	12.0	Q1
SOP8	SOP8	13’’	13’’	13’’	12.4	6.40	5.40	2.10	4.0	8.0	2.0	12.0	Q1
SOP14	SOP14	13’’	13’’	13’’	16.4	6.60	9.30	2.10	4.0	8.0	2.0	16.0	Q1
TSSOP8	TSSOP8	13’’	13’’	13’’	12.4	6.90	3.45	1.65	4.0	8.0	2.0	12.0	Q1

Table 1 (pages 1–1)

Table 2 (pages 3–3)

Table 3 (pages 4–4)

Table 4 (pages 6–6)

Table 5 (pages 6–6)

Table 6 (pages 7–7)

Table 7 (pages 8–8)

Table 8 (pages 9–9)

Table 9 (pages 9–9)

Table 10 (pages 9–9)

Table 11 (pages 9–9)

Table 12 (pages 9–9)

Table 13 (pages 10–10)

Table 14 (pages 14–14)

Table 15 (pages 15–15)

Table 16 (pages 15–15)

Table 17 (pages 17–17)

Table 18 (pages 19–19)

Table 19 (pages 20–20)

Table 20 (pages 22–22)