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MCP3561/2/4R

Two/Four/Eight-Channel, 153.6 ksps, Low Noise 24-Bit Delta-Sigma ADCs with Internal Voltage Reference Features General Description

• One/Two/Four Differential or Two/Four/Eight

Single-Ended Input Channels • 24-Bit Resolution • Programmable Data Rate: Up to 153.6 ksps • Programmable Gain: 0.33x to 64x • 106.7 dB SINAD, -116 dBc THD, 120 dBc SFDR

• Low-Temperature Drift:

• Offset error drift: 4/Gain nV/°C (AZ_MUX = 1) - Gain error drift: 0.5 ppm/°C (Gain = 1x) • Low Noise: 90 nV RMS (Gain = 16x,12.5 SPS) • RMS Effective Resolution: Up to 23.3 Bits • Wide Input Voltage Range: 0V to AV DD • Selectable Internal 2.4V Voltage Reference with

15 ppm/°C drift • Differential Voltage Reference Inputs • Internal Oscillator or External Clock Selection • Ultra-Low Full Shutdown Current Consumption

(<2.4 µA) • Internal Temperature Sensor • Burnout Current Sources for Sensor Open/Short

Detection • 24-Bit Digital Offset and Gain Error Calibration

Registers • Internal Conversions Sequencer (SCAN mode)

for Automatic Multiplexing • Dedicated IRQ Pin for Easy Synchronization • Advanced Security Features:

• 16-bit CRC for secure SPI communications - 16-bit CRC and IRQ for securing

configuration - Register map lock with 8-bit secure key - Monitor controls for system diagnostics • 20 MHz SPI-Compatible Interface with Mode 0,0

and 1,1 • AV DD : 2.7V-3.6V • DV DD : 1.8V-3.6V • Extended Temperature Range: -40°C to +125°C • Package: 3 mm x 3 mm x 0.55 mm, 20-Lead

UQFN and 6.5 mm x 4.4 mm x 1 mm, 20-Lead TSSOP The MCP3561/2/4R devices are 2/4/8-Channel, 24-Bit, Delta-Sigma Analog-to-Digital Converters (ADCs) with programmable data rate of up to 153.6 ksps. They offer integrated features, such as internal voltage reference, internal oscillator, temperature sensor and burnout sensor detection, in order to reduce system component count and total solution cost.

 2020-2021 Microchip Technology Inc.

The MCP3561/2/4R ADCs are fully configurable with Oversampling Ratio (OSR) from 32 to 98304 and gain from 1/3x to 64x. These devices include an internal sequencer (SCAN mode) with multiple monitor channels and a 24-bit timer to be able to automatically create conversion loop sequences without needing MCU communications. Advanced security features, such as CRC and register map lock, can ensure configuration locking and integrity, as well as communication data integrity for secure environments. These devices come with a 20 MHz SPI-compatible serial interface. Communication is largely simplified with 8-bit commands, including various Continuous Read/Write modes and 24/32-bit multiple data formats that can be accessed by the Direct Memory Access (DMA) of an 8-bit, 16-bit or 32-bit MCU. The MCP3561/2/4R devices are available in a leaded 20-Lead TSSOP package, as well as in an ultra-small, 3 mm x 3 mm x 0.55 mm 20-Lead UQFN package and are specified over an extended temperature range from -40°C to +125°C.

Applications

• Precision sensor transducers and transmitters:

pressure, strain, flow and force measurement • Factory automation and process controls • Portable instrumentation • Temperature measurements DS20006391C-page 1

MCP3561/2/4R

Package Types – 20-Lead UQFN Package Type for All Devices: 20-Lead UQFN* (3 mm x 3 mm x 0.55 mm)

MCLK D GND DV DD AV DD A GND

A. MCP3561R: Single Channel Device

20 19 18 17 16 REFIN- 1 15 IRQ/MDAT REFIN+/OUT 2

CH0 14 SDO EP 21 3 CH1 4 NC 5 13 SDI 12 SCK 11 CS NC NC NC NC DV DD

DGND MCLK 9 10 NC 8 AV DD 7 A GND 6

B. MCP3562R: Dual Channel Device

20 19 18 17 16 REFIN- 1 REFIN+/OUT 2

CH0 3 CH1 4 CH2 5 15 IRQ/MDAT 14 SDO EP 21

12 SCK 11 CS NC NC NC NC DV DD

DGND MCLK 9 10 CH3 8 AV DD 7 A GND 6

C. MCP3564R: Quad Channel Device

13 SDI 20 19 18 17 16 REFIN- 1 15 IRQ/MDAT REFIN+/OUT 2 14 SDO

EP 21 CH0 3 CH1 4 13 SDI 12 SCK CH2 5

9 10 CH7 CH4 8

CH6 7

CH5 6 CH3 11 CS *Includes Exposed Thermal Pad (EP); see Table 3-1.

DS20006391C-page 2  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

Package Types – 20-Lead TSSOP Package Type for All Devices: 20-Lead TSSOP (6.5 mm x 4.4 mm x 1 mm) A. MCP3561R: Single Channel Device

AV DD 1 20 DV DD A GND 2 19 D GND REFIN- 3 18 MCLK REFIN+/OUT 4 17 IRQ/MDAT

CH0 5 16 SDO CH1 6 15 SDI NC 7 14 SCK NC 8 13 CS NC 9 12 NC NC 10 11 NC 20 DV DD

B. MCP3562R: Dual Channel Device

AV DD 1 A GND 2 19 D GND REFIN- 3 18 MCLK REFIN+/OUT 4 17 IRQ/MDAT

CH0 5 16 SDO

CH1 6 15 SDI CH2 7 14 SCK CH3 8 13 CS NC 9 12 NC NC 10 11 NC 20 DV DD

C. MCP3564R: Quad Channel Device

Note:

AV DD 1 A GND 2 19 D GND REFIN- 3 18 MCLK REFIN+/OUT 4 17 IRQ/MDAT

CH0 5 16 SDO

CH1 6 15 SDI CH2 7 14 SCK CH3 8 13 CS CH4 9 12 CH7 CH5 10 11 CH6 The NC is a Not Connected pin. It is recommended for the NC pin to be tied to A GND for a better susceptibility to electromagnetic fields.

 2020-2021 Microchip Technology Inc. DS20006391C-page 3

MCP3561/2/4R

Functional Block Diagram

REFIN+/OUT AV DD Voltage + 2.4V Reference - REFINDV DD

AMCLK VREF_SEL DMCLK/DRCLK Clock Generation (RC Oscillator)

MCLK

IRQ/MDAT V REF- V REF+ MCP3562/4R

only MCP3564R

only CH0 CH1 CH2 DMCLK V IN+ V IN+

• nd '6 2 order

REFIN+/OUT AV DD DV DD

AMCLK VREF_SEL Voltage + 2.4V Reference

• REFIN- DMCLK/DRCLK

MCLK Clock Generation IRQ/MDAT (RC Oscillator)

V REF- V REF+ MCP3562/4R only MCP3564R only CH6 CH7 DS20006391C-page 4 A GND AV DD CH3 CH4 CH5

V IN+

DMCLK + + x - V IN- '6 2 nd order SINC 3 filter SINC 1

modulator with analog gain Analog differential multiplexer

CH6 CH7

with digital filter gain

OSR[3:0] PRE[1:0] Offset/Gain Digital SPI Calibration Interface

and control '6 A/D Converter Burnout current sources TEMP diodes A GND AV DD

POR AV DD Monitoring

SDO SDI SCK CS POR DV DD Monitoring A GND ANALOG DIGITAL D GND SINC 3 filter with digital

gain POR AV DD Monitoring A GND ANALOG SINC 1 filter Offset/Gain Calibration OSR[3:0] PRE[1:0]

SDO Digital SPI Interface and control SDI SCK CS '6A/D

Converter Burnout current sources TEMP diodes CH0 CH1 CH2 modulator with analog

gain Analog differential multiplexer CH3 CH4 CH5 + x POR DV DD Monitoring DIGITAL D GND  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†)

DV DD , AV DD ......................................................................................................................................................-0.3 to 4.0V Digital Inputs and Outputs w.r.t. D GND ............................................................................................ -0.3V to DV DD + 0.3V Analog Inputs w.r.t. A GND .................................................................................................................-0.3V to AV DD + 0.3V Current at Input Pins ...............................................................................................................................................±5 mA Current at Output and Supply Pins ...................................................................................................................... ±20 mA Storage Temperature .............................................................................................................................. -65°C to +150°C Ambient Temperature with Power Applied .............................................................................................. -65°C to +125°C Soldering Temperature of Leads (10 seconds) ..................................................................................................... +300°C Maximum Junction Temperature (T J ) ........................................................................................... .........................+150°C ESD on All Pins (HBM)  6.0 kV † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operational listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

 2020-2021 Microchip Technology Inc. DS20006391C-page 5

MCP3561/2/4R

ELECTRICAL CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all parameters apply at AV DD = 2.7V to 3.6V, DV DD = 1.8V to AV DD + 0.1V, MCLK = 4.9152 MHz, V REF = AV DD , ADC_MODE[1:0] = 11. All other register map bits to their default conditions,

Parameters Sym. Min. Typ. Max. Units V Conditions

Supply Requirements Analog Operating Voltage AV DD 2.7 — 3.6 Digital Operating Voltage DV DD 1.8 — AV DD + 0.1 V DV DD ≤ 3.6V Analog Operating Current AI DD — 0.56 0.81 mA BOOST[1:0] = 00, 0.5x

V REF = 2.4V internal

V REF = 2.4V internal

V REF = 2.4V internal

V REF = 2.4V internal Analog Operating Current AI DD Digital Operating Current DI DD — 0.25 0.37 mA (Note 8) Analog Partial Shutdown Current

Digital Partial Shutdown Current

Analog Full Shutdown Current

Digital Full Shutdown Current

V POR_A — 1.75 — V For analog circuits V POR_D — 1.2 — V For digital circuits POR Hysteresis V POR_HYS — 150 — mV POR Reset Time t POR — 1 — µs Power-on Reset (POR) Threshold Voltage Note 1:

2: 3: 4: 5:

This parameter is ensured by design and not 100% tested. This parameter is ensured by characterization and not 100% tested. REFIN- must be connected to ground for single-ended measurements. Full-Scale Range (FSR) = 2 x V REF /GAIN. This input impedance is due to the internal input sampling capacitor and frequency. This impedance is measured between the two input pins of the channel selected with the input multiplexer. 6: Applies to all analog gains. Offset and gain errors depend on analog gain settings. See Section 2.0, Typical

Performance Curves. 7: INL is the difference between the endpoints line and the measured code at the center of the quantization band. 8: DI DD is measured while no transfer is present on the SPI bus. 9: An external buffer is recommended for external use. 10: Start-up Time is the reaction time to the SPI command. 11: Settling Time depends on bypass caps on REFIN+/OUT pin.

DS20006391C-page 6  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all parameters apply at AV DD = 2.7V to 3.6V, DV DD = 1.8V to AV DD + 0.1V, MCLK = 4.9152 MHz, V REF = AV DD , ADC_MODE[1:0] = 11. All other register map bits to their default conditions,

Parameters Sym. Min. Typ. Max. Units Conditions Input Voltage at Input Pin CH N A GND – 0.1 — AV DD + 0.1 V Differential Input Range V IN -V REF /GAIN — +V REF /GAIN V Differential Input Impedance (Note 5)

Z IN — 510 — k GAIN = 0.33x, proportional to

1/AMCLK — 260 — k GAIN = 1x, proportional to

1/AMCLK — 150 — k GAIN = 2x, proportional to

1/AMCLK — 80 — k GAIN = 4x, proportional to

1/AMCLK — 40 — k GAIN = 8x, proportional to

1/AMCLK — 20 — k GAIN ≥ 16x, proportional to

1/AMCLK

Internal V REF Absolute Voltage I VREF -2% 2.4 +2% V Internal V REF Temperature Coefficient T CREFE — 15 40 ppm/°C T A = -40°C to +125°C, Extended

Temperature Range (Note 2) Internal V REF Temperature Coefficient

(Note 2) Voltage Reference Buffer Short Circuit Current I REF_SC — — 8 mA REFIN+/OUT shorted to A GND ,

Internal Reference Settling Time t VREF_SET — 12 — ms Settling to 10 ppm from final

value, bypass capacitor 1 µF, (Note 2,Note 11) Internal V REF Output Noise

Analog Inputs Analog Input Leakage Current During ADC Shutdown Analog inputs are measured with respect to A GND Internal Voltage Reference

Note 1:

2: 3: 4: 5:

This parameter is ensured by design and not 100% tested. This parameter is ensured by characterization and not 100% tested. REFIN- must be connected to ground for single-ended measurements. Full-Scale Range (FSR) = 2 x V REF /GAIN. This input impedance is due to the internal input sampling capacitor and frequency. This impedance is measured between the two input pins of the channel selected with the input multiplexer. 6: Applies to all analog gains. Offset and gain errors depend on analog gain settings. See Section 2.0, Typical

Performance Curves. 7: INL is the difference between the endpoints line and the measured code at the center of the quantization band. 8: DI DD is measured while no transfer is present on the SPI bus. 9: An external buffer is recommended for external use. 10: Start-up Time is the reaction time to the SPI command. 11: Settling Time depends on bypass caps on REFIN+/OUT pin.

 2020-2021 Microchip Technology Inc. DS20006391C-page 7

MCP3561/2/4R

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all parameters apply at AV DD = 2.7V to 3.6V, DV DD = 1.8V to AV DD + 0.1V, MCLK = 4.9152 MHz, V REF = AV DD , ADC_MODE[1:0] = 11. All other register map bits to their default conditions,

Parameters Sym. Min. Typ. Max. Units Conditions External Voltage Reference Input Reference Voltage Range (V REF + – V REF -)

External Noninverting Input Voltage Reference V REF + V REF- + 0.6 — AV DD V External Inverting Input Voltage Reference V REF - A GND — V REF+ – 0.6 V Resolution 24 — — Bits OSR ≥ 256 (Note 1)

AV DD Power Supply Rejection Ratio DV DD Power Supply Rejection Ratio DC PSRR — -110 — dB DV DD varies from 1.8V to 3.6V,

V IN = 0V DC Common-Mode Rejection Ratio DC CMRR — -126 — dB V INCOM varies from 0V to AV DD ,

V IN = 0V Note 1:

2: 3: 4: 5:

This parameter is ensured by design and not 100% tested. This parameter is ensured by characterization and not 100% tested. REFIN- must be connected to ground for single-ended measurements. Full-Scale Range (FSR) = 2 x V REF /GAIN. This input impedance is due to the internal input sampling capacitor and frequency. This impedance is measured between the two input pins of the channel selected with the input multiplexer. 6: Applies to all analog gains. Offset and gain errors depend on analog gain settings. See Section 2.0, Typical

Performance Curves. 7: INL is the difference between the endpoints line and the measured code at the center of the quantization band. 8: DI DD is measured while no transfer is present on the SPI bus. 9: An external buffer is recommended for external use. 10: Start-up Time is the reaction time to the SPI command. 11: Settling Time depends on bypass caps on REFIN+/OUT pin.

DS20006391C-page 8  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all parameters apply at AV DD = 2.7V to 3.6V, DV DD = 1.8V to AV DD + 0.1V, MCLK = 4.9152 MHz, V REF = AV DD , ADC_MODE[1:0] = 11. All other register map bits to their default conditions,

Parameters Sym. Min. Typ. Max. Units Conditions SINAD 105.8 106.7 — dB AV DD = DV DD = V REF = 3.3V

V REF = 2.4V internal, bypass capacitor 0.1 µF and

106.7 107.2 — dBc AV DD = DV DD = V REF = 3.3V

V REF = 2.4V internal, bypass capacitor 0.1 µF and

and T A = +25°C, includes the first 10 harmonics (Note 2)

V REF = 2.4V internal, bypass capacitor 0.1 µF and T A = +25°C, includes the first 10 harmonics (Note 2)

V REF = 2.4V internal, bypass capacitor 0.1 µF and

AC Performance Signal-to-Noise and Distortion Ratio Signal-to-Noise Ratio Total Harmonic Distortion Spurious-Free Dynamic Range SNR THD SFDR Input Channel Crosstalk CTALK — -130 — dB V IN = 0V, Perturbation = 0 dB at

50 Hz, applies to all perturbation channels and all input channels AC Power Supply Rejection Ratio AC PSRR — -75 – 20 x

LOG (GAIN)

AC Common-Mode Rejection Ratio AC CMRR — -122 — dB V INCOM = 0 dB at 50 Hz,

V IN = 0V Note 1:

2: 3: 4: 5:

This parameter is ensured by design and not 100% tested. This parameter is ensured by characterization and not 100% tested. REFIN- must be connected to ground for single-ended measurements. Full-Scale Range (FSR) = 2 x V REF /GAIN. This input impedance is due to the internal input sampling capacitor and frequency. This impedance is measured between the two input pins of the channel selected with the input multiplexer. 6: Applies to all analog gains. Offset and gain errors depend on analog gain settings. See Section 2.0, Typical

Performance Curves. 7: INL is the difference between the endpoints line and the measured code at the center of the quantization band. 8: DI DD is measured while no transfer is present on the SPI bus. 9: An external buffer is recommended for external use. 10: Start-up Time is the reaction time to the SPI command. 11: Settling Time depends on bypass caps on REFIN+/OUT pin.

 2020-2021 Microchip Technology Inc. DS20006391C-page 9

MCP3561/2/4R

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all parameters apply at AV DD = 2.7V to 3.6V, DV DD = 1.8V to AV DD + 0.1V, MCLK = 4.9152 MHz, V REF = AV DD , ADC_MODE[1:0] = 11. All other register map bits to their default conditions,

Parameters Sym. Min. Typ. Max. Units Conditions

ADC Timing Parameters Sampling Frequency DMCLK See Table 5-6 MHz See Figure 4-1 Output Data Rate DRCLK See Table 5-6 ksps See Figure 4-1 ms See Figure 4-1 Data Conversion Time T CONV ADC Start-up Delay T ADC_SETUP See Table 5-6 — 256 — DMCLK

periods ADC_MODE[1:0] change from ‘0x’ to ‘1x’ — 0 — DMCLK

periods ADC_MODE[1:0] change from ‘10’ to ‘11’ Conversion Start Pulse Low Time T STP — 1 — DMCLK

periods SCAN Mode Time Delays T DLY_SCAN 0 — 512 DMCLK

periods Time delay between sampling channels T TIMER_SCAN 0 — 16777215 DMCLK

periods Time interval between SCAN cycles Data Ready Pulse Low Time T DRL — — OSR-16 DMCLK

periods See Figure 5-16 Data Ready Pulse High Time T DRH 16 — — DMCLK

periods See Figure 5-16 Data Transfer Time to DR (Data Ready)

t DODR — — 50 ns Modulator Output Valid from AMCLK High

External Master Clock Input (CLK_SEL[1] = 0)

1 — 10 MHz DV DD < 2.7V f MCLK_DUTY 45 — 55 %

Internal Oscillator Start-up Time t OSC_STARTUP — 10 — µs CLK_SEL[1] changes from ‘0’

to ‘1’, time to stabilize the clock frequency to ±1 kHz of the final value (Note 10) Internal Oscillator Current Consumption IDD OSC — 30 — µA Should be added to DI DD when

Master Clock Input Frequency Range f MCLK_EXT Master Clock Input Duty Cycle Internal Clock Oscillator Internal Master Clock Frequency Note 1:

2: 3: 4: 5:

This parameter is ensured by design and not 100% tested. This parameter is ensured by characterization and not 100% tested. REFIN- must be connected to ground for single-ended measurements. Full-Scale Range (FSR) = 2 x V REF /GAIN. This input impedance is due to the internal input sampling capacitor and frequency. This impedance is measured between the two input pins of the channel selected with the input multiplexer. 6: Applies to all analog gains. Offset and gain errors depend on analog gain settings. See Section 2.0, Typical

Performance Curves. 7: INL is the difference between the endpoints line and the measured code at the center of the quantization band. 8: DI DD is measured while no transfer is present on the SPI bus. 9: An external buffer is recommended for external use. 10: Start-up Time is the reaction time to the SPI command. 11: Settling Time depends on bypass caps on REFIN+/OUT pin.

DS20006391C-page 10  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all parameters apply at AV DD = 2.7V to 3.6V, DV DD = 1.8V to AV DD + 0.1V, MCLK = 4.9152 MHz, V REF = AV DD , ADC_MODE[1:0] = 11. All other register map bits to their default conditions,

Parameters Sym. Min. Typ. Max. Units

Conditions Internal Temperature Sensor Temperature Measurement Accuracy See Section 5.1.2, Internal Temperature Sensor Note 1:

2: 3: 4: 5:

This parameter is ensured by design and not 100% tested. This parameter is ensured by characterization and not 100% tested. REFIN- must be connected to ground for single-ended measurements. Full-Scale Range (FSR) = 2 x V REF /GAIN. This input impedance is due to the internal input sampling capacitor and frequency. This impedance is measured between the two input pins of the channel selected with the input multiplexer. 6: Applies to all analog gains. Offset and gain errors depend on analog gain settings. See Section 2.0, Typical

Performance Curves. 7: INL is the difference between the endpoints line and the measured code at the center of the quantization band. 8: DI DD is measured while no transfer is present on the SPI bus. 9: An external buffer is recommended for external use. 10: Start-up Time is the reaction time to the SPI command. 11: Settling Time depends on bypass caps on REFIN+/OUT pin.

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise specified, all parameters apply for T A = -40°C to +125°C, AV DD = 2.7V to 3.6V, DV DD = 1.8V to AV DD + 0.1V, D GND = A GND = 0V.

Parameters Sym. Min. Typ. Max. Units Specified Temperature Range T A -40 — +125 °C Operating Temperature Range T A -40 — +125 °C Storage Temperature Range T A -65 — +150 °C Thermal Resistance, 20-Lead TSSOP  JA — 44 — °C/W Thermal Resistance, 20-Lead UQFN  JA — 50 — °C/W Conditions Temperature Ranges Thermal Package Resistance Note 1: The internal Junction Temperature (T J ) must not exceed the absolute maximum specification of +150°C.

 2020-2021 Microchip Technology Inc. DS20006391C-page 11

MCP3561/2/4R

TABLE 1-1: SPI SERIAL INTERFACE TIMING SPECIFICATIONS FOR DV DD = 2.7V TO 3.6V Electrical Specifications: DV DD = 2.7V to 3.6V, T A = -40°C to +125°C, C LOAD = 30 pF. See Figure 1-1.

DS20006391C-page 12  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

TABLE 1-2: SPI SERIAL INTERFACE TIMING SPECIFICATIONS FOR DV DD = 1.8V TO 2.7V

Parameters Sym. Min. Typ. Max. Units Schmitt Trigger High-Level Input Voltage V IH 0.7 x DV DD — — V Schmitt Trigger Low-Level Input Voltage V IL — — 0.3 x DV DD V Hysteresis of Schmitt Trigger Inputs V HYS — 200 — mV Conditions Low-Level Output Voltage V OL — — 0.2 x DV DD V I OL = +1.5 mA High-Level Output Voltage V OH 0.8 x DV DD — — V I OH = -1.5 mA Input Leakage Current I LI_D — — 1 µA Pins configured as inputs

or high-impedance outputs  2020-2021 Microchip Technology Inc. DS20006391C-page 13

MCP3561/2/4R

t CSD CS t SC K t CLE t H I t CSS t L O t C SH t C LD

SPI mode 1,1 SPI mode 1,1 SCK

SPI mode 0,0 SPI mode 0,0

Device Latches SDI on SCK Rising Edge t SU SDI SDO t H D t DO t HO t C SSD O High-Z DS20006391C-page 14 t D IS High-Z 0 (for first two bits on SDO)

FIGURE 1-1:

Device Latches SDO on SCK Falling Edge High-Z 0 Serial Output Timing Diagram.

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz;

V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

-40 -60 -80 -100 -120 -140 -160 0 Output Amplitude (dBFS)

Output Amplitude (dBFS)

0 -20 -180 -40 -60 -80 -100 -120 -140 -160 -180 0 500 1000 1500

Frequency (Hz)

2000 0 2500 FIGURE 2-1: FFT Output Spectrum,

500 2000 2500 FIGURE 2-4: FFT Output Spectrum, f in = 1 kHz (Internal V REF ).

V IN = -0.5 dBFS at 1 kHz FFT 16384 samples -20 Occurrence (Counts) -40 -60 -80 -100 -120 -140 -160 V IN = 0V

Bin Size = 4 LSB 5000 4000 3000 2000 1000 -1100 -1084 -1068 -1052 -1036 -1020 -1004 -988 -972 -956 -940 -924 -908 -892 -876 -860 -844 0 -180

0 500 1000 1500 2000 2500

ADC Output Code (LSB) Frequency (Hz) FIGURE 2-2: FFT Output Spectrum, f in = 1 kHz (External V REF ).

FIGURE 2-5: (External V REF ).

FFT 16384 samples -20 -40 -60 -80 -100 -120 -140 -160 Output Noise Histogram V IN = 0V Noise = 9.4 ȝV RMS 64000 samples Bin size = 4 LSB 3500 Occurrence (Counts) 3000 2500 2000

1500 1000 500

0 -180

0 500 1000 1500

Frequency (Hz)

2000 FIGURE 2-3: FFT Output Spectrum,

 2020-2021 Microchip Technology Inc.

2500 -1244 -1228 -1212 -1196 -1180 -1164 -1148 -1132 -1116 -1100 -1084 -1068 -1052 -1036 -1020 -1004 -988 Output Amplitude (dBFS)

1000 1500 Frequency (Hz)

6000 0 Output Amplitude (dBFS)

FFT 16384 samples -20 ADC Output Code (LSB) FIGURE 2-6: (Internal V REF ).

Output Noise Histogram DS20006391C-page 15

MCP3561/2/4R

Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz; V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

120

100

FIGURE 2-7: FIGURE 2-10:

V REF .

Signal-to-Noise Ratio (dB)

2.5

2 1.5

1 131072 65536 32768 8192 80

60

40

20

FIGURE 2-11:

V REF .

Output Noise vs. Input

131072 65536 32768 16384 8192 512 256 Oversampling Ratio (OSR) Differential Input Voltage (% of V REF )

FIGURE 2-8: Voltage.

128 100 4096 50 2048 0 1024 -50 64 0 -100

SNR vs. OSR External

0

FIGURE 2-9:

DS20006391C-page 16 2 Analog Gain 4 8

Maximum INL vs. Gain.

16

Oversampling Ratio (OSR)

FIGURE 2-12:

131072 1 65536 0.5 -140

32768 2 -120 16384 4 -100 8192 6 -80 4096 8 -60 2048 10 -40 1024 AVDD = VREF = 3.6V, +125°C 512 AVDD = VREF = 3.6V, -40°C

-20 256 AVDD = VREF = 2.7V, +125°C 128 Total Harmonic Distortion (dBc) AVDD = VREF = 2.7V, -40°C 64 20 Maximum INL (ppm of 2*V REF )

100 0 0.5 0 0.25 120 32 RMS Noise (ppm of 2*V REF )

3.5 12

SINAD vs. OSR External

140 AVDD = VREF = 2.7V, -40°C AVDD = VREF = 2.7V, +125°C AVDD = VREF = 3.6V, -40°C AVDD = VREF = 3.6V, +125°C 4 14 16384 Oversampling Ratio (OSR)

5 16 4096 100

INL vs. Input Voltage.

4.5 18 0 2048 -50 0 50 Differential Input Voltage (% of V REF )

20 512 -6 -100 40 1024 -4

60 256 -2 80 128 0 64 Gain = 1x 32 4 2 140 AVDD = VREF = 2.7V, -40°C AVDD = VREF = 2.7V, +125°C AVDD = VREF = 3.6V, -40°C AVDD = VREF = 3.6V, +125°C 32 Integral Non-Linearity (ppm of 2*V REF )

6 Signal-to-Noise and Distortion Ratio (dB)

Note:

THD vs. OSR External V REF .

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz; V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

FIGURE 2-13:

V REF .

SFDR vs. OSR External

65536 16384 8192 4096 2048 512 1024 -140 Oversampling Ratio (OSR)

THD vs. OSR Internal V REF.

140 Spurious-Free Dynamic Range (dBc)

120 100

100  2020-2021 Microchip Technology Inc.

131072 65536 32768 16384 8192 4096 2048 1024 512

SFDR vs. OSR Internal

256 Oversampling Ratio (OSR)

FIGURE 2-17:

V REF.

SINAD vs OSR Internal

0

FIGURE 2-14:

V REF.

20 Oversampling Ratio (OSR)

131072 65536 32768 16384 8192 4096 2048 1024 512 256 128 64 32 0 40 128 20

60 40 80 64

60 32 80 Signal-to-Noise and Distortion Ratio (dB)

-120

FIGURE 2-16:

120 -100 131072 Oversampling Ratio (OSR)

-80 256 16384 8192 4096 2048 1024 512 256 64 128 0 -60 128 20 131072 40 65536 60 32768

-40 64 80

-20 32 100 32 Spurious-Free Dynamic Range (dBc) 120 Total Harmonic Distortion (dBc)

0 140 32768 Note:

External V REF .

DS20006391C-page 17

MCP3561/2/4R

Note: Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz;

V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

33Devices x 3 Lots Bin Size: 0.1 dB 20

15

10

5

0 20 18 16 14 12 10 8 6 4 2 0 33 Devices x 3 Lots Bin Size: 0.1 dB 98.8 98.9 99.0 99.1 99.2 99.3 99.4 99.5 99.6 99.7 99.8 99.9 100.0 100.1 100.2 100.3 100.4 100.5 105.8 105.9 106.0 106.1 106.2 106.3 106.4 106.5 106.6 106.7 106.8 106.9 107.0 107.1 107.2 107.3 107.4 107.5 107.6 Occurrence (Counts)

25 Occurrence (Counts)

30 Signal-to-Noise Ratio (dB) Signal-to-Noise-and-Distortion Ratio (dB)

FIGURE 2-19: SINAD Distribution Histogram External V REF . FIGURE 2-22: Internal V REF.

30 33 Devices x 3 Lots Bin Size: 0.5 dB 20

15

10

5

0 25 20 15 10 5 98.2 98.3 98.4 98.5 98.6 98.7 98.8 98.9 99.0 99.1 99.2 99.3 99.4 99.5 99.6 99.7 99.8 99.9 100.0 100.1 100.2 Signal-to-Noise-and-Distortion Ratio (dB) Total Harmonic Distortion (dBc)

FIGURE 2-20: External V REF . THD Distribution Histogram FIGURE 2-23: SINAD Distribution Histogram Internal V REF.

30 33 Devices x 3 Lots Bin Size: 1.0 dB 30

25

20

15

10

5 Occurrence (Counts)

35

33 Devices x 3 Lots Bin Size: 0.5 dB 25 20 15 10 5 Spurious-Free Dynamic Range (dBc)

FIGURE 2-21: SFDR Distribution Histogram External V REF .

DS20006391C-page 18 -113.5 -113.0 -112.5 -112.0 -111.5 -111.0 -110.5 -110.0 -109.5 -109.0 -108.5 -108.0 -107.5 -107.0 -106.5 -106.0 -105.5 0 0

110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 Occurrence (Counts)

33 Devices x 3 Lots Bin Size: 0.1 dB 0 -120.0 -119.5 -119.0 -118.5 -118.0 -117.5 -117.0 -116.5 -116.0 -115.5 -115.0 -114.5 -114.0 -113.5 -113.0 -112.5 -112.0 Occurrence (Counts)

25 Occurrence (Counts)

30

SNR Distribution Histogram

Total Harmonic Distortion (dBc)

FIGURE 2-24: Internal V REF. THD Distribution Histogram

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

50 45 40 35 30 25 20 15 10 5 0 33 Devices x 3 Lots Bin Size: 1.0 dB Total Harmonic Distortion (dBc)

Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz; V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

0

-20 -40 -60 -80 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 -100 105 Occurrence (Counts)

Note:

-120

-50 -25 0 Spurious-Free Dynamic Range (dBc)

FIGURE 2-25: SFDR Distribution Histogram Internal V REF. FIGURE 2-28: External V REF .

125

THD vs. Temperature,

Spurious-Free Dynamic Range (dBc)

120 100

100 80 60

40 20 0 -50 -25

FIGURE 2-26: External V REF .

0 25 50 Temperature (°C)

75 100 125

SINAD vs. Temperature,

120 80

60

40

20

0 -50 -25 0 25 50

Temperature (°C)

FIGURE 2-29: External V REF .

75 100 125

SFDR vs. Temperature,

120 100 Signal-to-Noise and Distortion Ratio (dB)

Signal-to-Noise and Distortion Ratio (dB)

100 140 120 Signal-to-Noise Ratio (dB)

25 50 75 Temperature (°C)

100 80 60

40 20 0 -50 -25

FIGURE 2-27: External V REF .

0 25 50 Temperature (°C)

75 100

SNR vs. Temperature,

 2020-2021 Microchip Technology Inc.

125 80 60

40 20 0 -50 -25

FIGURE 2-30: Internal V REF.

0 25 50 75

Temperature (°C)

100 125

SINAD vs. Temperature,

DS20006391C-page 19

MCP3561/2/4R

Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz; V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

140

100 120

100 80 60

40 20 0 -50 -25 0

FIGURE 2-31: Internal V REF.

25 50 75 Temperature (°C)

100 80

60 SINAD (dB)

0

-8 -6 -4 -2 0

Analog Input Signal Amplitude (dBFS)

2

FIGURE 2-34: Dynamic Performance vs. Input Signal Amplitude.

-80 -100 -120

-50 -25 0

FIGURE 2-32: Internal V REF.

25 50 75 Temperature (°C)

100 125

THD vs. Temperature,

85

80

75

70

0 120 105

100

80

40

20

0 -50 -25 0

FIGURE 2-33: Internal V REF.

DS20006391C-page 20 25 50 75 Temperature (°C)

100

SFDR vs. Temperature,

5 10 15 AMCLK Frequency (MHz)

FIGURE 2-35:

110 60

140 Spurious-Free Dynamic Range (dBc)

125

SNR vs. Temperature,

Signal-to-Noise

Ratio Total Harmonic Dynamic Performance 120 125 Signal-to-Noise and Distortion Ratio (dB)

Signal-to-Noise Ratio (dB)

Note:

20

SINAD vs. AMCLK

100

95

90

85

80

75

BOOST = 0.66x 70

0 5 10 15

AMCLK Frequency (MHz)

20

FIGURE 2-36: SINAD vs. AMCLK

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

Note: Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz;

V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

110 105

BOOST = 1x Signal-to-Noise and Distortion Ratio (dB)

100

95

AMCLK Frequency (MHz)

FIGURE 2-37:

SINAD vs. AMCLK

95

90

85

80

75

70

0 5 10 15

MCLK Frequency (MHz)

FIGURE 2-40: SINAD vs. AMCLK (BOOST = 0.66X, Internal V REF ).

BOOST = 1x Signal-to-Noise Signal-to-Noise

Ratio 20 100 20 Distortion 105

80 75 70

0 5 10 15

MCLK Frequency (MHz)

FIGURE 2-39: SINAD vs. AMCLK (BOOST = 0.5X, Internal V REF ).

 2020-2021 Microchip Technology Inc.

20

80 75

70

0 5 10 15

MCLK Frequency (MHz)

20

FIGURE 2-42: SINAD vs. AMCLK (BOOST = 2X, Internal V REF ).

DS20006391C-page 21

MCP3561/2/4R

Note: Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz;

V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

Input-Referred Signal-to-Noise

Ratio

85 -400 BOOST = 1x, AVDD = 3.3V 80 BOOST = 1x, AVDD = 3.6V

-600 -800 -1000 70

0 5 10 15

AMCLK Frequency (MHz)

FIGURE 2-43: AV DD .

-50 20 1,200

FIGURE 2-44: Frequency.

100,000 Analog Input Signal Frequency (Hz) 10,000 1,000 100 10 1 Offset Error (nV)

80 0 25 50 75 Temperature (°C)

800 0 125 T A = 25°C, AZ_MUX = 1 600 400 200 0 2.7 3 3.3

AV DD Supply Voltage (V)

FIGURE 2-47:

SINAD vs. Input Signal

100

Offset Error vs. Temperature

1,000 3.6

Offset Error vs. AV DD

1,000

Voltage Signal-to-Noise and Distortion Ratio (dB)

100 -25

FIGURE 2-46:

SINAD vs. AMCLK vs.

120 Error (µV)

-200 BOOST = 1x, AVDD = 2.7V

800

AV DD Supply Voltage (V)

FIGURE 2-45:

DS20006391C-page 22

Offset Error vs. AV DD FIGURE 2-48:

0 25 50 Temperature (°C)

75 100 125

Offset Error vs. Temperature

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

Note: Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz;

V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

2

AV DD Supply Voltage (V)

FIGURE 2-49:

Differential Input Impedance (k:)

10K 1K 100 10 1

Gain Error vs. AV DD .

1 5

MCLK Frequency (MHz)

FIGURE 2-52: vs. MCLK.

2 25

Differential Input Impedance

10M Error (%)

1.6 1.4 1.2

1

Output (LSB)

1.8 1M 100K

-50 -25 0 25 50

Temperature (°C)

FIGURE 2-50:

5 Differential Input Impedance (:)

Gain Error vs. Temperature. FIGURE 2-53: ADC Output Code vs. Differential Input Impedance, Burnout Current Sources Enabled.

61 Devices 4 3 T ACC (°C)

2 1 0 -1 -2 -3 -4 -5

-50 -25 0 25 50

Temperature (°C)

75 100 125

FIGURE 2-51: Temperature Sensor Accuracy vs. Temperature (First Order Best Fit).

 2020-2021 Microchip Technology Inc. DS20006391C-page 23

MCP3561/2/4R

Note: Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz;

V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

2

0.2 DI

0 0 0

0 5 10 15

MCLK Frequency (MHz)

FIGURE 2-54:

5 20

DI DD and AI DD vs. MCLK.

10 15 MCLK Frequency (MHz)

20

DI DD and AI DD vs. FIGURE 2-57: Temperature.

2.5

2.41186

Internal V REF Output

DI DD 2.41183

2.41182

2.41181

2.4118

2.41179 Output Noise = 14.3 ȝV

RMS 100 Samples (100 ms per sample) 2.41178 0 1.8 2.1 2.4 2.7 3

AV DD /DV DD (V)

3.3 0 3.6

DI DD and AI DD vs. DV DD FIGURE 2-55: and AV DD .

2 4

Time (s)

6 8 10

FIGURE 2-58: V REF Output vs Time

2.5 2.415

Internal V REF output (V)

2 2.41184

0

0 5 10 15

MCLK Frequency (MHz)

FIGURE 2-56:

V REF ).

DS20006391C-page 24

AI DD vs MCLK (internal

20 2.405

2.4

2.395

2.39

2.385

2.38

-50 -25 0 25 50

Temperature (°C)

75 100 125

FIGURE 2-59: V REF Output Voltage vs

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

Internal V REF Output (V)

Note: Unless otherwise indicated, AV DD = 3.3V, DV DD = 3.3V; T A = +25°C, MCLK = 4.9152 MHz;

V IN = -0.5 dBFS at 50 Hz, V REF = AV DD ; ADC_MODE = 11. All other registers are set to default value. Histogram ticks are centered at their bin center.

2.3988 2.3987 2.3986 2.3985 2.3984 2.3983 2.3982 2.3981 2.398 2.3979 2.3978

2.7 2.8

FIGURE 2-60: Voltage vs. AV DD.

2.9 3 3.1 3.2

AV DD (V)

3.3 3.4 3.5 3.6

Internal V REF Output

 2020-2021 Microchip Technology Inc. DS20006391C-page 25

MCP3561/2/4R

2.1 Noise Specifications

Table 2-1 and Table 2-2 summarize the noise performance of the MCP3561/2/4R devices. The noise performance is an analog gain function of the ADC (digital gain does not change the noise performance significantly) and the OSR, chosen through the user interface. With a higher gain, the input referred noise is reduced. With a higher OSR setting, the noise is also reduced as the oversampling diminishes both thermal noise and quantization noise induced by the Delta-Sigma modulator loop. The noise value generally increases when temperature is higher as thermal noise is dominant for all OSR larger than 32. For high OSR settings (> 512), the thermal noise is largely dominant and increases proportionally to the square root of the absolute temperature. The performance in the following tables has been measured with the device placed in Continuous Conversion mode, with the differential input voltage equal to V IN = 0V, default conditions for the register map and MCLK = 4.9152 MHz. The noise performance is also a function of the measurement duration. For short duration measurements (low number of consecutive samples), the peak-to-peak noise is usually reduced because the crest factor (ratio between the RMS noise and peak-to-peak noise) is reduced. This is only a consequence of the noise distribution being Gaussian by nature (see Figure 2-5 for noise histogram example and fitting with an ideal Gaussian distribution). The noise specifications have been measured with a sample size of 16384 samples for low OSR values and have been capped to approximately 80 seconds for the 16384 samples leading to a larger duration. The noise specifications are expressed in two different values, which lead to the same quantity. It may be more practical to choose one of these representations depending on the desired application. In Table 2-1, the RMS (Root Mean Square) noise is the variance of the ADC output code, expressed in µV RMS and input referred with Equation 5-5. The peak-to-peak noise values are in parentheses. The peak-to-peak noise is the difference between the maximum and minimum code observed during the complete time of the measurement (see Equation 5-5). In Table 2-2, the noise is expressed in Effective Resolution (ER). The Effective Resolution is a ratio of the full-scale range of the ADC (that depends on V REF and gain) and the noise performance of the device. The Effective Resolution can be determined from the RMS or peak-to-peak noise with the following equations.

DS20006391C-page 26

EQUATION 2-1:

2  V REF

EQUATION 2-2:

2  V REF

Due to the nature of the noise, the performance detailed in the noise tables can vary significantly from one measurement to another. They present an averaging of the performance over a large distribution of parts over multiple lots. They give the typical expectation of the noise performance, but performance can be better or worse if a limited number of measurements is performed. For large gain and OSR combinations, if the noise performance is comparable to the quantization step (1 LSb), the performance is limited to 0.5 LSb for the RMS noise and 1 LSb for the peak-to-peak noise (same limits for Effective Resolution values). These figures correspond to the resolution limit of the device as peak-to-peak noise cannot be better than 1 LSb. Similarly, if the intrinsic RMS noise of the device is much smaller than 0.5 LSb, it may lead to histogram with either one or two bins, depending on the relative position of the input voltage versus the possible quantized outputs of the ADC. If the position is exactly in between two quantization steps, the histogram of output noise will have two bins with exactly 50% occurrence on each. This case gives an RMS noise of a 0.5 LSb value, which is therefore, used as a cap of the performance for the sake of clarity and a better representation on the noise tables. The noise specifications are improved by a ratio of approximately √2 (or 0.5-bit Effective Resolution) when the AZ_MUX setting is enabled. However, the output data rate is significantly reduced (see Figure 5-5 and Table 5-6). The digital gain added for GAIN = 32x and 64x settings is not significant for the noise performance, and therefore, the noise values can be extracted from the GAIN = 16x columns. Effective Resolution performance is degraded by 1 bit for GAIN = 32x and 2 bits for GAIN = 64x compared to GAIN = 16x performance.

Note: All Output Noise performance-related

tables and figures are with reference to the input, i.e. Input Referred.

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

TABLE 2-1: OUTPUT NOISE VS. GAIN VS. OSR (AV DD = DV DD = V REF = 3.3V, T A = 25°C)

RMS (Peak-to-Peak) Noise (µV) TOTAL OSR GAIN = 0.33 GAIN = 1 GAIN = 2 GAIN = 4 GAIN = 8 GAIN = 16

32 365.02 (2932.55) 120.80 (981.90) 60.79 (489.77) 30.70 (243.71) 15.69 (125.98) 8.23 (65.94) 64 68.06 (566.05) 23.56 (189.40) 12.54 (101.97) 7.06 (55.09) 4.25 (34.15) 2.77 (22.05) 128 35.21 (313.00) 12.68 (108.08) 7.03 (57.36) 4.19 (33.51) 2.68 (21.43) 1.83 (14.47) 256 24.83 (212.31) 8.94 (73.35) 4.94 (40.62) 2.94 (23.38) 1.88 (15.17) 1.29 (10.11) 512 17.99 (150.04) 6.43 (52.02) 3.53 (28.51) 2.09 (17.02) 1.34 (10.58) 0.92 (7.32) 1024 15.12 (123.74) 5.40 (43.95) 2.97 (23.54) 1.75 (14.05) 1.12 (8.82) 0.77 (6.20) 2048 11.47 (91.51) 4.08 (32.01) 2.26 (18.04) 1.34 (10.69) 0.86 (6.79) 0.59 (4.57) 4096 8.32 (64.97) 2.98 (23.59) 1.66 (13.10) 0.98 (7.85) 0.63 (4.97) 0.43 (3.45) 8192 5.88 (44.39) 2.11 (15.61) 1.18 (8.99) 0.70 (5.39) 0.45 (3.37) 0.31 (2.30) 16384 4.16 (30.56) 1.50 (10.80) 0.84 (6.12) 0.50 (3.65) 0.32 (2.28) 0.22 (1.60) 20480 3.71 (26.82) 1.34 (9.65) 0.75 (5.29) 0.44 (3.27) 0.28 (2.06) 0.19 (1.41) 24576 3.40 (24.24) 1.23 (8.88) 0.69 (4.88) 0.41 (2.94) 0.26 (1.92) 0.18 (1.29) 40960 2.70 (18.79) 0.98 (6.53) 0.55 (3.83) 0.32 (2.22) 0.20 (1.41) 0.14 (0.96) 49152 2.52 (17.44) 0.90 (6.08) 0.50 (3.47) 0.30 (2.07) 0.19 (1.25) 0.13 (0.87) 81920 2.05 (13.19) 0.74 (4.64) 0.40 (2.56) 0.24 (1.52) 0.15 (0.96) 0.10 (0.63) 98304 1.94 (12.20) 0.68 (4.37) 0.38 (2.39) 0.22 (1.37) 0.14 (0.89) 0.09 (0.59)

TABLE 2-2: EFFECTIVE RESOLUTION VS. GAIN VS. OSR (AV DD = DV DD = V REF = 3.3V, T A = 25°C)

 2020-2021 Microchip Technology Inc. DS20006391C-page 27

MCP3561/2/4R

TABLE 2-3: OUTPUT NOISE VS. GAIN VS. OSR (AV DD = DV DD = 3.3V, V REF = 2.4V INTERNAL,

RMS (Peak-to-Peak) Noise (µV) TOTAL OSR GAIN = 0.33 GAIN = 1 GAIN = 2 GAIN = 4 GAIN = 8 GAIN = 16

32 275.92 (2169.18) 91.57 (746.73) 46.26 (373.37) 23.50 (187.97) 12.16 (97.85) 6.52 (55.04) 64 65.13 (536.40) 22.54 (184.73) 12.04 (98.83) 6.76 (55.04) 4.05 (34.12) 2.64 (21.65) 128 38.21 (309.86) 13.47 (109.15) 7.35 (58.99) 4.27 (34.47) 2.66 (21.26) 1.79 (14.39) 256 26.60 (217.70) 9.38 (75.24) 5.14 (42.71) 2.99 (23.78) 1.88 (15.13) 1.27 (10.14) 512 18.94 (149.55) 6.65 (54.08) 3.65 (29.73) 2.13 (17.38) 1.33 (10.46) 0.89 (7.33) 1024 15.90 (126.06) 5.58 (44.03) 3.05 (24.21) 1.78 (14.33) 1.11 (8.98) 0.75 (6.06) 2048 12.06 (93.72) 4.25 (35.36) 2.33 (19.23) 1.35 (11.06) 0.85 (6.87) 0.57 (4.54) 4096 8.75 (68.40) 3.09 (24.49) 1.70 (13.25) 0.98 (7.98) 0.62 (4.85) 0.42 (3.33) 8192 6.31 (47.08) 2.22 (16.88) 1.22 (9.54) 0.71 (5.39) 0.44 (3.51) 0.30 (2.28) 16384 4.55 (35.03) 1.61 (11.70) 0.88 (6.41) 0.51 (3.77) 0.32 (2.32) 0.21 (1.53) 20480 4.11 (29.82) 1.45 (10.76) 0.79 (5.85) 0.46 (3.23) 0.28 (2.06) 0.19 (1.39) 24576 3.79 (27.14) 1.34 (9.87) 0.73 (5.28) 0.42 (3.03) 0.26 (1.85) 0.17 (1.27) 40960 3.02 (21.15) 1.06 (7.24) 0.57 (4.06) 0.33 (2.27) 0.20 (1.43) 0.14 (0.96) 49152 2.79 (19.51) 0.98 (6.58) 0.53 (3.61) 0.30 (2.15) 0.19 (1.32) 0.12 (0.87) 81920 2.27 (14.91) 0.79 (5.01) 0.43 (2.89) 0.24 (1.62) 0.15 (0.99) 0.10 (0.63) 98304 2.09 (14.04) 0.72 (4.49) 0.39 (2.52) 0.22 (1.45) 0.14 (0.93) 0.09 (0.59)

TABLE 2-4: EFFECTIVE RESOLUTION VS. GAIN VS. OSR (AV DD = DV DD = 3.3V, V REF = 2.4V

Effective Resolution RMS (Peak-to-Peak) (bits) TOTAL OSR GAIN = 0.33 GAIN = 1 GAIN = 2 GAIN = 4 GAIN = 8 GAIN = 16

32 15.2 (12.7) 15.2 (12.7) 15.2 (12.6) 15.1 (12.6) 15.1 (12.6) 15.00 (12.5) 64 17.3 (14.8) 17.2 (14.7) 17.1 (14.6) 16.9 (14.5) 16.7 (14.2) 16.3 (13.8) 128 18.0 (15.5) 17.9 (15.4) 17.8 (15.3) 17.6 (15.1) 17.3 (14.8) 16.9 (14.4) 256 18.6 (16.1) 18.5 (16.0) 18.3 (15.8) 18.1 (15.6) 17.8 (15.3) 17.4 (14.9) 512 19.1 (16.6) 19.0 (16.4) 18.8 (16.3) 18.6 (16.1) 18.3 (15.8) 17.9 (15.4) 1024 19.3 (16.8) 19.2 (16.7) 19.1 (16.6) 18.9 (16.4) 18.5 (16.1) 18.1 (15.6) 2048 19.7 (17.2) 19.6 (17.1) 19.5 (17.0) 19.3 (16.8) 18.9 (16.4) 18.5 (16.0) 4096 20.2 (17.7) 20.1 (17.6) 19.9 (17.4) 19.7 (17.2) 19.4 (16.9) 19.0 (16.5) 8192 20.6 (18.2) 20.5 (18.1) 20.4 (18.0) 20.2 (17.8) 19.9 (17.4) 19.4 (17.0) 16384 21.1 (18.7) 21.0 (18.7) 20.9 (18.5) 20.7 (18.3) 20.4 (18.0) 19.9 (17.6) 20480 21.3 (18.9) 21.2 (18.8) 21.0 (18.7) 20.8 (18.5) 20.5 (18.2) 20.1 (17.7) 24576 21.4 (19.0) 21.3 (18.9) 21.2 (18.8) 21.0 (18.6) 20.6 (18.3) 20.2 (17.9) 40960 21.7 (19.4) 21.6 (19.3) 21.5 (19.2) 21.3 (19.0) 21.0 (18.7) 20.6 (18.3) 49152 21.8 (19.5) 21.7 (19.5) 21.6 (19.3) 21.4 (19.1) 21.1 (18.8) 20.7 (18.4) 81920 22.1 (19.9) 22.0 (19.8) 21.9 (19.8) 21.8 (19.5) 21.5 (19.3) 21.0 (18.9) 98304 22.2 (20.0) 22.2(20.0) 22.0 (19.9) 21.9 (19.7) 21.6 (19.4) 21.2 (19.0)

Note: To calculate noise RMS level and Effective Resolution (Bits) for a given GAIN and data rate, refer to the

OSR setting and associated data rate relationship shown in Table 5-6.

DS20006391C-page 28  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

3.0 PIN DESCRIPTIONS

TABLE 3-1: PIN FUNCTION TABLE

MCP3561 MCP3562 MCP3564 MCP3561 MCP3562 MCP3564

R R R Symbol Description REFIN- Inverting Reference Input Pin 20-Lead UQFN 20-Lead TSSOP

1 3 2 4 3 5 CH0 4 6 CH1 Analog Input 1 Pin — 5 5 — — 6 6 — — 7 — — — — 5, 6, 7, 8,

9, 10 REFIN+/OUT Non-inverting Reference Input Pin or

Internal Voltage Reference output Analog Input 0 Pin 7 7 CH2 Analog Input 2 Pin — 8 8 CH3 Analog Input 3 Pin — — 9 CH4 Analog Input 4 Pin 8 — — 10 CH5 Analog Input 5 Pin — 9 — — 11 CH6 Analog Input 6 Pin — 10 — — 12 CH7 Analog Input 7 Pin 11 13 CS Serial Interface Chip Select Digital Input

Pin 12 14 SCK Serial Interface Digital Clock Input Pin 13 15 SDI Serial Interface Digital Data Input Pin 14 16 SDO Serial Interface Digital Data Output Pin 15 17 IRQ/MDAT Interrupt Output Pin or Modulator Output

Pin 16 18 MCLK Master Clock Input or Analog Master Clock

Output Pin 17 19 D GND Digital Ground Pin 18 20 DV DD Digital Supply Voltage Pin 19 1 AV DD Analog Supply Voltage Pin 20 2 A GND Analog Ground Pin 7, 8, 9, 10 — 7, 8, 9,

10, 11, 12 9, 10, 11,

12 — NC Not Connected — — — EP Exposed Thermal Pad, internally connected

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MCP3561/2/4R

3.1 Differential Reference Voltage Inputs: REFIN+/OUT, REFIN-

The REFIN+/OUT pin is the non-inverting differential reference input (V REF +) when VREF_SEL = 0. When VREF_SEL = 1, it is the internal voltage reference output voltage as well as the ADC voltage non-inverting reference pin. The REFIN- pin is the inverting differential reference input (V REF -). For single-ended reference applications, the REFINpin should be directly connected to A GND . The differential reference voltage pins must respect this condition at all times: 0.6V ≤ V REF ≤ AV DD . The differential reference voltage input is given by the following equation:

EQUATION 3-1:

For optimal ADC accuracy, appropriate bypass capacitors should be placed between REFIN+/OUT and A GND at all times. Using a 0.1 µF and a 10 µF ceramic capacitor can help to decouple the reference voltage around the sampling frequency (which would lead to aliasing noise in the base band). These bypass capacitors are not mandatory for correct ADC operation, but removing these capacitors may degrade the accuracy of the ADC.

3.2 Analog Inputs (CHn): Differential or Single-Ended

The CHn pins are the analog input signal pins for the ADC. Two analog multiplexers are used to connect the CHn pins to the V IN +/V IN - analog inputs of the ADC. Each multiplexer independently selects one input to be connected to an ADC input (V IN + or V IN -). Each CHn pin can either be connected to the V IN + or V IN - inputs of the ADC. This multiplexer selection is controlled by either the MUX register in MUX mode or the SCAN register in SCAN mode. See Figure 5-1 for more details on the multiplexer structure. When the input is selected by the multiplexer, the differential (V IN ) and Common-Mode Voltage (V INCOM ) at the ADC inputs are defined by:

EQUATION 3-2:

DS20006391C-page 30 The input signal level is multiplied by the internal programmable analog gain at the front end of the Delta-Sigma modulator. For single-ended input measurements, the user can select V IN - to be internally connected to A GND . The differential input voltage should not exceed an absolute of ±V REF /GAIN for accurate measurement. If the input is out of range, the converter output code will be saturated or overloaded depending on how the output data format (DATA_FORMAT[1:0]) is selected. See Section 5.6 “ADC Output Data Format” for further information on the ADC output coding. The absolute voltage on each of the analog signal input pins can range from A GND – 0.1V to V DD + 0.1V. Any voltage above or below this range will cause leakage currents through the Electrostatic Discharge (ESD) diodes at the input pins. This ESD current can cause unexpected performance of the device. The Common-mode of the analog inputs should be chosen such that both the differential analog input range and the absolute voltage range on each pin are within the specified operating range defined in the Electrical Characteristics table.

3.3 SPI Serial Interface Communication Pins

The SPI interface is compatible with both SPI 0,0 and 1,1 modes.

3.3.1 CHIP SELECT (CS) This is the SPI Chip Select pin that enables/disables the SPI serial communication. The CS falling edge initiates the serial communication and the rising edge terminates the communication. No communication can take place when this pin is in a Logic High state. This input is Schmitt Triggered.

3.3.2 SERIAL DATA CLOCK (SCK) This is the serial clock input pin for SPI communication. This input has a Schmitt Trigger structure. The maximum SPI clock speed is 20 MHz. Data are clocked into the device on the rising edge of SCK. Data are clocked out of the device on the falling edge of SCK. The device interface is compatible with both SPI 0,0 and 1,1 modes. SPI modes can be changed when CS is in Logic High status. SCK and MCLK are two different and asynchronous clocks; SCK is only required during a communication, while MCLK is continuously required when the part converts analog inputs.

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MCP3561/2/4R

3.3.3 SERIAL DATA OUTPUT PIN (SDO) This pin is used for the SPI Data Output (SDO). The SDO data are clocked out on the falling edge of SCK. This pin stays high-impedance under the following conditions: • When CS pin is logic high. • During the entire SPI write or Fast command

communication period after the SPI command byte has been transmitted. • After the two device address bits in the command

are transmitted, if the device address in the command does not match the internal chip device address.

3.3.4 SERIAL DATA INPUT PIN (SDI) This is the SPI Data Input (SDI) pin and it uses a Schmitt Trigger structure. When CS is logic low, this pin is used to send a command byte just after the CS falling edge, which can be followed by data words of various lengths. Data are clocked into the device on the rising edge of SCK. Toggling SDI while reading a register has no effect.

3.4 IRQ/MDAT

This is the digital output pin. This pin can be configured for Interrupt (IRQ) or Modulator Data (MDAT) output using the IRQ_MODE[1] bit setting. When IRQ_MODE[1] = 0 (default), this pin can output all four possible interrupts (see Section 6.8 “Interrupts Description”). The Inactive state of the pin is selectable through the IRQ_MODE[0] bit setting (high-Z or logic high). When IRQ_MODE[1] = 1, this pin outputs the modulator output synchronously with AMCLK (that can be selected as an output on the MCLK pin). In this mode, the POR and CRC interrupts can still be generated, as they are high-level interrupts, and will lock the IRQ/MDAT pin to logic low until they are cleared. When the IRQ pin is in High-Z mode, an external pull-up resistor must be connected between DV DD and the IRQ pin. The device needs to be able to detect a Logic High state when no interrupt occurs in order to function properly (the pad has an input Schmitt Trigger to detect the state of the IRQ pin just like the user sees it). The pull-up value can be equal to 100-200 k for a weak pull-up using the typical clock frequency. The pull-up resistor value must be selected in relation with the load capacitance of the IRQ output, the MCLK frequency and the DV DD supply voltage, so that all interrupts can be correctly detected by the SPI host device.

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3.5 MCLK

This pin is either the MCLK digital input pin for the ADC or the AMCLK digital output pin, depending on the CLK_SEL[1:0] bit settings in the CONFIG0 register. The typical clock frequency specified is 4.9152 MHz. To optimize the ADC for accuracy and ensure proper operation, AMCLK should be limited to a certain range depending on the BOOST and GAIN settings. The higher GAIN settings require higher BOOST settings to maintain high bandwidth, as the input sampling capacitors have a larger value. Figure 2-35, Figure 2-36, Figure 2-37, Figure 2-38 and Figure 2-43 represent the typical accuracy (SINAD) expected with the different combinations of BOOST and GAIN settings, and can be used to determine an optimal set for the application depending on the sampling speed (AMCLK) chosen. MCLK can take larger values as long as the prescaler settings (PRE[1:0]) limit AMCLK = MCLK/PRESCALE in the range shown in Section 2.0 “Typical Performance Curves”.

3.6 Digital Ground (D GND )

D GND is the ground connection to internal digital circuitry. To ensure accuracy and noise cancellation, D GND must be connected to the same ground as A GND , preferably with a star connection. If a digital ground plane is available, it is recommended that this pin be tied to this plane of the Printed Circuit Board (PCB). This plane should also reference all other digital circuitry in the system. D GND is not internally connected to A GND and must be connected externally.

3.7 Digital Power Supply (DV DD )

DV DD is the power supply pin for the digital circuitry within the device. The voltage on this pin must be maintained in the range specified by the Electrical Characteristics table. For optimal performance, it is recommended to connect appropriate bypass capacitors (typically a 10 µF ceramic in parallel with a 0.1 µF ceramic). DV DD is monitored by the DV DD POR monitoring circuit for the digital section.

3.8 Analog Power Supply (AV DD )

AV DD is the power supply pin for the analog circuitry within the device. The voltage on this pin must be maintained in the range specified by the Electrical Characteristics table. For optimal performance, it is recommended to connect appropriate bypass capacitors (typically a 10 µF ceramic in parallel with a 0.1 µF ceramic). AV DD is monitored by the AV DD POR monitoring circuit for the analog section.

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3.9 Analog Ground (A GND )

A GND is the ground connection to internal analog circuitry. To ensure accuracy and noise cancellation, this pin must be connected to the same ground as D GND , preferably with a star connection. If an analog ground plane is available, it is recommended that this pin be tied to this plane of the PCB. This plane should also reference all other analog circuitry in the system. A GND is the biasing voltage for the substrate of the die and is not internally connected to D GND .

DS20006391C-page 32

3.10 Exposed Pad (EP)

This pad is only available on the UQFN package. The pad is internally connected to A GND . It must be connected to the analog ground of the PCB for optimal accuracy and thermal performance. This pad can also be left floating if necessary.

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MCP3561/2/4R

4.0 TERMINOLOGY AND FORMULAS

This section defines the terms and formulas used throughout this document. The following terms are defined: • MCLK – Master Clock • AMCLK – Analog Master Clock • DMCLK – Digital Master Clock • DRCLK – Data Rate Clock • OSR – Oversampling Ratio • Offset Error • Gain Error • Integral Nonlinearity Error (INL) • Signal-to-Noise Ratio (SNR) • Signal-to-Noise and Distortion Ratio (SINAD) • Total Harmonic Distortion (THD) • Spurious-Free Dynamic Range (SFDR) • MCP3561/2/4R Delta-Sigma Architecture • Power Supply Rejection Ratio (PSRR) • Common-Mode Rejection Ratio (CMRR) • Digital Pins Output Current Consumption PRE[1:0] CLK_SEL[1] OSR[3:0]

MCLK Pad 0

OU T MCLK 1/ PRESCALE AMCLK 1/4 DMCLK 1/OSR

DRCLK 1 Internal Oscillator Multiplexer Clock Divider Clock Divider Clock Divider

AMCLKOUT

FIGURE 4-1: 4.1

System Clock Details.

MCLK – Master Clock EQUATION 4-2:

This is the master clock frequency at the MCLK input pin when an external clock source is selected or internal clock frequency when the internal clock is selected.

4.2 AMCLK – Analog Master Clock

This is the clock frequency that is present on the analog portion of the device after prescaling has occurred via the PRE[1:0] bits.

EQUATION 4-1: ANALOG MASTER CLOCK

MCLK AMCLK = ----------------------

Prescale

4.3 DMCLK – Digital Master Clock

This is the clock frequency that is present on the digital portion of the device. This is also the sampling frequency or the rate at which the modulator outputs are refreshed. Each period of this clock corresponds to one sample and one modulator output. See Equation 4-2.

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DIGITAL MASTER CLOCK

MCLK DMCLK = AMCLK -------------------- = --------------------------------

4 4  Prescale

4.4 DRCLK – Data Rate Clock

This is the output data rate in Continuous mode or the rate at which the ADC outputs new data. Any new data are signaled by a data ready pulse on the IRQ pin. This data rate depends on the OSR and the prescaler as shown in Equation 4-3.

EQUATION 4-3: DATA RATE

AMCLK = -------------------------------------------------- MCLK DRCLK = DMCLK --------------------- = --------------------- -

OSR 4  OSR 4  OSR  Prescale Since this is the output data rate, and since the decimation filter is a sinc (or notch) filter, there is a notch in the filter transfer function at each integer multiple of this rate.

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MCP3561/2/4R

4.5 OSR – Oversampling Ratio

The ratio of the sampling frequency to the output data rate. OSR = DMCLK/DRCLK in Continuous mode. See Table 5-6 for the OSR setting effect on sinc filter parameters.

4.6 Offset Error EQUATION 4-5:

SignalPower SINAD  dB  = 10 log 

 --------------------------------------------------------------------   Noise + HarmonicsPower The calculated combination of SNR and THD per the following formula also yields SINAD:

EQUATION 4-6:

This is the error induced by the ADC when the inputs are shorted together (V IN = 0V). This error varies based on gain settings, OSR settings and from chip to chip. It can easily be calibrated out by an MCU with a subtraction.

4.7 Gain Error

This is the error induced by the ADC on the slope of the transfer function. It is the deviation expressed in percentage compared to the ideal transfer function defined by Equation 5-5. The specification incorporates ADC gain error contributions, but not the V REF contribution. This error varies with GAIN and OSR settings. The gain error of this device has a low-temperature coefficient.

4.8 Integral Nonlinearity Error (INL)

Integral nonlinearity error is the maximum deviation of an ADC transition point from the corresponding point of an ideal transfer function, with the offset and gain errors removed, or with the end points equal to zero. It is the maximum remaining static error after offset and gain errors calibration for a DC input signal.

4.9 EQUATION 4-4: SIGNAL-TO-NOISE RATIO

SignalPower SNR  dB  = 10 log  --------------------------------- 

 NoisePower 

4.10 Signal-to-Noise and Distortion Ratio (SINAD) SINAD, THD AND SNR RELATIONSHIP

SINAD  dB  = 10 log 10

4.11

 SNR -----------   10  + 10  THD ------------  

10 

Total Harmonic Distortion (THD)

The THD is the ratio of the output harmonics power to the fundamental signal power for a sine wave input and is defined by the following equation.

EQUATION 4-7:

HarmonicsPower THD  dB  = 10 log  ---------------------------------------------------- 

 FundamentalPower  The THD is usually measured only with respect to the first ten harmonics. THD is sometimes expressed in percentage (%). This formula converts the THD from dB to percentage:

EQUATION 4-8: THD  %  = 100  10 Signal-to-Noise Ratio (SNR)

For this device family, the Signal-to-Noise Ratio is a ratio of the output fundamental signal power to the noise power (not including the harmonics of the signal) when the input is a sine wave at a predetermined frequency. It is measured in dB. Usually, only the maximum Signal-to-Noise Ratio is specified. The SNR figure depends mainly on the OSR and gain settings of the device, as well as the temperature (due to thermal noise being dominant for high OSR).

SINAD EQUATION 4.12

THD  dB  ------------------------

20

Spurious-Free Dynamic Range (SFDR)

SFDR is the ratio between the output power of the fundamental and the highest spur in the frequency spectrum. The spur frequency is not necessarily a harmonic of the fundamental, even though that is usually the case. This figure represents the dynamic range of the ADC when a full-scale signal is used at the input. This specification depends mainly on the OSR and gain settings.

EQUATION 4-9:

FundamentalPower SFDR  dB  = 10 log 

 ----------------------------------------------------   HighestSpurPower Signal-to-Noise and Distortion Ratio is similar to Signal-to-Noise Ratio, with the exception that you must include the harmonics power in the noise power calculation. The SINAD specification depends mainly on the OSR and gain settings.

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MCP3561/2/4R

4.13 MCP3561/2/4R Delta-Sigma Architecture

A Delta-Sigma ADC is an oversampling converter that incorporates a built-in modulator which digitizes the quantity of charge integrated by the modulator loop. The quantizer is the block that performs the Analog-to-Digital conversion. The quantizer is typically 1-bit or a simple comparator which helps to maintain the linearity performance of the ADC (the DAC structure is in this case, inherently linear). Multibit quantizers help to lower the quantization error (the error fed back in the loop can be very large with 1-bit quantizers) without changing the order of the modulator or the OSR, which leads to better SNR figures. However, typically the linearity of such architectures is more difficult to achieve since the DAC is no more simple to realize and its linearity limits the THD of such ADC. The modulator 5-level quantizer is a Flash ADC composed of four comparators arranged with equally spaced thresholds and a thermometer coding. The device also includes proprietary 5-level DAC architecture that is inherently linear for improved THD figures.

4.14 Power Supply Rejection Ratio (PSRR)

This is the ratio between a change in the power supply voltage and the change in the ADC output codes. It measures the influence of the power supply voltage on the ADC outputs. PSRR is defined in Equation 4-10. The PSRR specification can be DC (the power supply is taking multiple DC values) or AC (the power supply is a sine wave at a certain frequency with a certain Common-mode). In AC, the amplitude of the sine wave represents the change in the power supply.

EQUATION 4-10:

 V OUT PSRR  dB  = 20 log 

 ------------------    AV DD

Where V OUT is the equivalent input voltage that the output code translates to with the ADC transfer function.

4.15 Common-Mode Rejection Ratio (CMRR)

This is the ratio between a change in the Common-mode input voltage and the change in the ADC output codes. It measures the influence of the Common-mode input voltage on the ADC outputs. The CMRR specification can be DC (the Common-mode input voltage takes multiple DC values) or AC (the Common-mode input voltage is a sine wave at a certain frequency with a certain Common-mode). In AC, the amplitude of the sine wave represents the change in the Common-mode input voltage. CMRR is defined in Equation 4-11.

EQUATION 4-11:

 V OUT CMRR  dB  = 20 log 

 -----------------------    V INCOM Where V INCOM = (V IN + + V IN -)/2 is the Common-mode input voltage and V OUT is the equivalent input voltage that the output code translates to with the ADC transfer function.

4.16 Digital Pins Output Current Consumption

The digital current consumption shown in the Electrical Characteristics table does not take into account the current consumption generated by the digital output pins and the charge of their capacitive loading. The specification is intended with all output pins left floating and no communication. In order to estimate the additional current consumption due to the output pins, see Equation 4-12. This equation specifies the amount of additional current due to each pin when its output is connected to a C load capacitance, with respect to D GND , and submitted to an output signal toggling at an f out frequency. If a typical 10 MHz SPI frequency is used, with a 30 pF load and DV DD = 3.3V, the SDO output generates an additional maximum current consumption of 500 µA (the maximum toggling frequency of SDO is 5 MHz, since f SCK = 10 MHz, and this is reached when the ADC output code is a succession of ‘1’s and ‘0’s). The C load value includes internal digital output driver capacitance, but this can generally be neglected with respect to the external loading capacitance.

EQUATION 4-12:

DIDD SPI = C load  DV DD  f Where:

out C load = Capacitance on the Output Pin DV DD = Digital Supply Voltage

f out = Output Frequency on the Output Pin  2020-2021 Microchip Technology Inc. DS20006391C-page 35

MCP3561/2/4R

NOTES:

DS20006391C-page 36  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

5.0 DEVICE OVERVIEW

5.1 Analog Input Multiplexer

Each of these multiplexers includes the same possibilities for the input selection, so that any required combination of input voltages can be converted by the ADC. The analog multiplexer is composed of parallel low-resistance input switches turned on or off depending on the input channel selection. Their resistance is negligible compared to the input impedance of the ADC (caused by the charge and discharge of the input sampling capacitors on the V IN +/V IN - ADC inputs). The block diagram of the analog multiplexer is shown in Figure 5-1.

The device includes a fully configurable analog input dual multiplexer that can select which input is connected to each of the two differential input pins (V IN +/V IN -) of the Delta-Sigma ADC. The dual multiplexer is divided into two single-ended multiplexers that are totally independent.

MUX<7:4> CH0 CH1 A GND AV DD AV DD REFIN+/OUT

REFIN-

TEMP diode P AV DD

I SOURCE CS_SEL<1:0> AV DD

I TEMP+ I TEMPTEMP diode M

V CM MUX<7:4>

=1101 MUX<3:0>

=1101 VIN+ Analog Multiplexer MUX<3:0>

=1110

V IN+ A GND

MUX<3:0> V

INCH0 CS_SEL<1:0> CH1 A GND MUX<7:4>

=1110 I SINK Sigma-Delta ADC AV DD REFIN+/OUT

REFINA GND

TEMP diode P TEMP diode M

V CM VIN- Analog Multiplexer A GND

Analog Input Dual Multiplexer FIGURE 5-1: Simplified Analog Input Multiplexer Schematic.

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MCP3561/2/4R

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MCP3561/2/4R

5.1.1 BURNOUT CURRENT SOURCES

FOR SENSOR OPEN/SHORT DETECTION The ADC inputs, V IN -/V IN +, feature a selectable burnout current source, which enables open or short-circuit detection, as well as biasing very low-current external sensors. The bias current is sourced on the V IN + pin of the ADC (noninverting output of the analog multiplexer) and sunk on the V IN - pin of the ADC (inverting output of the analog multiplexer). Since the same current flows at the V IN -/V IN + pins of the ADC, it can sense the impedance of an externally connected sensor that would be connected between the selected inputs of the multiplexer. When the sensor is in short circuit, the ADC converts signals that are close to 0V. When the sensor is an open circuit, the ADC converts signals that are close to the AV DD voltage. The current source is an independent peripheral of the ADC. It does not need the ADC to be in Conversion mode to be present. Once enabled, the source provides current even when the ADC is in reset or ADC Shutdown mode. The current source can be configured at any time through programming the CS_SEL[1:0] bits in the CONFIG0 register (see Table 5-2).

5.1.2 INTERNAL TEMPERATURE

SENSOR The device includes an on-board temperature sensor, which is made of two typical P-N junction diodes biased by fixed current sources (TEMP Diode P and M). The TEMP Diode P has a current density of 4x of the TEMP Diode M. The difference in the current densities of the diodes yields a voltage that is a function of the absolute temperature. Once the ADC inputs (V IN -/V IN +) are connected to the temperature sensor diodes (MUX[7:0] = 0xDE), the ADC will see a V IN differential input that is the function of the temperature. The transfer function of the temperature sensor can be approximated by a linear equation or a third-order equation for more accuracy. When the internal temperature sensor is selected for the MUX or SCAN input, the input sink/source current source, controlled by the CS_SEL[1:0] bits (see Section 5.1, Analog Input Multiplexer), is disabled internally (even though the CS_SEL[1:0] bits are not modified by the temperature sensor selection). In this case, the input current source is replaced by a specific internal current source that will only be sourced to the diode temperature sensor (see Figure 5-1). Since the amount of current selected can be very small, it may be necessary to diminish the MCLK master clock frequency to be able to reach the full desired accuracy during conversions (the settling time of the input structure, including the sensor, can be large if the sensor is very resistive, which will limit the bandwidth of the Sample-and-Hold input circuit).

The bias current of the diodes is not calibrated internally and can lead to a relatively large gain and offset error in the transfer function of the temperature sensor. Typical graphs showing the typical error in the temperature measurement are provided in Section 2.0, Typical Performance Curves (see Figure 2-51 for first-order).

TABLE 5-2:

The accuracy can also be optimized by using proper digital gain and offset error calibration schemes. BURNOUT CURRENT SOURCE SETTINGS CS_SEL[1:0] (Source/Sink)

The accuracy of the current sources is on the order of magnitude of ±20% and not very well controlled internally. However, the mismatch between sink and source is typically around ±1%. This relatively low accuracy on the current is generally sufficient for open/short detection applications. Figure 2-53 shows how the ADC output code varies when the burnout current sources are enabled (with Gain = 1x) and the input sensor impedance is swept with a large dynamic range. This allows the use of the ADC as an open/short-detection circuit, which is practical when manufacturing complex remote sensor systems.

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MCP3561/2/4R

EQUATION 5-1: TEMPERATURE SENSOR TRANSFER FUNCTION

First-order (linear) fitting: Gain = 1, MCLK = 4.9152 MHz

TEMP (°C) = 4.0096  10 (– 4)  ADCDATA(LSB)  V REF (V) – 269.13, where V REF = V REF + – V REF -

5.1.3 ADC OFFSET CANCELLATION

ALGORITHM The input multiplexer and the ADC include an offset cancellation algorithm that cancels the offset contribution of the ADC. This offset cancellation algorithm is controlled by the AZ_MUX bit in the CONFIG2 register. When AZ_MUX = 0 (default), the offset cancellation algorithm is disabled and the conversions are not

EQUATION 5-2:

affected by this setting. When AZ_MUX = 1, the algorithm is enabled. When the offset cancellation algorithm is enabled, ADC takes two conversions, one with the differential input as V IN +/V IN -, one with V IN +/V IN - inverted. Equation 5-2 calculates the ADC output code. When AZ_MUX = 1, the Conversion Time, T CONV , is multiplied by two, compared to the default case where

AZ_MUX CONVERSION RESULT

 ADC Output at + V IN  –  ADC Output at -V IN  - ADC Output Code (AZ_MUX = 1) = ------------------------------------------------------------------------------------------------------------------------ 2 This technique allows the cancellation of the ADC offset error and the achievement of ultra-low offset without any digital calibration. The resulting offset is the residue of the difference between the two conversions, which is on the order of magnitude of the noise floor. This offset is effectively canceled at every conversion, so the residual offset error temperature drift is extremely low.

DS20006391C-page 40 For One-Shot mode, the conversion time is simply multiplied by two. Enabling the AZ_MUX bit is not compatible with the Continuous Conversion mode (because it effectively multiplexes the inputs in between each conversion). If AZ_MUX = 1 and

the device will reset the digital filter in between each conversion, and will therefore, have an output data rate of 1/(2 * T CONV ). The Continuous mode is replaced by a series of One-Shot mode conversions with no delay in between each conversion (see Section 5.14 “Conversion Modes” and Figure 5-5 for more details about the Conversion modes).

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MCP3561/2/4R

5.2 Input Impedance This anti-aliasing filter can be a simple first-order RC

network with low time constant, which will provide a high rejection at the DMCLK frequency (see Figure 5-6 for more details). The RC network usually uses small R and large C to avoid additional offset due to IR drop in the signal path. This anti-aliasing filter will induce a small systematic gain error on the AC input signals that can be compensated in the digital section with the Digital Gain Error Calibration register (GAINCAL).

The ADC inputs (V IN +/V IN -) are directly tied to the analog multiplexer outputs and are not routed to external pins. The multiplexer input stage contribution to the input impedance is negligible. The conversion accuracy can be affected by the input signal source impedance when any external circuit is connected to the input pins. The source impedance adds to the internal impedance and directly affects the time required to charge the internal sampling capacitor. Therefore, a large input source impedance connected to the input pins can increase the system performance errors, such as offset, gain and Integral Nonlinearity (INL). Ideally, the input source impedance should be near zero. This can be achieved by using an operational amplifier with a closed-loop output impedance of tens of ohms.

5.3

The gain of the converter is programmable and controlled by the GAIN[2:0] bits in the CONFIG2 register. The ADC programmable gain is divided in two gain stages: one in the analog domain, one in the digital domain, as per Table 5-3. After the multiplexer, the analog input signals are routed to the Delta-Sigma ADC inputs and are amplified by the analog gain stage (see Section 5.3.1 “Analog Gain” for more details). The digital gain stage is placed inside the digital decimation filter (see Section 5.3.2 “Digital Gain” for more details).

A proper anti-aliasing filter must be placed at the ADC inputs. This will attenuate the frequency contents around DMCLK and keep the desired accuracy over the baseband (DRCLK) of the converter.

TABLE 5-3:

ADC Programmable Gain

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MCP3561/2/4R

5.3.1 ANALOG GAIN The gain settings from 0.33x to 16x are done in the analog domain. This analog gain is placed on each ADC differential input. Each doubling of the gain improves the thermal noise due to sampling by approximately 3 dB, which means the lowest noise configuration is obtained when using the highest analog gain. The SNR, however, is degraded, since doubling the gain factor reduces the maximum allowable input signal amplitude by approximately 6 dB. If the gain is set to 0.33x, the differential input range theoretically becomes ±3 * V REF . However, the device does not support input voltages outside of the power supply voltage range. If large reference voltages are used with this gain, the input voltage range will be clipped between A GND and AV DD , therefore limiting the output code span. This gain is useful when the reference voltage is small and when the input signal voltage is large. The analog gain stage can be used to amplify very low signals, but the differential input range of the Delta-Sigma modulator must not be exceeded.

5.3.2 DIGITAL GAIN When the gain setting is chosen from 16x to 64x, the analog gain stays constant at 16x and the additional gain is done in the digital domain by a simple shift and round of the output code. The digital gain range is between 1x and 4x. The output noise is approximately unchanged (except for the quantization noise, which is slightly decreased). The SNR is thus degraded by 6 dB per octave from 16x to 64x settings. This digital gain is useful for scaling up the signals without using the host device (MCU) operations, but they degrade the SNR and resolution (1 bit per octave), and do not significantly improve the noise performance, except for very large OSR settings.

5.4

5.4.1

Delta-Sigma Modulator

ARCHITECTURE The Delta-Sigma ADC includes a second-order modulator with a multibit DAC architecture. Its 5-level quantizer is a Flash ADC composed of four comparators with equally spaced thresholds and a thermometer output coding. The proprietary 5-level architecture ensures minimum quantization noise at the outputs of the modulators without disturbing the linearity or inducing additional distortion. Unlike most multibit DAC architectures, the 5-level DAC used in this architecture is inherently linear, and therefore, does not degrade the ADC linearity and THD performance. The sampling frequency is DMCLK; therefore, the modulator outputs are refreshed at a DMCLK rate.

DS20006391C-page 42 Figure 5-2 represents a simplified block diagram of the Delta-Sigma modulator.

Delta-Sigma 2 nd Order 5-Level Modulator Quantizer

Differential Input

Voltage (from Analog Mux)

Analog 2 nd Order

FIGURE 5-2: Block Diagram.

5.4.2 Digital

Simplified Delta-Sigma ADC MODULATOR OUTPUT BLOCK The modulator output option enables users to apply their own digital filtering on the output bit stream. By setting IRQ_MODE[1] = 1 in the IRQ register, the modulator output is available at the IRQ/MDAT pin, at AMCLK rate and also through the ADCDATA register (0x0) with DMCLK rate. With this configuration, the digital decimation filter is disabled in order to reduce the current consumption and no data ready interrupt is generated on any of the IRQ mechanisms. The IRQ/MDAT pin is never placed in high-impedance during the Modulator Output mode. Since the Delta-Sigma modulator has a 5-level output given by the state of four comparators with thermometer coding, the output is represented using four bits, each bit representing the state of the corresponding comparator (see Table 5-4). The comparator output bits are arranged serially at the AMCLK rate on the IRQ/MDAT output pin (see Figure 5-3). This 1-bit serial bit stream is considered to be the same one as it is produced by a 1-bit DAC modulator with a sampling frequency of AMCLK. The modulator can either be considered as a 5-level output at DMCLK rate or as 1-bit output at AMCLK rate. These two representations are interchangeable. The MDAT outputs can, therefore, be used in any application that requires 1-bit modulator outputs. This application can be integrated with an external sinc filter or more advanced decimation filters that are computed in the MCU or DSP device. When CLK_SEL[1:0] = 11 (internal oscillator with external clock output), the AMCLK clock is present on the MCLK pin. This configuration allows a correct synchronization of the bit stream when the internal oscillator is used as the master clock source. When CLK_SEL[1:0] = 00, the modulator outputs are also synchronized with the MCLK input but the ratio between MCLK and AMCLK must to be taken into account in the user applications to correctly retrieve the desired bit stream.

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MCP3561/2/4R

The default value of the bit stream after a reset or a power-up is ‘0011’; it is equivalent to a 0V input for the ADC. After each ADC reset and restart (see Section 5.16 “A/D Conversion Automatic Reset and Restart Feature”), the bit stream output is also reset and restarted, and the IRQ/MDAT is kept equal to logic high during the two MCLK clock periods needed for the synchronization. After these two clock periods, the bit stream will be provided on the IRQ/MDAT pin and the first value will be the default value.

TABLE 5-4: DELTA-SIGMA MODULATOR

OUTPUT BIT STREAM CODING

COMP[3:0]

Code Modulator Output Code (Decimal)

MDAT Serial Stream Equivalent

V REF Voltage 1111 +2 1111 +V REF 0111 +1 0111 +V REF /2 0011 0 0011 0 0001 -1 0001 -V REF /2 0000 -2 0000 -V REF t D OMD AT t D OMD AT t D OMD AT t D OMD AT t D OMD AT AMCLK MDAT

5.4.3 BOOST MODES The Delta-Sigma modulator includes a programmable biasing circuit in order to further adjust the power consumption to the sampling speed applied through the MCLK. This can be programmed through the BOOST[1:0] bits in the CONFIG2 register. The different BOOST settings are applied to the entire modulator circuit, including the voltage reference buffers. The settings of the BOOST[1:0] bits are described in Table 5-5.

TABLE 5-5: BOOST SETTINGS

DESCRIPTION BOOST[1:0] Bias Current

00 x0.5 01 x0.66 10 x1 (default) 11 x2

The maximum achievable Analog Master Clock (AMCLK) speed, the maximum sampling frequency (DMCLK) and the maximum achievable data rate (DRCLK) are highly dependent on the BOOST[1:0] and GAIN[2:0] settings. A higher BOOST setting allows the circuit’s bandwidth to be increased and allows a higher analog master clock rate which will then increase the baseband of the input signals to be converted. The digital gain (which is enabled at 32x and 64x gains) has no influence on the achievable bandwidth. A typical dependency of the bandwidth depending on the gain for each BOOST setting combination is shown from Figure 2-35 to Figure 2-38. Typically, a larger gain setting requires a higher BOOST setting in order to achieve the same bandwidth performance. MDAT (code = +1)

Figure 2-43 shows the behavior of the achievable bandwidth at BOOST = 1x with AV DD corner cases. Since the BOOST settings vary, the internal slew rate of the modulator components, using a lower V REF value, will improve the bandwidth if low BOOST settings are used and show a bandwidth behavior that is too limited.

MDAT (code = 0)

MDAT

MDAT

C OMP[3] C OMP[2] C OMP[1] C OMP[0] FIGURE 5-3: MDAT Serial Outputs Depending on the Modulator Output Code.

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MCP3561/2/4R

5.5 Digital Decimation Filter

The decimation filter decimates the output bit stream of the modulator to produce 24-bit ADC output data. The decimation filter present in the device is a cascade of two filters: a third-order sinc filter with a decimation ratio of OSR 3 (third-order moving an average of 3 x OSR 3 values), followed by a first-order sinc filter with a decimation ratio of OSR 1 , moving an average of OSR values (third-order moving average of 3 x OSR 3 values). Figure 5-4 represents the decimation filter architecture.

OSR 1 = 1 Modulator Output (Thermometer

Coding)

SINC 3 SINC 1 4 OSR 3 OSR 1 Decimation

Filter Output

ADC Resolution Decimation Filter

FIGURE 5-4: Diagram.

Decimation Filter Block The following equation is the transfer function of the decimation filter:

EQUATION 5-3: FILTER TRANSFER

FUNCTION

The resolution (number of possible output codes expressed in powers of two or in bits) of the digital filter is 24-bit maximum for any OSR = OSR 3 x OSR 1 and data format choice. The resolution only depends on the OSR through the OSR[3:0] settings in the CONFIG1 register per Table 5-6. Once the OSR is chosen, the resolution is fixed and the output code of the ADC is encoded with the data format defined by the DATA_FORMAT[1:0] setting in the CONFIG3 register.

DS20006391C-page 44 The transfer function of this filter has a unity gain at each multiple of DMCLK. A proper anti-aliasing filter must be placed at the ADC inputs. This will attenuate the frequency contents around each multiple of DMCLK and keep the desired accuracy over the baseband of the converter. This anti-aliasing filter can be a simple first-order RC network with low time constant to provide a high rejection at DMCLK frequency. The conversion time is a function of the OSR settings and the DMCLK frequency.

EQUATION 5-4: CONVERSION TIME FOR

T CONV =   3  OSR 3  +  OSR 1 – 1   OSR 3   DMCLK In One-Shot mode, each conversion is launched individually, so the maximum data rate is effectively 1/T CONV if each conversion is launched with no delay. The digital filter is reset in between each conversion. However, due to the nature of the digital filter (which memorizes the sum of the incoming bit stream), the data rate at the filter output can be maximized if the filter is never reset. Because of the internal resampling of the digital filter, the output data rate can be equal to DMCLK/OSR = DRCLK; this is the case in Continuous mode. In this case, the first conversion still happens in the T CONV time, as this is the settling time of the filter. The subsequent conversions are pipelined and give their output at a data rate of DRCLK. The Continuous Conversion mode can optimize the data rate, while consuming the same power as One-Shot mode, which is advantageous in applications that require a continuous sampling of the analog inputs. The Continuous mode is not compatible with multiplexing the inputs (see Section 5.15 “SCAN Mode” for more details about the Conversion mode settings in MUX and SCAN modes). Figure 5-5 shows the fundamental difference between One-Shot mode and Continuous mode in a simplified diagram.

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MCP3561/2/4R

Analog Input

Signal One-Shot mode Conversions are Serialized, IRQ Filter is Reset After Each ADC

Conversion Status Group Delay: T CONV Data Rate: 1/(T CONV )

Conversion1 Conversion2 Conversion3

T CONV T CONV T CONV IRQ

ADC Continuous mode Status Conversions are Pipelined,

Filter is Never Reset Group Delay: T CONV Data Rate: DRCLK Conversion1 T CONV = Settling Time 1/DRCLK Conversion2

T CONV Conversion3

T CONV FIGURE 5-5: One-Shot Mode vs. Continuous Mode.

Since the converter is effectively doing two conversions when the AZ_MUX bit is enabled, the conversion time is equal to 2 * T CONV in this mode. As described in Section 5.1.3 “ADC Offset Cancellation Algorithm”, this selection is not compatible with the Continuous Conversion mode, and therefore, the output data rate is equal to 1/(2 * T CONV ) in this mode.

When OSR is larger than 20480 for typical master clock frequency, MCLK = 4.9152 MHz, the device includes an additional 50/60 Hz rejection by aligning decimation filter notches with a multiple of 50/60 Hz depending on the OSR setting. The rejection band strongly depends on the master clock accuracy and corresponds to a first-order decimation filter rejection rate. Table 5-6 summarizes the possible filter settings and their associated Conversion Time, T CONV , as well as their output data rate (DRCLK) in Continuous mode.

The high OSR settings can be used for applications requiring very low noise and slow data rates.

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Figure 5-6 shows the frequency response of the decimation filter with default settings. Figure 5-7 represents the frequency response of the filter with the highest OSR settings and a line rejection at 60 Hz.

DS20006391C-page 45

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TABLE 5-6: OVERSAMPLING RATIO AND SINC FILTER RELATIONSHIP 1 Total OSR ADC Resolution

(T CONV )

Data Rate in Continuous

Conversion Mode

Data Rate (Hz) with MCLK = 4.9152 MHz Fastest Data Rate (Hz)

with MCLK = 19.6608 MHz

96/DMCLK 38400 153600 192/DMCLK 19200 76800

9600 38400 768/DMCLK 4800 19200 1536/DMCLK 2400 9600 2048/DMCLK 1200 4800 3072/DMCLK 600 2400 5120/DMCLK 300 1200 9216/DMCLK 150 600 17408/DMCLK 75 300 24 21504/DMCLK 60 240 24576 24 25600/DMCLK 50 200 40960 24 41984/DMCLK 30 120 96 49152 24 50176/DMCLK 25 100 512 160 81920 24 82944/DMCLK 15 60 512 192 98304 24 99328/DMCLK 12.5 50 DS20006391C-page 46  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

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MCP3561/2/4R

5.6 ADC Output Data Format

The ADC Output Data (ADCDATA) register is located at the address: 0x0. The default length of the register is 24-bit (23-bit + sign). Output data are calculated in the digital decimation filter with a much larger resolution and rounded to the closest LSb value.

EQUATION 5-5:

The rounding ensures a maximum 1/2 LSb error instead of a simple truncation that ensures a 1 LSb maximum error. Equation 5-5 calculates the ADC output code as a function of the input and reference signals for DC inputs.

ADC OUTPUT CODE FOR DC INPUT (DATA_FORMAT[1:0] = 00)

For AC sine wave inputs, the decimation filter transfer function (see Equation 5-3) induces an additional gain on the ADC output code, which depends on the input frequency (roll-off of the decimation filter). For any inputs, the V IN +/V IN - voltages are averaged out during the whole conversion time as the ADC is an oversampling converter.

00 ADC output format is set by the DATA_FORMAT[1:0] bits in the CONFIG3 register. These bits define four different possible formats for the ADC Data Output register: three 32-bit formats and one 24-bit format for the MCP3561/2/4R. Figure 5-8 describes all possible data formats.

SGN + DATA[22:0] SGN+ DATA[22:0] 01 0x00 10 SGN ext (8-bit) DATA[23:0] 11 CH_ID[3:0] SGN ext (4-bit) DATA[23:0] FIGURE 5-8: ADC Output Format Selection.

When DATA_FORMAT[1:0] = 0x, the ADC data are represented on 24 bits (23-bit plus sign). The ADC output code is represented with MSb first signed two’s complement coding. With these two data formats, the coding does not allow overrange; the equivalent analog input range is [-V REF ; +V REF – 1 LSb]. When V IN * Gain > V REF – 1 LSb, the 24-bit ADC code (SGN+DATA[22:0]) will saturate and be locked at 0x7FFFFF. When V IN * Gain < -V REF , the 24-bit ADC code will saturate and be locked at 0x800000. Using these data formats does not permit correctly evaluating full-scale errors in case of a positive full-scale error.

DS20006391C-page 48 When DATA_FORMAT[1:0] = 00, the output register shows only the 24-bit value. When DATA_FORMAT[1:0] = 01, the output register is 32 bits long and the output code is padded with additional zeros on the last byte. The output code is left justified in this case. This format is useful for 32-bit MCU applications.

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MCP3561/2/4R

When DATA_FORMAT[1:0] = 1x, the ADC data are represented on 25 bits. For these two data formats, the output register is 32 bits long. With these two data formats, the coding allows overrange; the equivalent analog input range is [-2 x V REF , +2 x V REF – 1 LSb]. When V IN * Gain > 2V REF – 1 LSb, the 25-bit ADC code (SGN+DATA[23:0]) will saturate and be locked at 0x0FFFFFF. When V IN * Gain < -2V REF , the 24-bit ADC code will saturate and be locked at 0x1000000. Using these data formats allows a correct evaluation of the full-scale errors in case of a positive full-scale error, since they allow inputs that can be greater than V REF or less than -V REF . The ADC accuracy is not maintained on the full extended [-2 x V REF , +2 x V REF – 1 LSb] range, but only on a smaller range, which is approximately equal to ±1.05 x V REF . This overrange can be useful in high-side measurements and gain error cancellation algorithms. The overrange-capable formatting on 25 bits is fully compatible with the standard code locked formatting on 24 bits; both coding formats will produce the same TABLE 5-7:

24-bit codes for the [-V REF ; +V REF – 1 LSb] range and the MSb on the 25-bit coding can be considered as a simple Sign bit extension. When DATA_FORMAT[1:0] = 10, the 25-bit (24-bit + SGN) value is right justified. The first byte of the 32-bit ADC output code will repeat the Sign bit (SGN). In DATA_FORMAT[1:0] = 11, the output code is similar to the one in DATA_FORMAT[1:0] = 10. The only difference resides in the four MSbs of the first byte, which are no longer repeats of the Sign bit (SGN). They are the Channel ID data (CH_ID[3:0]) that are defined in Table 5-15. This CH_ID[3:0] word can be used to verify that the right channel has been converted to SCAN mode and can serve easy data retrieval and logging (see Section 5.15 “SCAN Mode” for more details about the SCAN mode). In MUX mode, this 4-bit word is defaulted to ‘0000’ and does not vary with the MUX[7:0] selection. This format is useful for 32-bit MCU applications.

Equivalent Input Voltage ADC Output Code (SGN + DATA[21:0]) > 2 V REF – 1 LSb 0111111111111111111111111 0x0FFFFFF +16777215 2 V REF – 2 LSb 0111111111111111111111110 0x0FFFFFE +16777214 V REF + 1 LSb 0100000000000000000000001 0x0800001 +8388609 V REF 0100000000000000000000000 0x0800000 +8388608 V REF – 1 LSb 0011111111111111111111111 0x07FFFFF +8388607 V REF – 2 LSb 0011111111111111111111110 0x07FFFFE +8388606 1 LSb 0000000000000000000000001 0x0000001 +1 0 0000000000000000000000000 0x0000000 0 -1 LSb 1111111111111111111111111 0x1FFFFFF -1 -V REF + 1 LSb 1100000000000000000000001 0x1800001 -8388607 -V REF 1100000000000000000000000 0x1800000 -8388608 -V REF – 1 LSb 1011111111111111111111111 0x17FFFFF -8388609 -2 VREF + 1 LSb 1000000000000000000000001 0x1000001 -16777215 < -2 V REF 1000000000000000000000000 0x1000000 -16777216  2020-2021 Microchip Technology Inc. DS20006391C-page 49

MCP3561/2/4R

5.7 Internal/External Voltage Reference

5.7.1 VOLTAGE REFERENCE

SELECTION The voltage reference selection for the ADC is controlled by the VREF_SEL bit in the CONFIG0 register, as shown in Table 5-9.

TABLE 5-9:

The REFIN- pin is set as an input, directly connected to the V REF- input of the ADC. For a better noise immunity, it is recommended to connect this pin to A GND externally when a single-ended voltage reference is used. Figure 6-10 shows more details of the reference selection and reference pins connections.

V REF- Input V REF+ Input Internal reference selected with 2.4V buffered output.

V REF- Input (should be tied to A GND )

Internal reference with 2.4V

buffered output.

REFINPAD ADC V REF-

Input REFIN+/OUT

PAD ADC V REF+

Input Chopped at DMCLK rate if AZ_VREF=1

2x +

V REF Buffer -

1x ADC Internal V

CM Voltage +

Internal Bandgap Voltage FIGURE 5-9:

DS20006391C-page 50 +

• 1.2V V CM Buffer Voltage Reference Selection Schematic.

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MCP3561/2/4R

When VREF_SEL = 0, the reference voltage is set to external mode. The REFIN+/OUT pin becomes an input. In this case, the REFIN+/OUT pad is directly tied to the V REF+ input of the ADC. There is no input buffer in the differential input voltage reference path in this mode, so the external voltage reference should include a buffer to be able to charge the internal voltage reference sampling capacitors. When VREF_SEL = 1, the REFIN+/OUT is internally buffered to produce a 2.4V buffered reference voltage at the V REF+ input of the ADC. Section 5.7.2 “Internal Voltage Reference Buffer” details the architecture of the voltage reference buffer. In this mode the REFIN+/OUT pin becomes an output and the reference voltage is generated internally. The structure of the internal voltage reference is based on a band gap voltage reference source, giving a 1.2V output directly connected to a low-noise chopper buffer configured with a gain of 2x to give a 2.4V output on the REFIN+/OUT pad. The internal reference has a very low typical temperature coefficient of 15 ppm/°C for extended temperature range and 9 ppm/°C for industrial temperature range, allowing the ADC output codes to have the least variation corresponding to the temperature ranges, since they are proportional to (1/V REF ).

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5.7.2 INTERNAL VOLTAGE REFERENCE

BUFFER

When VREF_SEL = 1, the voltage reference buffer is enabled. It is only powered on when the ADC state is in reset or in Conversion mode and is powered off in Shutdown mode. The buffer is designed to be able to drive the ADC reference input that is sampling the reference voltage. The REFIN- pin is not buffered and is connected directly to the ADC inverting voltage reference input (V REF- ). The offset induced by the buffer may slightly vary between the two possible gain selections as well as its temperature dependency and bandwidth, therefore it has to be characterized separately. The buffer injects a certain quantity of 1/f noise into the system, that can be modulated with the incoming input signals and can limit the SNR performance at higher OSR values (OSR > 256). To overcome this limitation, the buffer includes an auto-zeroing algorithm that greatly reduces (cancels out) the 1/f noise and cancels the offset value of the reference buffer. As a result, the SNR of the system is not affected by this 1/f noise component of the reference buffer, even at maximum OSR values. This auto-zeroing algorithm is performed synchronously with the DMCLK, and can be enabled or disabled with the AZ_VREF bit setting in the CONFIG2 register. When AZ_VREF = 1 (Default), the auto-zeroing is enabled, which cancels out the 1/f noise and improves the SNR while not impacting the THD performance. This mode is recommended for higher OSR values (OSR 256). When AZ_VREF = 0, the reference auto-zeroing algorithm is disabled. This setting should be reserved to lower OSR values, where higher ADC speed is more important than accuracy. If the application is susceptible to high frequency noise, using AZ_VREF = 0 or a proper low pass filter at the V REF output pin (to filter out the chopper frequency components from the buffered output) is recommended.

DS20006391C-page 51

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5.8 Power-on Reset

The analog and digital power supplies are monitored separately by two Power-on Reset (POR) monitoring circuits at all times, except during Full Shutdown mode (see Section 5.10, Low-Power Shutdown Modes).

If the CS pin is kept logic low during a POR state, a logic high pulse is necessary to start the first communication sequence after power-up. The CS rising edge will reset the SPI interface properly and the falling edge will clear the POR interrupt on the IRQ pin (see Figure 6-15). Each POR circuit has two separate thresholds, one for the rising voltage supply and one for the falling voltage supply. They both include hysteresis (the rising threshold is superior), so that the device is tolerant to a certain degree of transient noise on each power supply.

The DV DD and AV DD monitoring thresholds are different since their respective voltage ranges are different. The AV DD rising threshold is approximately 1.75V ± 10% and the DV DD is 1.2V ± 10%. The hysteresis is approximately 150 mV (typical). If any of the two power supply voltages is below its respective threshold, the POR state is forced internally. In this state, the SPI interface is disabled, no command can be executed by the chip. All registers are cleared and set to their default values.

Proper decoupling ceramic capacitors (0.1 µF and 10 µF ceramic) should be placed as close as possible to the power supply pins (AV DD , DV DD ) to provide additional transient immunity. During Full Shutdown mode, the power supply voltages are not monitored to be able to reach ultra-low power consumption. The device cannot generate a POR event interrupt in this mode, except for cases of extremely low-power supply voltages (see Section 5.10.1 “Full Shutdown Mode”).

At power-up, when both power supply voltages are above the rising thresholds, the device powers up and the SPI interface is enabled and can handle communications. Since both thresholds need to be crossed for the power-up, the power-up sequence is not important and any power supply voltage can ramp up first. The detection time for the monitoring circuits (t POR ) is about 1 µs for relatively fast power-up ramp rates. The normal operation stops when any of the falling thresholds of the two POR monitoring circuits is crossed. Figure 5-10 illustrates the power-up and power-down sequences.

In order to ensure a proper power-up sequence, the ramp rate of DV DD must not exceed 3V/µs when coming out of the POR state.

Voltage (AV DD , DV DD )

POR Threshold Up POR Threshold Down t POR

Time POR State

FIGURE 5-10:

DS20006391C-page 52 Normal Operation POR State Power-on Reset Timing Diagram.

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MCP3561/2/4R

5.9 ADC Operating Modes

The ADC can be placed into three different operating modes: ADC Shutdown, Standby and Conversion. The ADC operating mode is controlled by the user through the ADC_MODE[1:0] bits in the CONFIG0 register. The user can directly launch conversions or place the ADC into ADC Shutdown or Standby mode by writing these bits. Additional Fast commands are available for each of the three possible states of these bits to allow faster programming in case of time-sensitive applications (see Section 6.2.4 “Command-Type Bits (CMD[1:0])”). Table 5-10 describes the available ADC_MODE[1:0] settings. The ADC_MODE[1:0] bits do not give an instantaneous representation of the ADC state. Writing the ADC_MODE[1:0] bits sets the desired state of the ADC, but this state is only attained after a start-up time depending on the current state of the ADC (see Section 5.11 “ADC Start-up Timer” for details about the start-up timer). Typically, the device starts in ADC Shutdown mode after a POR (ADC_MODE[1:0] = 00 by default). To launch conversions in the desired configuration, the user should program the part in the desired configuration and then set the ADC_MODE[1:0] bits to ‘11’. In this case, the first conversion will start after T ADC_SETUP = 256 DMCLK periods. This time is necessary for the part to adjust to the new programmed settings and settle in to its operating point to accurately convert the input signals. Internally, the device tracks the current state of the ADC, as well as the start-up timer counter, to be able to optimize the start-up time depending on the desired transitions and internal configurations required, and set by the user.

TABLE 5-10:

In MUX mode, overwriting the ADC_MODE[1:0] bits to ‘11’ when the ADC is already in conversion resets and restarts the current conversion immediately. The conversion start pulse will also be regenerated if the EN_STP bit is enabled. In SCAN mode (see Section 5.15 “SCAN Mode”), writing the ADC_MODE[1:0] bits to ‘11’ starts the conversion SCAN cycle. During the complete cycle, even when the scan timer is enabled, reading the ADC_MODE[1:0] bits gives a ‘11’ code output, meaning that the SCAN cycle is ongoing. Rewriting ADC_MODE[1:0] = 11 during SCAN mode will immediately reset and restart the entire SCAN sequence from the beginning of the sequence. The conversion start pulse will also be regenerated if the EN_STP bit is enabled. The restart of the SCAN sequence may induce a T ADC_SETUP additional delay if the ADC is in ADC Shutdown mode when the ADC_MODE bits are overwritten (this can happen if the ADC_MODE bits are overwritten during the timer delay period, where the ADC is placed into ADC Shutdown mode in between two SCAN cycles). The ADCDATA register is always updated with the last conversion results. The ADCDATA register cannot provide incomplete conversion results. The A/D conversion must be completed to be able to provide a result in the ADCDATA register. Each end of conversion generates a data ready interrupt on all three IRQ mechanisms (see Section 6.8.1 “Conversion Data Ready Interrupt”). The ADCDATA register is never cleared when the device transitions from one mode to another. The only way to clear the ADCDATA register is a POR event or a Full Reset Fast command (see Section 6.2.5, Fast Commands Description).

ADC OPERATING MODES DESCRIPTION

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MCP3561/2/4R

5.10 Low-Power Shutdown Modes

The device incorporates two low-power modes that can be activated in order to limit power consumption of the device when ADC is not used. These two modes are called Partial Shutdown and Full Shutdown modes.

5.10.1 FULL SHUTDOWN MODE The Full Shutdown mode can only be enabled by sending a Fast Command Full Shutdown (Fast Command code: ‘1101’). Note that the execution of this fast command forces the CONFIG0 to be set to 0x00 (no active block is enabled). Full Shutdown mode is the lowest power mode of the device. None of the circuits consuming static power are active in this mode. As stated in Section 5.8 “Power-on Reset”, the AV DD /DV DD POR monitoring circuits are not active while in Full Shutdown mode.

Note: If the digital power supply resides for a

long time period below the POR threshold and to a sufficiently low voltage (typically below 0.6V0, some bits previously set to ‘1’ can toggle to ‘0’ and not be set properly. In order to ensure a safe operation after the full shutdown mode, follow the sequence of commands: - Write LOCK register to 0xA5 - Write IRQ register to 0x03 - Send a fast CMD full reset (1110) - Reconfigure the chip as desired This sequence ensures a recovery with the desired settings in any loss-of-power scenario. The part can still be accessed through the SPI interface during this mode and will accept incoming SPI commands. The ADCDATA register is not cleared

TABLE 5-11:

during Full Shutdown mode and still holds previous conversion results. The other register settings are not modified or reset due to entering in Full Shutdown mode. The Full Shutdown mode stops all internal timers and resets them. Sending a Fast CMD to change the operating mode exits the Full Shutdown mode. The user should place all digital inputs to a static value (logic low or high) in order to optimize power consumption during Full Shutdown mode. The current consumption specifications during Full Shutdown mode are intended without any digital pin toggling during the measurement. In this case, only leakage current is consumed throughout the device and this current varies exponentially with respect to absolute temperature.

5.10.2 PARTIAL SHUTDOWN MODE Partial Shutdown mode is achieved when CONFIG0 is set to ‘0000000x’. In this mode, most of the internal circuits are shut down, with the exception of the POR monitoring and internal biasing circuits. During the Partial Shutdown mode, the power supply is continuously monitored, whereas in Full Shutdown mode, the POR monitoring circuits are powered down. The power consumption is also much higher in Partial Shutdown mode due to the POR monitoring circuits being active. Partial Shutdown mode allows the device to be restarted and put back in Conversion mode faster than Full Shutdown mode. Table 5-11 describes the differences between Partial and Full Shutdown modes. If the current consumption of Partial Shutdown mode is acceptable for the application, it is recommended that it is used as an alternative to Full Shutdown mode where the POR monitoring circuits are shut down and no longer monitoring the AV DD and DV DD power supplies.

LOW-POWER MODES (1)

Device Low-Power Mode VREF_SEL CONFIG0[6]

Partial Shutdown 0 0 00 00 0x All peripherals, except the

POR monitoring circuits and clock biasing circuits, are shut down and consume no static current.The SPI interface remains active in this mode and consumes no current while the bus is Idle. Full Shutdown 0 0 00 00 00 All analog and digital circuits

are shut down and consume no static current. The SPI interface remains active in this mode and consumes no current while the bus is Idle. Note 1:

CLK_SEL[1:0] CS_SEL[1:0] ADC_MODE[1:0] Description

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MCP3561/2/4R

5.11 ADC Start-up Timer

The device includes an intelligent start-up timer circuit for the ADC, which ensures that the ADC is properly biased and that internal nodes are properly settled before each conversion. This timer ensures the proper conditions for the ADC to convert with its full accuracy for each conversion. The ADC can operate in three different modes: ADC Shutdown, Standby and Conversion, as described in Section 5.9 “ADC Operating Modes”. The ADC start-up timer manages the time for the transitions between each mode. These transitions can be instantaneous or can take a maximum of 256 DMCLK periods, depending on the type of transition, and the current status of the ADC and of the internal start-up timer. The timer will always try to reduce the transition time from one state to another, but will also allow enough time for the internal circuitry to settle to the proper internal operating points. The transitions from Standby or Conversion mode to ADC Shutdown mode are always immediate. They reset the internal start-up timer to 256 DMCLK periods (T ADC_SETUP ). The transitions from ADC Shutdown to Standby or Conversion mode start the internal start-up timer that decrements from 256 to 0. The timer only decrements after a small delay of two MCLK periods in case of a transition caused by an SPI command. This small delay is necessary to overcome any possible synchronization issue between the two asynchronous clocks: MCLK and SCK. The timer will immediately decrement (without the synchronization delay) if the transitions are generated by the internal state machine (for example, when the transitions are generated by the SCAN sequence). Once the timer reaches 0 (when the user has clocked 256 DMCLK periods), the device reaches its internal proper operating points and will either stay in Standby mode (if ADC_MODE[1:0] = 10) or start the Conversion mode (if ADC_MODE[1:0] = 11). The transition from Standby to Conversion mode and vice versa is immediate once the timer has reached 0 (if ADC_MODE[1:0] = 11). If the transition from Standby to Conversion mode occurs, and if the timer

TABLE 5-12:

has not yet reached 0, the timer will continue to decrement to 0 before effectively starting the conversion. The timer cannot decrement faster than 256 DMCLK periods when the ADC transitions from ADC Shutdown mode to Conversion mode (from ADC Shutdown mode, the ADC is allowed 256 DMCLK periods to power-up and settle to its desired operating point before starting conversions). The start-up time has been sized at 256 DMCLK clock periods for the part to be able to settle in all conditions and with all possible clock frequencies as specified. Table 5-12 summarizes the behavior of the internal start-up timer as a function of the ADC_MODE[1:0] settings. Rewriting ADC_MODE[1:0] bits without changing the bit settings does not modify the internal timer and cannot shorten the start-up delay necessary to start accurate conversions. A synchronization delay of two MCLK periods occurs after each rewrite if

In SCAN mode, when CONV_MODE[1:0] = 11 (Continuous mode), the ADC may be placed in ADC Shutdown mode and restarted in between each SCAN cycle depending on the TIMER[23:0] settings (see Section 5.15.5 “Delay Between SCAN Cycles (TIMER[23:0])”). If the TIMER register is programmed with a decimal code greater than T ADC_SETUP = 256, the internal timer will automatically place the part in ADC Shutdown mode at the end of the cycle and will start to transition to the next cycle 256 DMCLK periods before the end of the TIMER delay. This lowers the power consumed during the TIMER delay as much as possible. If the value of the TIMER delay is less than 256 DMCLK periods, the part will not enter ADC Shutdown mode and stay in Standby during the TIMER delay (in this case the power consumed is equivalent to the Conversion mode power consumption). In order to catch the start of the conversion in case of complex sequences of transitions, it can be useful to enable the EN_STP bit so that the part will generate a pulse on the IRQ pin to indicate a conversion start. Figure 5-11 shows different cases of transitions between modes and shows the internal state of the start-up timer for each step.

ADC START-UP TIMER BEHAVIOR AS A FUNCTION OF ADC_MODE[1:0] SETTINGS

convert when it reaches 0. 0x ADC Shutdown  2020-2021 Microchip Technology Inc.

ADC Start-up Timer Behavior ADC start-up timer is reset to T ADC_SETUP = 256.

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MCP3561/2/4R

DMCLK Continuous Clocking SPI Wri te Wri te Wri te AD C _M ODE =

1x AD C _M ODE = 0x AD C _M ODE = 1x 0x 1x 0x 1x Timer Reset Timer

Countdown Timer Reset Switching Between ADC_MODE = 10 and 11

has no Effect on the Timer ADC_MODE ADC Start-up Timer Decimal

Code Wri te

1X AD C _M ODE = 1x 256 ADC Ready to Convert 0 FIGURE 5-11:

5.12

ADC Start-up Timer Timing Diagram.

Master Clock Selection/Internal Oscillator

The device includes three possible clock modes for the master clock generation. The Master Clock (MCLK) is used by the ADC to perform conversions and is also used by the digital portion to generate the different digital timers. The clock mode selection is made through the CLK_SEL[1:0] bits located in the CONFIG0 register. The possible selections are described in Table 5-13. The master clock is not propagated in the chip when the chip enters the Full Shutdown mode (see Section 5.10 “Low-Power Shutdown Modes”). Any change to the CLK_SEL bits creates a reset and restart for the currently running conversions and a restart of the ADC setup timer. Each reset and restart resets all internal phases to their default values and can lead to a possible temporary duty cycle change at the clock output pin.

TABLE 5-13: CLOCK SELECTION BITS CLK_SEL[1:0] Clock Mode MCLK Pin

00 or 01 External clock MCLK digital input

10 Internal RC

Oscillator, no clock output High-Z 11 Internal RC

Oscillator with clock output AMCLK digital output DS20006391C-page 56 5.12.1 EXTERNAL MASTER CLOCK MODE

The External Clock mode is used to input the MCLK clock necessary for the ADC conversions and can accept duty cycles with a large range since the clock is redivided internally to generate the different internal phases. The external clock can be provided on the MCLK pin for the MCP3561/2/4R devices.

5.12.2 INTERNAL OSCILLATOR The device includes an internal RC-type oscillator powered by the digital power supply (DV DD /D GND ). The frequency of this internal oscillator ranges from 3.3 MHz to 6.6 MHz. The oscillator is not trimmed in production, therefore, the precision of the center frequency is approximately ±30% from chip to chip. The duty cycle of the internal oscillator is centered around 50% and varies very slightly from chip to chip. The internal oscillator has no reset feature and keeps running once selected.

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MCP3561/2/4R

5.12.3 INTERNAL MASTER CLOCK

When CLK_SEL[1] = 1, the internal oscillator is selected and the master clock is generated internally. The internal oscillator has no reset feature and continues to run once selected. The master clock generation is independent of the ADC as the clock can still be generated even if the ADC is in ADC Shutdown mode. The internal oscillator is only disabled when CLK_SEL[1:0] = 0x. The clock can be distributed to the dedicated output pin depending on the CLK_SEL[0] bit. When the clock output is selected (CLK_SEL[0] = 1), the AMCLK clock derived from the MCLK (AMCLK = MCLK/PRESCALE) is available on the output pin. The AMCLK output can serve as the clock pin to synchronize the modulator output or other MCP3561/2/4R devices that are configured with

The AMCLK output is available on the MCLK clock output pin as soon as the Write command

5.13 Digital System Offset and Gain Calibrations

The MCP3561/2/4R devices include a digital calibration feature for offset and gain errors. The calibration scheme for offset error consists of the addition of a fixed offset value to the ADC output code (ADCDATA at address: 0x0). The offset value added (OFFSETCAL) is determined in the OFFSETCAL register (address: 0x9). The calibration scheme for gain error consists of the multiplication of a fixed gain value to the ADCDATA code. The gain value (GAINCAL) multiplied is determined in the GAINCAL register (address: 0xA). The digital offset and gain calibration schemes are enabled or disabled via the EN_OFFCAL and EN_GAINCAL control bits of the CONFIG3 register. When both calibration control bits are enabled (EN_OFFCAL = EN_GAINCAL = 1), the ADCDATA register is modified with the digital offset and gain calibration schemes, as described in Equation 5-6. When a calibration enable bit is off, its corresponding register becomes a Don’t Care register and the corresponding calibration is not performed.

 2020-2021 Microchip Technology Inc.

EQUATION 5-6: ADCDATA OUTPUT

AFTER DIGITAL GAIN AND OFFSET ERROR CALIBRATION

[ADCDATA (pre-calibration) + OFFSETCAL] x GAINCAL The calculations are performed internally with proper management of overloading, so that the overload detection is done on the output result only and not on the intermediate results. A sufficient number of additional overload bits are maintained and propagated internally to overcome all possible overload and/or overload recovery situations. For example, if ADCDATA (pre-calibration) + OFFSETCAL is out of bounds, but (ADCDATA (pre-calibration) + OFFSETCAL) x GAINCAL is still in the right range (possible with 0 < GAINCAL < 1), the result is not saturated.

5.13.1 DIGITAL OFFSET ERROR

CALIBRATION The Offset Calibration register (OFFSETCAL, address: 0x9) is a signed MSb first, two’s complement coding, 24-bit register that holds the digital offset calibration value, OFFSETCAL. The OFFSETCAL equivalent input voltage value is calculated with Equation 5-7.

EQUATION 5-7: OFFSETCAL

CALIBRATION VALUE (EQUIVALENT INPUT VOLTAGE) OFFSETCAL (V) = V REF x (OFFSETCAL[23:0] signed decimal code)/(8388608 x GAIN)

For the MCP3561/2/4R devices, the offset calibration is done by adding the OFFSETCAL[23:0] calibration value to the ADCDATA code bit-by-bit. The offset calibration value range in equivalent voltage is [-V REF /GAIN; (+V REF – 1 LSb)/GAIN], which can cancel any possible offset in the ADC but also in the system. The offset calibration is realized with a simple 24-bit signed adder and is instantaneous (no pipeline delay). Enabling the offset calibration will affect the next conversion result; the conversion result already held in the ADCDATA register (0x0) is not modified when the EN_OFFCAL is set to ‘1’, but the next one will take the offset calibration into account. Changing the OFFSETCAL register to a new value will not affect the current ADCDATA value, but the next one (after a data ready interrupt) will take the new OFFSETCAL value into account. Figure 5-12 presents the different cases and their impact on the ADCDATA register and the IRQ output.

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MCP3561/2/4R

Wri te OFFSE TCA L[2 3:0] = OFFSE TCA L1 SPI ADC STATUS Data 2 Conversion Data 3 Conversion Data 4 Conversion DATA0 DATA1 DATA2 + OFFSETCAL1 DATA3 + OFFSETCAL2 FIGURE 5-12: ADC Output and IRQ Behavior with Digital Offset Calibration Enabled.

DIGITAL GAIN ERROR CALIBRATION The Gain Error Calibration register (GAINCAL, address: 0xA) is an unsigned 24-bit register that holds the digital gain error calibration value, GAINCAL. Equation 5-8 calculates the GAINCAL multiplier.

EQUATION 5-8: GAINCAL CALIBRATION

VALUE (MULTIPLIER VALUE) GAINCAL (V/V) = (GAINCAL[23:0] unsigned decimal code)/8388608 For the MCP3561/2/4R devices, the gain error calibration is done by multiplying the GAINCAL value to the ADC output code. The gain error calibration value range in equivalent voltage is [0; 2-2 -23 ], which can cancel any possible gain error in the ADC and in the system. The gain error calibration is made with a simple 24-bit Wri te GAIN C AL[2 3:0] = GAIN C AL1 SPI ADC STATUS Wri te OFFSE TCA L[2 3:0] = OFFSE TCA L2 Data 1 Conversion IRQ ADC DATA REGISTER

VALUE 5.13.2 Wri te EN _OFFC AL = 1 Data 1 Conversion Wri te EN _GAIN C AL = 1 add-and-shift circuit clocked on DMCLK and induces a pipeline delay of T GCAL = 23 DMCLK periods. This pipeline delay acts as a delay on the data ready interrupt position that is shifted by T GCAL = 23 DMCLK periods. During this delay, the converter can process the next conversion, the delay does not shift the next conversion and does not change the Conversion Time, T CONV . Enabling the gain error calibration will affect the next conversion result; the conversion result already held in the ADCDATA register (0x0) is not modified when the EN_GAINCAL is set to ‘1’, but the next one will take the offset calibration into account. Changing the GAINCAL register to a new value will not affect the current ADCDATA value, but the next one (after a data ready interrupt) will take the new GAINCAL value into account. Figure 5-13 shows the different cases and their associated effects on the ADCDATA register and the IRQ output.

Wri te GAIN C AL[2 3:0] = GAIN C AL2 Data 2 Conversion Data 3 Conversion Data 4 Conversion IRQ ADCDATA DATA0 DATA1 DATA2 x GAINCAL1 T GCAL

FIGURE 5-13:

DS20006391C-page 58 DATA3 x GAINCAL2 T GCAL

ADC Output and IRQ Behavior with Digital Gain Error Calibration Enabled.

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MCP3561/2/4R

5.14 Conversion Modes

The ADC includes several conversion modes that can be selected through the CONV_MODE[1:0] bits located in the CONFIG3 register. The ADC behavior, with respect to these bits, depends on whether the ADC is in MUX or SCAN mode. Table 5-14 summarizes the possible configurations.

TABLE 5-14: ADC CONVERSION MODES IN MUX OR SCAN MODES

CONVERSION MODES IN MUX MODE In MUX mode, the user can choose between one-shot and continuous conversions. A one-shot conversion is a single conversion and takes a certain Conversion Time, T CONV (or 2 x T CONV when AZ_MUX = 1, see Section 5.1.3 “ADC Offset Cancellation Algorithm”). Once this conversion is performed, the part automatically returns to a Standby or ADC Shutdown state, depending on the CONV_MODE[1:0] bit settings. The Conversion mode determined by the CONV_MODE[1:0] bits settings will also affect the state of the ADC_MODE[1:0] as described in Table 5-14. The conversion can be preceded by a start-up time that depends on the ADC state (see Section 5.11 “ADC Start-up Timer”). In One-Shot mode, the ADC data have to be read completely with the SPI interface for the interrupt to be cleared on the IRQ pin (the IRQ pin cannot be automatically cleared like in the Continuous Conversion mode). This mode is recommended for low-power, low bandwidth applications, requiring a once in a while A/D conversion.

 2020-2021 Microchip Technology Inc.

Performs continuous SCAN cycles with TIMER[23:0] delay between each cycle.

In Continuous Conversion mode, the ADC is never placed in Standby or ADC Shutdown mode and converts continuously without any internal reset. In this mode, the output data rate of the ADC is defined by DRCLK (see Figure 5-5). The digital decimation filter induces a pipeline or group delay of T CONV for the first data ready and is structured to give a continuous stream of data at the DRCLK rate after this first data (the internal registers of the filter are never reset in this mode, thus the decimation filter acts as a moving average). Each data ready interrupt corresponds to a valid and complete conversion that was processed through the digital filter (the digital filter has no latency in this respect). This mode allows a faster data rate than the One-Shot mode and is therefore recommended for higher bandwidth applications. The pipeline delay should be carefully determined and adapted to the user needs, especially in closed-loop, low-latency applications. This mode is recommended for applications requiring continuous sampling/averaging of the input signals. If AZ_MUX = 1, the Continuous Conversion mode is replaced by a series of subsequent One-Shot mode conversions with a reset in between each conversion. This makes the group delay equal to 2 x T CONV and the data rate equal to 1/(2 x T CONV ). Figure 5-14 and Figure 5-15 detail One-Shot and Continuous Conversion modes for MUX mode.

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MCP3561/2/4R

ADC Data Read can be t DODR Performed During this Time

SPI Wri te C ONV _M OD E = 0x o r 10 MCLK ADC_MODE ADC STATUS Wri te AD C M ODE = 11 Read ADC Data Don’t Care Continuous Clocking Don’t Care 00 11 ‘0x’ or ‘10’ Depending on CONV_MODE[1:0] Start-up Conversion Partial Shutdown or Reset Depending on CONV_MODE[1:0] T ADC SET UP T CONV Partial Shutdown IRQ Conversion

Start (Generates

Pulse if

FIGURE 5-14:

T S TP IRQ is Cleared at First SCK Falling Edge

After ADC Read Start

MUX One-Shot Conversion Mode Timing Diagram.

Write SPI

CONV_ Write MOD E = 11 ADC _MOD E = 11 MCLK ADC_MODE

ADC STATUS Don’t Care Continuous Clocking 00 11 Partial Shutdown DS20006391C-page 60 R ea d A DC

D ata 2 Start-up Data 1 Conversion Data 2 Conversion Data 3 Conversion T A DC_S E TUP T CONV 1/DRCLK 1/DRCLK IRQ FIGURE 5-15:

R ea d A DC

D ata 1 T DRH T DRH

MUX Continuous Conversion Mode Timing Diagram.

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

5.14.2 CONVERSION MODES IN SCAN

MODE If CONV_MODE[1:0] = 11, the ADC runs in a SCAN Cycle mode with a TIMER[23:0] delay between cycles. Writing the CONV_MODE[1:0] bits with the SPI interface within a conversion does not create an internal reset. It is recommended not to wait for the end of a conversion to change the CONV_MODE[1:0] bits to the desired value, but to change to the desired value just after the data are ready to avoid possible glitches. Figure 5-16 and Figure 5-17, respectively, detail the ADC timing behavior in One-Shot and Continuous Conversion modes when configured for SCAN mode with N channels chosen among 16 SCAN possibilities.

In SCAN mode, the device takes one conversion per channel and multiplexes the input to the next channel in the SCAN sequence. Therefore, all conversions are One-Shot mode conversions, no matter how the CONV_MODE[1:0] bits are set. Each conversion takes the same time, T CONV (or 2 x T CONV when AZ_MUX = 1, see Section 5.1.3 “ADC Offset Cancellation

01 or 10, the SCAN cycle is executed once and then the ADC is placed into Standby or ADC Shutdown mode.

SPI Write CONV_MODE = 0x/10 MCLK Write ADC_MODE = 11 Don’t Care ADC STATUS Start-up Channel 1 Conversion Reset Channel 2 Conversion Reset Channel N Conversion (Last in Cycle) T DLY_SCAN T CONV T ADC_SETUP T CONV T DLY_SCAN T CONV

IRQ SCAN One-Shot Conversion Mode Timing Diagram.

Read ADC Data N Continuous Clocking 00 ADC_MODE SPI Read ADC Data N-1 Read ADC Data 1 Read ADC Data1 (New Cycle) Read ADC Data N Continuous Clocking 00 11

T ADC_SETUP ADC Shutdown Start-up Channel 1 Conversion Reset Channel 2 Conversion Reset Channel N Conversion (Last in Cycle)

T DLY_SCAN T CONV T ADC_SETUP T CONV

IRQ T CONV T DLY_SCAN

T DRH ADC Shutdown or Reset Depending on TIMER[23:0] Settings

T TIMER_SCAN Start-up Channel 2 Conversion Channel 1 Conversion Reset (New Cycle) (New Cycle)

T CONV T DLY_SCAN

T DRH T DRH T CONV

T DRH Start-up Time is Reduced to 0 if T TIMER_SCAN < 256 DMCLK

Periods

FIGURE 5-17: SCAN Continuous Conversion Mode Timing Diagram.

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MCP3561/2/4R

5.15 SCAN Mode

5.15.1 5.15.2

SCAN MODE PRINCIPLE The ADC is, by default, in MUX mode at power-up. The

ADC enters SCAN mode as soon as one of the SCAN[15:0] bits in the SCAN register is set to ‘1’. MUX mode and SCAN mode cannot be enabled at the same time. When SCAN[15:0] = 0x0000, SCAN mode is disabled and the part returns to MUX mode, where the input channel selection is defined by the MUX[7:0] bits.

In SCAN mode, the device sequentially and automatically converts a list of predefined differential inputs (also referred to as input channels) in a defined order. After this series of conversions, the ADC can be placed in Standby or ADC Shutdown mode, or it can wait a certain time in order to perform the same sequence of conversions periodically. The SCAN cycle conversions are effectively started as

soon as the ADC_MODE[1:0] bits are programmed through the SPI interface to ‘11’ (direct Write or Fast command, ADC reset and restart). After the ADC_MODE[1:0] bits are set to ‘11’, they keep the same value until the SCAN mode is completed or aborted.

This mode is useful for applications that require constant monitoring of defined channels or internal resources (like AV DD or VCM), and allow a minimal and simplified communication. When in SCAN mode, the MUX register (address: 0x6) becomes a Don’t Care register. Each SCAN[15:0] bit defines a possible input channel for

the SCAN cycle, which corresponds to a certain selection of the analog multiplexer input channel and possibly a certain predefined gain of the ADC. The SCAN cycle will process and convert each channel that has been enabled (SCAN[n] = 1) with a defined order of priority from MSb to LSb (SCAN[15] to SCAN[0]). The list of channels with their corresponding inputs is defined in Table 5-15.

SCAN mode includes a configurable delay between each SCAN cycle, as well as a configurable delay between each conversion within a SCAN cycle. Each conversion within the SCAN cycle leads to a data ready interrupt and to an update of the ADCDATA register as soon as the current conversion is finished. The device does not include additional memory to retain all SCAN cycle A/D conversion results. Therefore, each result has to be read when it is available and before it is overwritten by the next conversion result.

TABLE 5-15:

SCAN MODE ENABLE AND SCAN CHANNEL SELECTION When using DATA_FORMAT[1:0] = 11, each channel conversion result in the SCAN sequence can be identified with a Channel ID (CH_ID[3:0]) code that will appear in the 4 MSbs of the ADCDATA register output value (Section 5.6 “ADC Output Data Format”). The Channel ID indicates the channel that sends the output data. Table 5-15 shows each possible Channel ID value and its associated channel.

Single-Ended Channel CH7 0111 0x78 None Single-Ended Channel CH6 0110 0x68 None Single-Ended Channel CH5 0101 0x58 None Single-Ended Channel CH4 0100 0x48 None Single-Ended Channel CH3 0011 0x38 None Single-Ended Channel CH2 0010 0x28 None Single-Ended Channel CH1 0001 0x18 None Single-Ended Channel CH0 0000 0x08 None SCAN[11:9] and SCAN[7:2] are not available for MCP3561R. Writing these bits has no effect. SCAN[11:10] and SCAN[7:4] are not available for MCP3562R. Writing these bits has no effect.

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MCP3561/2/4R

5.15.3 5.15.3.1 SCAN MODE INTERNAL RESOURCE CHANNELS

Analog Supply Voltage Reading (AV DD ) During the conversion that reads AV DD in SCAN mode, the multiplexer selection becomes 0x98 (AV DD -A GND ), which is equal to the analog power supply voltage. Since AV DD is the highest voltage available in the chip, when reading AV DD in SCAN mode, the gain of the ADC is automatically set to 1/3x, which maximizes the input full-scale range regardless of the GAIN[2:0] settings. This temporary internal configuration does not change the register settings, it only impacts the gain of the device during this conversion. With this fixed 1/3x gain, the ADC can measure the maximum specified analog supply voltage (AV DD = 3.6V) with a reference voltage as low as 1.2V.

5.15.3.2 The V CM reading is susceptible to the gain and offset errors of the ADC, which should be calibrated to obtain a precise internal Common-mode measurement.

5.15.4 DELAY BETWEEN CONVERSIONS

WITHIN A SCAN CYCLE (DLY[2:0]) While the ADC and multiplexer are optimized to switch from one channel to another instantaneously, it may not be the case of an application that requires additional settling time to overcome the transition. The device can insert an additional delay between each conversion of the SCAN cycle. The delay value is controlled by the DLY[2:0] bits located in the SCAN register (SCAN[23:20]). See Table 5-16.

TABLE 5-16:

Temperature Reading (TEMP)

DELAY BETWEEN CONVERSIONS WITHIN A SCAN CYCLE DLY[2:0] Delay Value (DMCLK Periods)

111 512 110 256 101 128 100 64 011 32 Offset Reading (OFFSET) 010 16 During the conversion that reads OFFSET in SCAN mode, the differential MUX output is shorted to A GND (internally). The Offset Reading varies from part to part, and over AV DD and temperature. The reading of this offset value can be used for the device offset calibration or tracking of the offset value in applications.

001 8 000 0 During the conversion that reads TEMP in SCAN mode, the multiplexer selection becomes 0xDE, which enables the two temperature diode sensors at each input of the ADC. During the temperature reading, the ADC gain is automatically set to 1x regardless of the GAIN[2:0] settings. This temporary internal configuration does not change the register setting, it only impacts the gain of the device during this conversion.

5.15.3.3 There is no automatic offset calibration in the device, so the user has to manually write the opposite (signed value) of the offset measured into the OFFSETCAL register to effectively cancel the offset on the subsequent outputs.

5.15.3.4 V CM Reading (V CM ) During the conversion that reads V CM , the device monitors the internal Common-mode voltage of the device in order to ensure proper operation.

The delay is only added in between two conversions of the same SCAN cycle. There is no delay added at the end or the beginning of each SCAN cycle due to the DLY[2:0] settings. During this delay, the ADC is internally kept in Standby mode (ADC_MODE[1:0] = 10 internally, but the ADC_MODE[1:0] bits are always read as ‘11’ through the SPI interface). The analog multiplexer switches to the next selected input at the end of each conversion (i.e., at the beginning of the added delay, so that the application has additional time to settle properly).

The V CM voltage of the device should be located at 1.2V ± 2% to ensure proper accuracy. With this setting, the internal multiplexer setting becomes 0xF8 (V CM – A GND ). In order to properly measure V CM , the reference voltage must be larger than 1.2V. During the V CM reading, the gain of the ADC is set to 1x regardless of the GAIN[2:0] settings. This temporary internal configuration does not change the register setting, it impacts the gain of the device during this conversion.

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5.15.5 DELAY BETWEEN SCAN CYCLES

(TIMER[23:0]) During Continuous mode, SCAN cycles are processed continuously, one after another, separated by a time delay (T TIMER_SCAN ), which is defined by the TIMER register (address: 0x8) value. During this delay, the ADC is automatically placed into a power-saving mode (Standby or ADC Shutdown). The T TIMER_SCAN delay offers better power efficiency for applications which run a SCAN sequence periodically. Since the delay can be very long, it allows synchronous applications with very slow update rates without having to use an external timer. The TIMER register defines the time, T TIMER_SCAN , between cycles with a 24-bit unsigned value going from 0 to 16777215 DMCLK periods. Table 5-17 details the TIMER values with respect to the TIMER[23:0] code.

TABLE 5-17: TIMER DELAY VALUE

BETWEEN SCAN CYCLES TIMER[23:0] T TIMER_SCAN Delay

The internal TIMER counter will decrement from the T TIMER_SCAN value to 0 and launch the new SCAN cycle. If the T TIMER_SCAN value is greater than T ADC_SETUP (256 DMCLK periods), the device will enter ADC Shutdown mode (ADC_MODE is set to ‘00’ internally) at each end of a SCAN cycle. When the internal TIMER counter reaches 256, the device will start the ADC during a T ADC_SETUP time to be ready to convert when the internal counter reaches 0. If the T TIMER_SCAN value is less than T ADC_SETUP , the part will be placed in Standby mode between SCAN cycles (ADC_MODE is set to ‘10’ internally). ADC_MODE[1:0] bits in the CONFIG0 register can only be read as ‘11’ by the SPI interface during the entire SCAN cycle and between SCAN cycles.

5.16 A/D Conversion Automatic Reset and Restart Feature

When the A/D conversions are running, the user can change the device configuration through the SPI interface by writing any register. Some register settings directly impact the conversion results and lead to invalid ADC data if they are changed within a conversion. The device incorporates an automatic reset and restart feature for the A/D conversions to avoid these DS20006391C-page 64 invalid data. Some register writes with the SPI interface during a conversion will automatically reset and restart the A/D conversion with the new settings. The automatic reset and restart feature behavior depends on the register bits that are written by the SPI interface.

5.16.1 REGISTER BIT MODIFICATIONS

NOT CAUSING RESET/RESTART The first group of bits will not generate any reset and restart. This group is composed of all the unused bits, all the read-only bits and some digital settings, such as CONV_MODE[1:0], DATA_FORMAT[1:0], CRC_FORMAT, EN_CRCCOM, IRQ_MODE[0], EN_FASTCMD, EN_STP and LOCK[7:0] bits.

5.16.2 REGISTER BIT MODIFICATIONS

CAUSING IMMEDIATE RESET/RESTART The second group of bits generates a reset and a restart. The reset is immediate, the restart is only valid after a period of two MCLK periods (necessary to handle the reset and ensures that the restart is synchronous with the master clock). This group is composed of settings that do not induce an analog operating point change. This group includes: ADC_MODE[1:0], PRE[1:0], OSR[3:0], GAIN[2:0], AZ_MUX, EN_OFFCAL, EN_GAINCAL, IRQ_MODE[1:0], MUX[7:0] and DLY[2:0] bits. The EN_OFFCAL, EN_GAINCAL and IRQ_MODE[1:0] bits generate the reset and restart only if they are changed to a new value. An overwrite of the same value has no effect. In SCAN mode, the reset and restart feature will just restart the current conversion for this group of bits; the SCAN cycle is not modified and not restarted. The MUX[7:0] bits can be changed within SCAN mode without generating a reset and a restart since this register is a Don’t Care during SCAN mode. The DLY[2:0] bits can be changed during the MUX mode without generating a reset and restart since these bits are Don’t Care during the MUX mode. The OFFSETCAL[23:0] and GAINCAL[23:0] only generate a reset and a restart when written if their corresponding enable bit (EN_OFFCAL, EN_GAINCAL) is enabled. The ADC_MODE[1:0] bits generate an immediate reset and restart but only if they are overwritten with ‘11’ (in any other case, the conversions are stopped). Depending on the part being in MUX or SCAN mode, the reset and restart feature will reset the conversion or the complete SCAN cycle.

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MCP3561/2/4R

5.16.3 REGISTER BIT MODIFICATIONS

CAUSING DELAYED RESET/RESTART A third group of bits will generate a reset and a restart that induce a new start-up delay (T ADC_SETUP ), so that the internal analog operating points can be settled with the new settings before the new conversion is started. The reset is immediate; the start-up timer is only restarted after a period of two MCLK periods (necessary to handle the reset and to ensure that the restart is synchronous with the master clock). Overall, the delay from the reset to the actual restart of the conversion with the new settings is then 2 MCLK + T ADC_SETUP . This group includes: CONFIG0 and the RESERVED registers at addresses 0xB and 0xC. The CONFIG0 bits induce a start-up timer delay only if they are changed to a new value. If they are overwritten with the same value, they will generate an immediate reset and restart. In SCAN mode, the reset and restart feature will just restart the current conversion for this group of bits, the SCAN cycle is not modified and not restarted. This third group of bits will induce a start-up timer delay, even when ADC_MODE[1:0] = 10 or if the ADC is in Standby mode.

Depending on the phase between the AMCLK and the SPI commands, the 2-MCLK delay can turn into a 4-MCLK delay to ensure the proper synchronization of the device. If very precise synchronization is required, it is recommended to not change the register configurations (i.e., not during conversions) or to use the EN_STP = 1 setting so that the start of the conversions can be clearly determined. In MUX mode, the TIMER and SCAN registers do not generate a reset and restart when written, except if the SCAN register is modified to effectively enter in SCAN mode. In this case, the MUX mode is superseded by the SCAN mode immediately. In SCAN mode, a write access of the SCAN register, during or between conversions within the SCAN cycle, will create a reset and restart of the whole SCAN sequence. Within the same conditions, a write access on the TIMER register will not create a reset and restart of the entire SCAN sequence. However, during the T TIMER_SCAN delay between SCAN cycles, a write on the SCAN register does not generate a reset and a restart of the entire sequence. Within the same conditions, a write on the TIMER register generates a reset and a restart of the entire sequence.

During the reset and restart sequence, the reset is immediate and resets the internal phases to the original state, which can lead to a discontinuity in the clock output frequency if the AMCLK clock output is enabled. The restart is synchronous with the AMCLK generation and is effective only after two MCLK periods. The restart also generates a conversion start pulse (only after the two MCLK periods or the 2 MCLK + T ADC_SETUP necessary for the restart) if enabled, for the user to be able to align the system with the exact start of the new conversion.

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NOTES:

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6.0 SPI SERIAL INTERFACE AND DEVICE OPERATION

6.1 Overview

The MCP3561/2/4R devices use an SPI interface to read and write the internal registers. The device includes a four-wire (CS, SCK, SDI, SDO) serial SPI interface that is compatible with SPI Modes 0,0 and 1,1. Data are clocked out of the device on the falling edge of SCK and data are clocked into the device on the rising edge of SCK. In these modes, the SCK clock can Idle either high (1,1) or low (0,0). The digital interface is asynchronous with the MCLK clock that controls the ADC sampling and digital filtering. All digital input pins are Schmitt Triggered to avoid system noise perturbations on the communications. The SPI interface is maintained in a reset state during POR. Each SPI communication starts with a CS falling edge and stops with the CS rising edge. Each SPI communication is independent. When CS is logic high, SDO is in high-impedance, the transitions on SCK and SDI have no effect. Changing from SPI Mode 1,1 to an SPI Mode 0,0 and vice versa is possible and must be done while the CS pin is logic high. Any CS rising edge clears the communication and resets the SPI digital interface. See Figure 1-1 for the SPI timing details. The MCP3561/2/4R digital interface is capable of handling various Continuous Read and Write modes, which allows for ADC data streaming or full register map writing within only one communication (and therefore, with only one unique command byte). It also includes single byte Fast commands. The device does not include a Master Reset pin, but it includes an SPI Fast command to be able to fully reset the part at any time and place it back in a default configuration. The device family also includes advanced security features to secure communication and alert users of unwanted Write commands that change the desired configuration. To secure the entire configuration, the device includes an 8-bit lock code (LOCK[7:0]), which blocks all Write commands to the full register map if the value of the lock code is not equal to a defined password (0xA5). The user can protect its configuration by changing the LOCK[7:0] value to 0x00 after full programming, so that any unwanted Write command will not result in a change in the configuration. Each SPI read communication can be secured through a selectable CRC-16 checksum provided on the SDO pin at the end of every communication sequence. This checksum computation is compatible with the DMA CRC hardware of the PIC24 and PIC32 MCUs, as well as many other MCU references, resulting in no additional overhead for the added security.

processed through a CRC-16 calculation engine and give a CRC-16 checksum that depends on the configuration. This checksum is readable from the CRC register and updated when MCLK is running. If there is a change in the checksum, a CRC interrupt generates a flag to warn the user that the configuration has been corrupted. The MCP3561/2/4R devices also include additional digital signal pins, such as a dedicated IRQ interrupt output pin and a Master Clock (MCLK) input/output pin, which allow easier synchronization and faster interrupt handling, facilitating the implementation of the device in many different applications.

6.2 SPI Communication Structure

The MCP3561/2/4R interface has a simple communication structure. Every communication starts with a CS falling edge and stops with a CS rising edge. The communication is always started by the COMMAND byte (8 bits) clocking on the SDI input. The COMMAND byte defines the command that will be executed by the digital interface. It includes the device address, the register address bits and the command-type bits. The COMMAND byte is typically followed by data bytes clocked on SDI if the command type is a write and on SDO if the command type is a read. The COMMAND byte can also define a Fast command, and in this case, it is not followed by any other byte. The following subsections detail the COMMAND byte structure and all possible commands. During the COMMAND byte clocking on SDI, a STATUS byte is also propagated on the SDO output to enable easy polling of the device status. During this time, the interface is full-duplex, but the part can still be used by MCUs handling only half-duplex communications if the STATUS byte is ignored.

6.2.1 COMMAND BYTE STRUCTURE The COMMAND byte fully defines the command that will be executed by the part. This byte is divided into three parts: the device address bits (CMD[7:6]), the command address bits (CMD[5:2]) and the command-type bits (CMD[1:0]). See Table 6-1.

TABLE 6-1: COMMAND BYTE CMD[7] CMD[6] CMD[5] CMD[4] CMD[3] CMD[2] CMD[1] CMD[0] Device Address

Bits Register Address/Fast Command

Bits Command Type

Bits Once the part is locked (write-protected), an additional checksum calculation also runs continuously in the background to ensure the integrity of the full register map. All writable registers of the register map are  2020-2021 Microchip Technology Inc. DS20006391C-page 67

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6.2.2 DEVICE ADDRESS BITS (CMD[7:6]) The SPI interface of the MCP3561/2/4R devices is addressable, which means that multiple devices can communicate on the same SPI bus with only one Chip Select line for all devices. Each device communication starts by a CS falling edge, followed by the clocking of the device address (CMD[7:6]). Each device contains an internal device address which the device can respond to. This address is coded on two bits, so four possible addresses are available. Device address is hard-coded within the device and should be determined when ordering the device. The device address is part of the device markings to avoid potential confusion (see Sections 9.1 “Package Marking Information (1) ”). When the CMD[7:6] bits match the device address, the communication will proceed and the part will execute the commands defined in the control byte and its subsequent data bytes. When the CMD[7:6] bits do not correspond to the address hard-coded in the device, the command is ignored. In this case, the SDO output will become high-impedance, which prevents bus contention errors when multiple devices are connected on the same SPI bus (see Figure 6-2). The user has to exit from this communication through a CS rising edge to be able to launch another command.

TABLE 6-2:

6.2.3 COMMAND ADDRESS BITS

(CMD[5:2]) The COMMAND byte contains four address bits (CMD[5:2]) that can serve two purposes. In case of a register write or read access, they define at which register address the first read/write is performed. In case of a Fast command, they determine which Fast command is executed by the device. In case of a Write command on a read-only register, the command is not executed and the communication should be aborted (CS rising edge) to place another command. All registers can be read; there is no undefined address in the register map.

6.2.4 COMMAND-TYPE BITS (CMD[1:0]) The last two bits of the COMMAND register byte define the command type. These bits are an extension of the typical read/write bits present in most SPI communication protocols. The two bits define four possible command types: Incremental Write, Incremental Read, Static Read and Fast command. Changing the command type within the same communication (while CS is logic low) is not possible. The communication has to be stopped (CS rising edge) and restarted (CS falling edge) to change its command type. The list of possible commands, their type and their possible command addresses are described in Table 6-2.

MCP3561/2/4R

6.2.5 FAST COMMANDS DESCRIPTION There are five possible Fast commands available for the MCP3561/2/4R devices. For each command, only the COMMAND byte has to be provided on the SPI port and the command is executed right after the COMMAND byte has been clocked. The Fast command codes are detailed in Table 6-2. All undefined command address codes for Fast commands will be ignored and will have no effect. SDO will stay in high-impedance after the COMMAND byte for a Fast command until a CS rising edge is provided. The Fast commands can be enabled or disabled by placing the EN_FASTCMD bit in the IRQ register to ‘1’ (default). Disabling Fast commands can increase the security of the device because it can avoid the execution of unwanted Fast commands, which can be useful in harsh environments. The ADC Start/Restart command (command address: ‘1010’) overwrites the ADC_MODE[1:0] bits to ‘11’, creating a conversion start (or a restart if the conversion was already running). The ADC Standby mode command (command address: ‘1011’) overwrites the ADC_MODE[1:0] bits to ‘10’ and places the ADC in Standby mode. The ADC Shutdown mode command (command address: ‘1100’) overwrites the ADC_MODE[1:0] bits to ‘00’ and places the ADC in ADC Shutdown mode. The Full Shutdown mode command (command address: ‘1101’) overwrites the CONFIG0 register to 0x00 and places the device in Full Shutdown mode (see Section 5.10 “Low-Power Shutdown Modes” for a full description of this mode). The Full Reset command (command address: ‘1110’) resets the device and places the entire register map into its default state condition, including the non writable registers. The only difference with a POR event is that the POR_STATUS bit in the IRQ register is set to ‘1’ after a Full Reset and is reset to ‘0’ after a POR event. The user can only clear the ADC Data Output register to its default value by using the Full Reset command.

6.2.6 DEVICE ADDRESS AND STATUS

BYTE DURING CONTROL BYTE During the COMMAND byte clocking on the SDI pin, the SDO pin displays a STATUS byte to help the user retrieve quick interrupt status information.

The STATUS byte structure is described in Figure 6-1.

STAT[7] STAT[6] STAT[5] STAT[4] STAT[3] STAT[2] STAT[1] STAT[0] 0 0 DEV_ADDR [1] DEV_ADDR [0] DEV_ADDR [0] DR_ST ATUS CRCCFG_ ST ATUS POR_ST ATUS Device Address Acknowledge bits FIGURE 6-1:

Interrupt Status bits

STATUS Byte.

The first two bits are always equal to ‘0’ and SDO toggles to ‘0’ as soon as a CS pin falling edge is performed. This allows having an application with multiple devices, with different device addresses, sharing one common SPI bus and avoiding bus contention during STATUS byte clocking. The next three bits of the STATUS byte give a confirmation (Acknowledge) of the hard-coded device address. If the device address of the command byte and the internal device address of the chip match, these three bits will be transmitted and they are equal to:

The STAT[3] bit allows the user to distinguish the SDO output from a High-Impedance state (device address not matched), as the bits, STAT[4] and STAT[3], are complementary and will induce a deterministic toggle on the SDO output. If the two device address bits are not matched with the internally hard-coded device address bits, SDO is maintained in a High-Impedance state during the rest of the communication and the command is ignored. This behavior avoids potential bus contention errors if multiple devices with different device addresses share the same SPI bus. After the transmission of the first two bits, only one device responds to the command (all other devices with non-matching device addresses keep the SDO in high-impedance). In this case, the user needs to abort the communication (CS rising edge) in order to perform another command. The three LSbs of the STATUS byte are the three Interrupt Status bits: • STAT[2] = DR_STATUS (ADC data ready interrupt

status)

error on the register map interrupt status)

The STATUS byte allows fast polling of the different interrupts without having to read the IRQ register. However, it requires an MCU that can communicate in Full-Duplex mode (SDI and SDO are clocked at the same time). For MCUs that are only half-duplex, and for devices that do not incorporate a separate IRQ pin, or for applications that do not connect the existing IRQ pin, the polling of the IRQ status can still be done by reading the IRQ register continuously.

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These three Interrupt Status bits are independent of the two other interrupt mechanisms (IRQ pin and IRQ register) and are cleared each time the STATUS byte is fully clocked. This enables the polling on the STATUS byte as a possible interrupt management solution without requiring to connect the IRQ pin in the system. All Status bit values are latched together just after the device address has been correctly recognized by the chip. Any interrupt happening after the two first Status bits have been clocked out will appear in the STATUS byte of the subsequent communication sequence.

Figure 6-2 represents the beginning of each communication with both COMMAND and STATUS bytes depicted. After the STATUS byte is propagated, the SDO pin will be placed in high-impedance for Fast commands or Write commands and will transfer data bytes for Read commands as long as the CS pin stays logic low.

Device Latches SDI on Rising Edge CS

Device Latches SDO on Falling Edge SPI Mode 1,1

SCK SDO High-Z Device Address does not Match

CMD[7:6] CMD[0] CMD[1] CMD[2] CMD[3] Device Address ACK DR_ STATUS 0 CMD[6] Device Address Matches CMD[7:6] CMD[6] High-Z CMD[7] SDO Command

Type Register Address CRCREG_ STATUS POR_ STATUS Device Address CMD[4] CMD[5] Don’t Care CMD[6] SDI CMD[7] SPI Mode 0,0 Interrupts Status High-Z

0 FIGURE 6-2: SPI Communication Start (COMMAND on SDI and STATUS on SDO) when the Device Address Matches/Does Not Match CMD[7:6].

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6.3 Writing to the Device

When the command type is Incremental Write (CMD[1:0] = 10), the device enters Write mode and starts writing the first data byte to the address given in the CMD[5:2] bits.

CONFIG0 (0x1)

CONFIG1 (0x2)

CONFIG2 (0x3) After the STATUS byte has been transferred, SDO stays in a High-Impedance state during an Incremental Write communication. Writing to a read-only address (such as addresses 0x0 or 0xF) has no effect and does not increment the Address Pointer. The user must stop the communication and restart a communication with a COMMAND byte pointing to a writable address (0x1 to 0xD).

CONFIG3 (0x4)

IRQ (0x5)

MUX (0x6)

SCAN (0x7)

TIMER (0x8) Each register is effectively written after receiving the last bit for the register (SCK last rising edge). Any CS rising edge during a write communication aborts the current writing. In this case, the register being written will not be updated and will keep its old value.

OFFSETCAL (0x9)

GAINCAL (0xA)

Reserved (0xB) The registers may need 8, 16 or 24 bits to be effectively written, depending on their address (see Table 8-1). After each register is written, the Address Pointer is automatically incremented as long as CS stays logic low. When the Address Pointer reaches 0xD, the next register to be written is the 0x1 register (see Figure 6-3 for a graphical representation of the address looping). Internal registers located at addresses, 0xB, 0xC and 0xE, should be kept to their default state at all times for proper operation. These are reserved registers and should not be modified.

Reserved (0xC)

LOCK (0xD)

Reserved (0xE)

FIGURE 6-3: Incremental Write Loop.

The Incremental Write feature can be used in order to fully configure the part using a unique communication which can save time in the application. This unique communication can end at address 0xD so that the user can also lock the configuration when written, providing additional security in the application (see Sections 6.6 “Locking/Unlocking Register Map Write Access”). Figure 6-4 shows an example of a write communication in detail with a single register write. Figure 6-5 shows an example of an Incremental Write communication.

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CS Device Latches SDI on Rising Edge DATA<0> DATA<1> DATA<2> DATA<3> DATA<4> DATA<5> DATA<6> DATA<7> DATA<8> DATA<9> DATA<10> DATA<11> DATA<12> DATA<13> DATA<14> DATA<15> DATA<16> DATA<17> DATA<18> DATA<19> DATA<20> DATA<21> DATA<22> 0 1 DATA<23> Don’t care High-Z POR _

STA TUS CMD<2> CMD<3> CMD<6> C RC R EG_ STA TUS CMD<4> 0 0 0 D R_

STA TUS CMD<5> High-Z CMD<6> SDO CMD<6> Don’t care CMD<7> SDI CMD<7> SCK SPI Mode 0,0; Example with a 24-Bit Wide Register Located at Address CMD<5:2> CS Device Latches SDI on Rising Edge DATA<1> DATA<2> DATA<3> DATA<4> DATA<5> DATA<6> DATA<7> DATA<8> DATA<9> DATA<10> DATA<11> DATA<12> DATA<13> DATA<14> DATA<15> DATA<16> DATA<17> DATA<18> DATA<19> DATA<20> DATA<21> 1 C RC R EG_

STA TUS DATA<22> CMD<2> D R_

STA TUS DATA<23> CMD<3> CMD<6> 0 0 DATA<0> Don’t care High-Z POR _

STA TUS CMD<4> 0 0 CMD<6> High-Z CMD<5> SDO CMD<7> Don’t care CMD<6> SDI CMD<7> SCK A<6> SPI Mode 1,1; Example with a 24-Bit Wide Register Located at Address CMD<5:2>

FIGURE 6-4: Single Register Write Communication (CMD[1:0] = 10) Timing Diagram.

CS ADDRESS SET 0x1 Depends on ADDR SCK 8x SDI COMMAND BYTE Depends on ADDR + 1 ... 8x 8x 8x ... 8x ...

Don’t care CMD<7:6> + ADDR +10 ADDR ADDR + 1 ... ADDR = 0xD ADDR = 0x1 Complete WRITE Sequence

Complete WRITE Sequence

Complete WRITE Sequence Roll-over SDO Hi-Z 00xxxxxx Hi-Z

0 Depends on IRQ Status and Device Address

FIGURE 6-5:

DS20006391C-page 72 Multiple Register Write within One Communication Using Incremental Write Feature.

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6.4 Reading from the Device

When the Command bit, CMD[0], is equal to ‘1’, the command is a read communication. After the STATUS byte has been transferred, the first register to be read on the SDO pin is the one with the address defined by the Command Address bits (CMD[5:2]). Any CS rising edge during a read communication aborts the current reading. The registers may need 4, 8, 16, 24 or 32 bits to be fully read depending on their address (see Table 8-1). If the CMD[1:0] bits are equal to ‘11’, the command type is Incremental Read. In this case, after each register is read, the Address Pointer is automatically incremented as long as CS stays logic low. The following data bytes are read from the next address sequentially defined in the register map. When the Address Pointer reaches 0xF (last register in the register map for reading), the next register to read is register 0x0 (see Figure 6-6 for a graphical representation of the address looping).

will continuously read the same register. Reading another register is only possible by aborting the current communication sequence by raising CS and issuing another command. In both Static and Incremental modes, the registers are updated after each register read is fully performed. If the value of the register changes internally during the read, it will only be updated after the end of the read. The value of each register is latched in the SDO Output Shift register at the first rising edge of SCK of each individual register reading. Figure 6-7 shows the bit by bit details of a single register Read communication. Figure 6-8 shows the examples of Static and Incremental Read communications.

ADCDATA (0x0)

CONFIG0 (0x1)

CONFIG1 (0x2)

CONFIG2 (0x3)

CONFIG3 (0x4)

IRQ (0x5)

MUX (0x6)

SCAN (0x7)

TIMER (0x8)

OFFSETCAL (0x9)

GAINCAL (0xA)

Reserved (0xB)

Reserved (0xC)

LOCK (0xD)

Reserved (0xE)

CRCREG (0xF)

FIGURE 6-6: Incremental Read Loop. If the CMD[1:0] bits are equal to ‘01’, the command type is Static Read. In this case, the register address defined in the COMMAND byte is read continuously. The Address Pointer is automatically incremented. Continuously clocking SCK while CS stays logic low  2020-2021 Microchip Technology Inc. DS20006391C-page 73

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CS Device Latches SDI on Rising Edge Device Latches SDO on Falling Edge DATA<0> DATA<1> DATA<2> DATA<3> DATA<4> DATA<5> DATA<6> DATA<7> DATA<8> DATA<9> DATA<10> DATA<11> DATA<12> DATA<13> DATA<14> DATA<15> DATA<16> DATA<17> POR _ STA TUS DATA<18> CMD<1> C RC R EG_

STA TUS DATA<19> CMD<2> DR_

ST ATUS DATA<20> CMD<3> CMD<6> DATA<23> DATA<21> CMD<4> 0 0 0 Don’t Care DATA<22> CMD<5> 1 CMD<6> High-Z CMD<6> SDO Don’t Care CMD<7> SDI CMD<7> SCK Don’t Care High-Z SPI Mode 0,0 ; Example with a 24-Bit Wide Register Located at Address CMD<5:2> CS Device Latches SDI on Rising Edge Device Latches SDO on Falling Edge DATA<1> DATA<2> DATA<3> DATA<4> DATA<5> DATA<6> DATA<7> DATA<8> DATA<9> DATA<10> DATA<11> DATA<12> DATA<13> DATA<14> DATA<15> DATA<16> DATA<17> DATA<18> DATA<19> DATA<20> DATA<21> CMD<1> C RC R EG_

STA TUS DATA<22> CMD<2> DR_

ST ATUS A<6> Don’t Care DATA<23> CMD<3> CMD<6> 1 POR _

STA TUS CMD<4> 0 0 CMD<6> 0 CMD<5> High-Z CMD<7> SDO Don’t Care CMD<6> SDI CMD<7> SCK DATA<0> High-Z SPI Mode 1,1; Example with a 24-Bit Wide Register Located at Address CMD<5:2>

FIGURE 6-7:

DS20006391C-page 74 Single Read SPI Communication (Static or Incremental Read).

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CS SCK SDI Depends on ADDR 8x Don’t Care Depends on

ADDR COMMAND

BYTE ... Depends on ADDR ... ADDR Don’t Care CMD[7:6] + ADDR + 01 SDO High-Z 00XXXXXX ADDR Depends on IRQ status

and device address Complete READ

sequence ADDR 0 Static Read Sequence CS

ADDRESS SET 0x0 SCK Depends on ADDR 8x Depends on ADDR+1 ... Depends on Data Format 16x 8x ... 16x ...

ADDR SDI Don’t Care COMMAND BYTE Don’t Care ...

CMD[7:6] + ADDR + 11 Complete READ sequence 0xF

Roll-over SDO High-Z 00XXXXXX ADDR ADDR + 1 ... ADDR = 0xF ADDR = 0x0 ADDR = 0x1 ... ADDR = 0xF

0 Depends on IRQ status

and device address Complete READ sequence Complete READ sequence

Incremental Read Sequence

FIGURE 6-8: Static and Incremental Read SPI Communications.

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MCP3561/2/4R

If the COMMAND byte defines a static read of the ADCDATA register (address: 0x0), the ADC data will be present on SDO and will be updated continuously at each read. In this case, when a data ready interrupt occurs within a read, the data are not corrupted and will be updated to a new value after the old value has been completely read. The ADC register contains a double buffer that prevents data from being corrupted while reading it. The part is able to stream output data continuously with no additional command if the communication is not stopped with a CS rising edge. Figure 6-9 represents the continuous streaming of incoming ADCDATA through the SPI port with both SPI Modes 0,0 and 1,1.

CS The falling edge after Read Start clears the DR interrupt on IRQ pin Device latches SDI on rising edge The falling edge after Read Start clears the DR interrupt on IRQ pin Device latches SDO on falling edge R/W 1 D ATA1 <31> D ATA1 <28 > D ATA0 <31 > D ATA1 <29 > D ATA0 <0> D ATA0 <1> D ATA0 <2> D ATA0 <3> D ATA0 <4> D ATA0 <5> D ATA0 <6> D ATA0 <7> D ATA0 <8> D ATA0 <9> D ATA0 <10 > D ATA0 <11 > D ATA0 <12 > D ATA0 <13 > D ATA0 <14 > D ATA0 <15 > D ATA0 <16 > D ATA0 <17 > D ATA0 <18 > D ATA0 <19 > D ATA0 <20 > D ATA0 <21 > D ATA0 <22 > D ATA0 <23 > D ATA0 <24 > D ATA0 <25 > D ATA0 <26 > D ATA0 <27 > D ATA0 <28 > D ATA0<31 > D ATA0 <29 > D ATA0 <30 > Read Start 1 1 0 CMD<6> CMD<6> Hi-Z CMD<7> 0 SDO 0 Read Start D ATA1 <30 > A<0> 0 A<1> 0 A<2> 0 A<3> 0 A<4> 0 Don’t care CMD<6> A<5> SDI CMD<7> A<6> SCK SDO changes synchronously with the IRQ

falling edge (DR interrupt flag) only when MSB is present on SDO IRQ DR Interrupt

(DATA1 is ready)

SPI Mode 0,0; ADC Data Format: 32-Bit CS The falling edge after Read Start clears the DR interrupt on IRQ pin Device latches SDI on rising edge The falling edge after Read Start clears the DR interrupt on IRQ pin Device latches SDO on falling edge R/W Don’t care 1 IRQ D ATA1 <28 > D ATA1 <29 > D ATA0<0> D ATA1 <30 > D ATA0 <1> D ATA0 <2> D ATA0 <3> D ATA0 <4> D ATA0 <5> D ATA0 <6> D ATA0 <7> D ATA0 <8> D ATA0 <9> D ATA0 <10 > D ATA0 <11 > D ATA0 <12 > D ATA0 <13 > D ATA0 <14 > D ATA0 <15 > D ATA0 <16 > D ATA0 <17 > D ATA0 <18 > D ATA0 <19 > D ATA0 <20 > D ATA0 <21 > D ATA0 <22 > D ATA0 <23 > D ATA0 <24 > D ATA0 <25 > D ATA0 <26 > D ATA0 <27 > D ATA0 <28 > D ATA0 <29 > D ATA0 <30 > Read Start D ATA0 <31 > 1 1 0 CMD<6> Hi-Z CMD<6> CMD<7> 0 SDO 0 Read Start D ATA1 <31 > A<0> 0 A<1> 0 A<2> 0 A<3> 0 A<4> 0 Don’t care CMD<6> A<5> SDI CMD<7> A<6> SCK DR Interrupt (DATA1 is ready) SPI Mode 1,1; ADC Data Format: 32-Bit

FIGURE 6-9:

DS20006391C-page 76 Continuous ADC Read (Data Streaming) with SPI Mode 0,0 and 1,1.

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

For continuous reading of ADCDATA in SPI Mode 0,0, once the data have been completely read after a data ready interrupt, the SDO pin takes the MSb value of the previous data at the end of the reading (falling edge of the last SCK clock). If SCK stays Idle at logic low (by definition of Mode 0,0), the SDO pin will be updated at the falling edge of the next data ready pulse (synchronously with the IRQ pin falling edge with an output timing of t DODR ) with the new MSb of the data corresponding to the data ready pulse. This mechanism allows the device to continuously read ADC data outputs seamlessly, even in SPI Mode (0,0). In SPI Mode (1,1), the SDO pin stays in the last state (LSb of previous data) after a complete reading, which also allows seamless Continuous Read mode. The ADC output data can only be properly read after a t DODR time, after the data ready interrupt comes on the IRQ pin. The t DODR timing is shorter than the time necessary to input a command on the SDI pin, which ensures proper reading when a new Read command is triggered by the data ready interrupt. In case of continuous reading (with CS pin kept logic low), the t DODR timing must be carefully handled by the MCU, but in general, the interrupt service time is much longer than the t DODR timing. Retrieving a data ready interrupt by reading the STATUS byte or reading the IRQ register automatically ensures that the t DODR timing is respected.

6.5 Securing Read Communications through CRC-16 Checksum

Since some applications can generate or receive large EMI/EMC interferences and large transient spikes, it is helpful to secure SPI communications as much as possible, to maintain data integrity and desired configurations during the application’s lifetime. The communication data on the SDO pin can be secured through the insertion of a Cyclic Redundancy Check (CRC) checksum at the end of each read sequence. The CRC checksum on communications can be enabled or disabled through the EN_CRCCOM bit in the CONFIG3 register. The CRC message ensures the integrity of the read sequence bits transmitted on the SDO pin.

When enabled, the CRC checksum (CRCCOM[15:0]) is propagated on SDO after each read communication sequence. In case of a Static Read command, the checksum is propagated after each register read. In case of an Incremental Read command, the checksum is propagated after the last register read in the register map (address: 0xF). Figure 6-11 and Figure 6-12 show typical read communications in Static Read and Incremental Read modes, respectively, when the EN_CRCCOM bit is enabled. Since the STATUS byte is propagated on SDO, it is part of the first message, and therefore, it is included in the calculation of the first checksum. For subsequent checksum calculations, the message only contains the registers that are effectively read in between two checksums. The CRC-16 format displayed on the SDO pin depends on the CRC_FORMAT bit in the CONFIG3 register (see Figure 6-10). It can have a 16-bit or 32-bit format to be compatible with both 16-bit and 32-bit MCUs. The CRCCOM[15:0] bits calculated by the device do not depend on the format (the device always calculates a 16-bit only CRC checksum).

(Default)

CRCCOM[15:0]

FIGURE 6-10: Communications.

0x0000

CRC Format Table for Read The CRC calculation computed by the device is fully compatible with the CRC hardware contained in the Direct Memory Access (DMA) of the PIC24 and PIC32 MCU product lines. The CRC message that should be considered in the PIC ® device DMA is the concatenation of the read sequence and its associated checksum. When the DMA CRC hardware computes this extended message, the resulted checksum should be 0x0000. Any other result indicates that a miscommunication has occurred and that the current communication sequence should be stopped and restarted.

The CRC checksum in the MCP3561/2/4R devices uses the 16-bit CRC-16 ANSI polynomial as defined in the IEEE 802.3 standard: x 16 + x 15 + x 2 + 1. This polynomial can also be noted as 0x8005. CRC-16 detects all single and double-bit errors, all errors with an odd number of bits, all burst errors of 16 bits in length or less and most errors for longer bursts. This allows an excellent coverage of the SPI communication errors that can occur in the system, and heavily reduces the risk of a miscommunication, even under noisy environments.

 2020-2021 Microchip Technology Inc. DS20006391C-page 77

MCP3561/2/4R

CS SCK Depends on ADDR 8x 16x or 32x Depending on CRC format Depends on

ADDR 16x or 32x Depending on CRC format ...

ADDRESS SET ADDR

Roll-over SDI Don’t Care COMMAND BYTE Don’t Care CRC Checksum CMD[7:6] + ADDR + 01 SDO High-Z

0 STATUS BYTE ADDR Complete READ sequence including STATUS Byte

= First Message for CRC Calculation FIGURE 6-11:

CRC Checksum ADDR CRC Checksum First checksum New message New checksum ...

SPI Static Read with Communication CRC Enabled.

CS

ADDRESS SET 0x0 SCK 8x Depends on ADDR Depending on ADDR+1 ... 16x 16x or 32x Depending on CRC format Depends on Data Format 8x ... 24x 16x or 32x Depending on CRC format ...

ADDR SDI Don’t Care COMMAND BYTE Don’t Care ...

CMD[7:6] + ADDR + 11 Complete READ sequence 0xF

Roll-over SDO High-Z

0 STATUS BYTE ADDR ADDR + 1 ...

Complete READ sequence including STATUS Byte

= First Message for CRC Calculation FIGURE 6-12:

DS20006391C-page 78 ADDR = 0xF CRC Checksum ADDR = 0x0 First Checksum ADDR = 0x1 New Message ... ADDR = 0xF CRC Checksum CRC Checksum (not part of register map)

New Checksum

SPI Incremental Read with Communication CRC Enabled.

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

6.6 Locking/Unlocking Register Map Write Access

The MCP3561/2/4R digital interface includes an advanced security feature that allows locking or unlocking the register map write access. This feature prevents the miscommunication that can corrupt the desired configuration of the device, especially an SPI read becoming an SPI write because of the noisy environment. The last register address of the incremental write loop (0xD: LOCK) contains the LOCK[7:0] bits. If these bits are equal to the password value (0xA5), the register map write access is not locked. Any write can take place and the communications are not protected. The devices are, by default after POR, in an unlocked state

When the LOCK[7:0] bits are not equal to 0xA5, the register map write access is locked. The register map, and therefore, the full device configuration is writeprotected. Any write to an address other than 0xD will yield no result. All the register addresses, except the address 0xD, become read-only. In this case, if the user wants to change the configuration, the LOCK[7:0] bits have to be reprogrammed back to 0xA5 before sending the desired Write command. The LOCK[7:0] bits are located in the last register of the Incremental Write address loop, so the user can program the entire register map, starting from 0x1 to 0xD, within one continuous write sequence and then lock the configuration at the end of the sequence by writing all zeros (for example) in the 0xD address.

6.7 Detecting a Configuration Change through CRC-16 Checksum on the Register Map and its Associated Interrupt Flag

In order to prevent internal corruption and to provide additional security on the register map configuration, the MCP3561/2/4R devices include an automatic and continuous CRC checksum calculation on the full register map Configuration bits. This calculation is not the same as the communication CRC checksum described in Section 6.5 “Securing Read Communications through CRC-16 Checksum”. This calculation takes the contents of the register map, from addresses 0x1 to 0xF, and produces a checksum which is held in the CRCCFG[15:0] bits located in the CRCCFG register (address: 0xF). The CRC checksum for the register map uses the 16-bit CRC-16 ANSI polynomial as defined in the IEEE 802.3 standard: x 16 + x 15 + x 2 + 1.

 2020-2021 Microchip Technology Inc.

Since this feature is intended to protect the configuration of the device, this calculation is run continuously only when the register map is locked (LOCK[7:0]), which is different than 0xA5 (see Section 6.6 “Locking/Unlocking Register Map Write Access”). If the register map is unlocked (for example after POR), the CRCCFG[15:0] bits are cleared and no CRC is calculated. The DR_STATUS, CRCCFG_STATUS and POR_STATUS bits are set to ‘1’ (default) and the CRCCFG[15:0] bits are set to ‘0’ (default) for this calculation, as they could vary and lead to unwanted CRC errors. After the DR_STATUS, CRCCFG_STATUS and POR_STATUS bits are cleared (with a read on the IRQ register), the CRC checksum on the register map can be verified by reading all registers in an incremental read sequence and by using the CRC communication. At the second incremental read loop, the checksum provided by the CRC communication must be equal to all zeros if the checksum on the register map is correct. The checksum will be calculated for the first time in 11 DMCLK periods. This first value will then be the reference checksum value and will be latched internally until an unlocking of the register map occurs. The checksum will then be calculated continuously every 11 DMCLK periods and checked against the reference checksum. If the checksum is different than the reference, an interrupt flag will be generated on the CRCCFG_STATUS bit within the STATUS byte on SDO, on the CRCCFG_STATUS bit in the IRQ register and on the IRQ output pin. The interrupt flag is maintained on all three mechanisms until the register map write access is unlocked. When the part write access is unlocked, the interrupt on the IRQ pin clears immediately and the two other interrupt mechanisms are cleared when the interrupt is read (read STATUS byte or read IRQ register). The CRC interrupt can occur even if the IRQ pin is configured as the MDAT modulator output. In this case, the interrupt stays present and forces a logic low output on this pin as long as the LOCK[7:0] register is locked (LOCK[7:0] 0xA5). At power-up, the interrupt is not present and the register map is unlocked. As soon as the user finishes writing its configuration, the user needs to lock the register map (for example, by writing 0x00 in the LOCK bits) to be able to use the interrupt flag and to calculate the checksum of the register map.

DS20006391C-page 79

MCP3561/2/4R

6.8 Interrupts Description

The MCP3561/2/4R devices incorporate multiple interrupt mechanisms to be able to synchronize the device with an MCU and to warn against external perturbations. There are four events that can generate interrupt flags:

Additionally, there are three independent interrupt mechanisms that allow the devices to be implemented in many different applications and configurations. A summary of the different mechanisms is available in Table 6-3.

• Conversion Start • Data Ready • POR • CRC Error on the Register Map Configuration

TABLE 6-3: INTERRUPT DESCRIPTION SUMMARY TABLE

Interrupt Flag Type

STATUS Byte IRQ Register Status

Bits IRQ Pin State DS20006391C-page 80 Description Clearing Procedure

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MCP3561/2/4R

6.8.1 CONVERSION DATA READY

INTERRUPT 3.

The data ready interrupt happens when a new conversion is ready to be read on the ADCDATA register. This event happens synchronously with DMCLK and at each end of conversion. This interrupt is implemented with three different and independent mechanisms: STATUS byte on SDO, IRQ register Status bit, and IRQ pin state. 1.

STATUS byte on SDO. When the interrupt occurs on the next STATUS byte transmitted on SDO, the DR_STATUS bit will be logic low. Once the STATUS byte has been transmitted, the DR_STATUS bit appears as ‘1’ until a new interrupt is present. If the interrupt occurs between two STATUS byte transmissions, the DR_STATUS bit on SDO will appear as equal to ‘0’ on the second reading. IRQ register Status bit. When the interrupt occurs, the DR_STATUS bit in the IRQ register is set to ‘0’. Once the IRQ register has been fully read, this DR_STATUS bit is reset to ‘1’. If the interrupt occurs between two readings of the IRQ register, the IRQ register Status bit appears as equal to ‘0’ on the second reading.

IRQ pin state. The interrupt generates an IRQ pin falling edge (transition to logic low) as soon as it happens. The data ready interrupt is cleared by the first of the following two events: • First falling edge of SCK during an ADC Output

Data register read • 16 DMCLK clock periods before current

conversion ends If the user does not read the ADCDATA register in time in Continuous Conversion mode or in SCAN mode, the IRQ pin will automatically reset to its Inactive state 16 DMCLKs periods prior to the new data ready interrupt. This feature is designed in order to avoid the case where the IRQ pin is logic low if the reading of ADC data is not performed. The user can then determine exactly when to expect the new data and can respect the t DODR timing in all cases to ensure a proper reading of the ADC data. See Figure 6-13 for more details.

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MCP3561/2/4R

6.8.2 CONVERSION CYCLE START

INTERRUPT This interrupt is the only selectable one and the only one not present in the STATUS byte on the SDO and IRQ registers. It is only available on the IRQ pin. The user can enable or disable this output by using: • [EN_STP] = 1: The conversion start interrupt

output is enabled (default). • [EN_STP] = 0: The conversion start interrupt

output is disabled.

ADC_MODE 00 ADC STATUS Sh u td o wn This interrupt marks the beginning of a conversion cycle. In case of a One-Shot mode or Continuous mode conversion in MUX mode, it marks the start of the sampling in the first conversion (after the ADC start-up delay of 256 DMCLK periods). In case of a SCAN mode, it marks the start of the sampling in the first conversion of the first SCAN mode cycle. The host MCU can utilize this interrupt to synchronize the start of the ADC conversion and manage synchronous events together with the conversion process (see Figure 6-14 for more details).

11 Sta rt-u p 1 st C o nv ers io n i n e ithe r MU X o r SC AN mo de T ADC_ SET UP T CON V

T ST P IRQ

Conversion Start IRQ

FIGURE 6-14: Conversion Start IRQ Timing Diagram.

This interrupt output generates a falling edge on the IRQ pin and is automatically cleared after a short period of time, T STP. 6.8.3 POR INTERRUPT The POR interrupt informs the user if a POR event has happened or if the part is in a POR state when the IRQ pin is used. This interrupt is implemented with three different and independent mechanisms: STATUS byte on SDO, IRQ register Status bit and IRQ pin state.

6.8.3.1 Data Ready

IRQ 6.8.3.2 IRQ Register Status Bit When the device has just powered up, the POR_STATUS bit in the IRQ register is set to ‘0’. Once the IRQ register has been fully read, this POR_STATUS bit is once again reset to ‘1’. If a POR event occurs between two readings of the IRQ register, the IRQ register Status bit will appear as equal to ‘0’ on the second reading. This mechanism can only work when the power supplies are back above the POR thresholds on the analog and digital cores.

STATUS Byte on SDO When the device has just powered up, on the first STATUS byte transmitted on SDO (first communication), the POR_STATUS bit is logic low. Once the STATUS byte has been transmitted, the POR_STATUS bit appears as ‘1’ until the part is powered down. If a POR event occurs between two STATUS byte transmissions, and if the part is properly repowered up, the POR_STATUS bit on SDO will appear as equal to ‘0’ on the latter reading. This mechanism can only work when the power supplies are back above the POR thresholds on the analog and digital cores, as retrieving data from the SPI port is not possible when the device is in POR state.

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MCP3561/2/4R

6.8.3.3 IRQ Pin State A Logic Low state is generated on the IRQ pin as soon as the AV DD or DV DD monitoring circuits detect a power supply drop below their specified threshold. This POR interrupt can only be cleared when both AV DD and DV DD are above their monitoring voltage thresholds. When this condition is met, the POR threshold is cleared by the CS falling edge. Therefore, it means that if a CS falling edge does not clear the IRQ pin state, the POR event is still in effect.

DV DD AV DD This feature helps the user to know exactly when the chip has powered up by polling with the CS pin and checking the IRQ pin state at power-up (see Figure 6-15 for more details). Since this is a high-level priority interrupt, the POR interrupt can happen at all times, even when MDAT is enabled. In this case, having a constant logic low bitstream can indicate a probable POR event (or a fully negative ADC saturation output code induced by a large negative input voltage).

V POR_A , V POR_D t POR

POR Internal State High-Z IRQ

0

t C SIR Q CS Don’t Care Chip Select

Starts Low Clears POR interrupt FIGURE 6-15:

6.8.4 POR IRQ Timing Diagram.

CRCCFG ERROR INTERRUPT The CRCCFG interrupt happens when an error in the CRC-16 checksum has been detected in the register map CRC calculation. This interrupt is implemented with three different and independent mechanisms: STATUS byte on SDO, IRQ register Status bit and IRQ pin state.

6.8.4.1 STATUS Byte on SDO In case of a CRCCFG error on the next STATUS byte transmitted on SDO, the CRCCFG_STATUS bit is logic low. Once the STATUS byte has been transmitted, the CRCCFG_STATUS bit appears as ‘1’ until a new interrupt occurs. If the error is detected again between two STATUS byte transmissions, the CRCCFG_STATUS bit on SDO will appear as equal to ‘0’ on the second reading.

6.8.4.2 IRQ Register Status Bit In case of a CRCCFG error, the CRCCFG_STATUS bit in the IRQ register is set to ‘0’. Once the IRQ register is fully read, the CRCCFG_STATUS bit is reset to ‘1’. If the CRCCFG error happens again between two readings of the IRQ register, the IRQ register Status bit will appear as ‘0’ on the second reading.

 2020-2021 Microchip Technology Inc.

6.8.4.3 IRQ Pin State The CRCCFG error generates a Logic Low state on the IRQ pin until it is cleared. The clearing of the CRCCFG error can only be made by “unlocking” the device (write 0xA5 in the LOCK[7:0] register) or by sending a Fast command start/restart ADC conversion. Unlocking the device stops the CRC calculation and clears the associated interrupt. Sending an ADC start/restart conversion Fast command resets the CRC calculation and clears the interrupt. This CRCCFG error can only occur in case of an external perturbation (for example, EMI induced) that causes the continuous calculation of the CRC on the register map to be erroneous or in case the chip integrity has been altered. Since both causes are high-priority issues, the CRCCFG error has priority over all other interrupts (except POR) and over the MDAT output on the IRQ pin.

Note: If MCLK starts running before the device is

locked, an interrupt can momentarily occur, even if registers have not been corrupted. In such a case, the user must send a start/restart conversion Fast command which will clear the unwanted interrupt and correctly restart the CRC calculations.

DS20006391C-page 83

MCP3561/2/4R

NOTES:

DS20006391C-page 84  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

7.0 BASIC APPLICATION CONFIGURATION

7.1

The MCP3561/2/4R devices can be used for various precision Analog-to-Digital Converter applications. The flexibility of its usage is given by the possibility of configuring the ADC to fit the required application.

R12 100 5% 0603 CH0 CH1 1 2 J1

Typical Application for Absolute Voltage Measurement

The MCP3561/2/4R is able to measure the signal provided by sensors with absolute voltage output. For such applications, the MCP3561/2/4R typically uses its internal voltage reference. For the best performance, an external capacitor is recommended on the REFIN+/OUT pin for noise filtering and to provide more stability for the internal voltage reference (See Section 3.1 “Differential Reference Voltage Inputs: REFIN+/OUT, REFIN-”).

Anti Aliasing Filters C6 0.1uF 16V 0603

GNDA C9 R6 100

0603 R5 5%

0603 5% CH2 CH3 100 100 R7 0603

5% 1 2 J5 CH4 CH5 100 0603 5% IRQ Pull-UP 16V 0603 5% R9 5% 100 100 0603 16V 19 3 GNDA 4 0.1uF 16V 0603 5 6 7 C7 0.1uF 16V 0603 1 2 J7

CH6 CH7 8 9 GNDA C8 R11 5%

100 0603 0603 C12 0.1uF C2 0.1uF 16V 0603 R17 C11 0.1uF GNDA

0.1uF 16V 0603 C5 R10 3.3D 10R 5% 0603 C3 C4 R8 ADC 3.3A R14 0.1uF 16V 0603 1 2 J3 0.1uF 16V 0603 10 0.1uF 16V 0603 0603

GNDA AVDD 3.3D

16V 0603 C14 0.1uF

GND 16V 0603 DVDD R22 10k 5% 0603 18

RA14/ADC_IRQ CH0 CH1 CH2 CH3 CH4 CH5 CH6 0603 R18 0603 R19 10R 5% 10R 5%

13 0603 R21 SDI 14 R16 10R 5% SDO 12 0603 R20 SCK 11 R15 10R CS

5% 0603 10R 5% 16 MCLK 15 IRQ/MDAT 10R 5% 0603 RD3/ADC_CLKIN RA14/ADC_IRQ RG8/ADC_MOSI2 RG7/ADC_MISO2 RG6/ADC_SCK2 RG9/ADC_CS2 CH7 2 REFIN+/OUT 1 REFIN20 C13 0.1uF 10R 5% 0603 AGND EP DGND 21 17 GNDA GND 0&35 GNDA C10 10uF 10V 0603 GNDA FIGURE 7-1: MCP3564R Application Example.

The ADC can be used in Differential or Single-Ended mode due to the internal dual multiplexer (Figure 5-1). The user can select the input connection settings from the MUX register (Section 8.7 “Multiplexer (MUX) Register”) by using the different settings available on the positive and negative inputs of the ADC. The single-ended configuration is achieved by selecting A GND for the V IN - input of the ADC (MUX[3:0] = 1000) or by selecting any CHn input channel for V IN - and connecting the corresponding CHn input channel to A GND .

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MCP3561/2/4R

7.1.1 HIGH-SIDE AND LOW-SIDE

CURRENT SENSING The ADC has the ability to perform differential measurements with analog input Common-mode equal to or slightly larger than AV DD , or equal to or slightly lower than A GND (see the Electrical Characteristics table). A differential input structure and a Kelvin connection are required in order to achieve the most accurate measurements. An anti-aliasing filter is required to avoid aliasing of the oversampling frequency (DMCLK) back into the baseband of the input signal and possible corruption of the output data. Figure 7-1 provides an example of an anti-aliasing filter. For the measurement of voltages that can reach AV DD or a few mV higher, a gain setting of 0.33x is useful since it increases the input range to a 3 x V REF value, so a 1.2V V REF will allow a theoretical input range of 3.6V. However, the maximum voltage that can be measured is always bounded by AV DD + 0.1V in order to limit excess leakage current at the input pins created by the ESD structures. Therefore, in order to properly measure 3.6V with a 1.2V voltage reference, it is recommended to use an AV DD supply voltage as close as possible to 3.6V.

7.1.2 THERMOCOUPLE CONNECTION One of the most used temperature transducers in the industry is the thermocouple. Thermocouples provide a voltage dependent on the temperature difference between cold junction and hot junction. This voltage is in the order of magnitude of tens of µV/°C, which requires amplification that can be provided by the internal gain stage of the ADC.

7.2 Typical Application for Ratiometric Voltage Measurement

A wide range of sensors provides an output voltage directly related to the power supply of the sensors. These sensors are known as ratiometric output. These sensors often have a Wheatstone bridge structure, such as pressure sensors or load cells (Figure 7-3).

R 1 RTD V IN + Input Signal REFIN+/OUT MCP3561R

V IN - REFINFIGURE 7-3: Wheatstone Bridge Ratiometric Connection.

Others act as a single resistor with a value dependent on temperature (pure metal resistance thermometer RTD and negative temperature coefficient resistor NTC). To accurately measure the signal from these sensors, REFIN+/OUT is usually connected to the same power supply of the sensor (Figure 7-4), as long as this respects the specified voltage range on the REFIN+/OUT pin (see the Electrical Characteristics table).

R 2 Sensor V IN +

Anti-aliasing

Filter REFIN+/OUT MCP3561R

V IN - REFINR 1 C 1 FIGURE 7-4:

FIGURE 7-2: to MCP3561R.

C 2 A GND D GND RTD Ratiometric Connection.

Thermocouple Connection The connection of the thermocouple to the ADC requires minimal extra components. A differential input structure is recommended. The cold junction can be measured by using a digital temperature sensor like MCP9804 connected to the MCU. If high accuracy is not required, the cold junction temperature can be estimated directly with the internal temperature sensor of the ADC (see Figure 7-2).

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MCP3561/2/4R

7.3 Power Supply Design and Bypassing

Another possibility, sometimes easier to implement in terms of PCB layout, is to consider the MCP3561/2/4R as an analog component, and therefore, connect AV DD to DV DD and A GND to D GND with a star connection. In this scheme, the decoupling capacitors may be larger, due to the ripple on the digital power supply (caused by the digital filters and the SPI interface of the MCP3561/2/4R) now causing glitches on the analog power supply.

In any system, the analog ICs (such as references or operational amplifiers) are always connected to the analog ground plane. The MCP3561/2/4R should also be considered a sensitive analog component and connected to the analog ground plane. The ADC features two pairs of power supply voltage pins: A GND and AV DD , D GND and DV DD . For best performance, it is recommended to keep the two pairs of pins connected to two different networks (see Figure 7-5), so that the design will feature two ground traces and two power supplies (see Figure 7-6).

Figure 7-6 shows an example of a power supply schematic with separate DV DD and AV DD . A high-current LDO (MCP1825) was used for the DV DD line to be able to power the MCU and other peripherals attached to the MCU. A high PSRR LDO (MCP1754) is used for the AV DD that goes to the ADC and a few other components sensitive to noise. The NET tie is used to separate D GND from A GND .

The analog circuitry (including MCP3561/2/4R) and the digital circuitry (MCU) should have separate power supplies and return paths to the external ground reference, as described in Figure 7-5. An example of a typical power supply circuit, with different paths for analog and digital return currents, is shown in Figure 7-6. A possible split example is shown in Figure 7-7, where the ground star connection can be located underneath the device with the exposed pad. The split between analog and digital can be done under the device, and AV DD and DV DD can be connected with lines coming under the ground plane. The two separate return paths will eventually share a unique connection point (star connection) in order to minimize coupling between the two power supply domains.

I D I A 0.1 ȝF 0.1 ȝF C

V A AV DD DV DD V D MCP356;5 MCU

D GND A GND

I A I D

“Star” Point D - = A - = FIGURE 7-5: Separating Digital and Analog Ground by Using a Star Connection.

U2 MCP1825S-3.3V VIN VOUT 3 C44 10 µF 5V_USB C15 10 µF TANT-B GND VOUT GND GND 2 U3 MCP1754-3.3V +5V USB +9V IN

1 VIN VOUT 3 3.3A 2 MRA4005 VIN 3 1

4 2 3

GND D1 GND TANT-B J9 1 1 3 2 Power Jack 2.5 mm U4 LM1117-5V GND 9V

J10 C10 0.1 µF TANT-B

0603 GND GND 3.3D C45 10 µF C11 0.1 µF 0603 2 1

GND 5V C14 0.1 µF 0603 GND Net Tie GND

GND GNDA GNDA C12 0.1 µF 0603

GNDA GNDA C13 10 µF TANT-B GNDA FIGURE 7-6: Power Supply with Separate Lines for Analog and Digital Sections (the “Net Tie” Object Represents the Star Ground Connection).

 2020-2021 Microchip Technology Inc. DS20006391C-page 87

MCP3561/2/4R

7.4 SPI Interface Digital Crosstalk

The MCP3561/2/4R devices incorporate a high-speed 20 MHz SPI digital interface. This interface can induce crosstalk, especially with the outer channels closer to the SPI digital pins (for example, CH7), if it is run at full speed without any precautions. The crosstalk is caused by the switching noise created by the digital SPI signals. This crosstalk would negatively impact the SNR in this case. The noise is attenuated if proper separation between the analog and the digital power supplies is put in place (see Sections 7.3 “Power Supply Design and Bypassing”).

FIGURE 7-7: Separation of Analog and Digital Circuits on the Layout (Shown on the UQFN Package). When remote sensors are used to reduce the sensitivity to external influences, such as EMI, the wires that connect the sensor to the ADC should form a twisted pair. Ferrite beads can be used between the digital and analog ground planes to keep high-frequency noise from entering the device. A low-resistance ferrite bead is recommended.

DS20006391C-page 88 In order to further remove the influence of the SPI communication on measurement accuracy, it is recommended to add series resistors on the SPI lines to reduce the current spikes caused by the digital switching noise (see Figure 7-1 where these resistors have been implemented). The resistors also help to keep the level of electromagnetic emissions low. The switching noise is also a linear function of the DV DD supply voltage. In order to further reduce the influence of the switching noise caused by SPI transmissions, the DV DD digital power supply voltage should be kept as low value as possible. The measurement graphs provided in this MCP3561/2/4R data sheet have been performed with 10 series resistors connected on each SPI I/O pin. Measurement accuracy disturbances have not been observed, even at 20 MHz interfacing.

 2020-2021 Microchip Technology Inc.

MCP3561/2/4R

8.0 INTERNAL REGISTERS

The MCP3561/2/4R devices have a total of 16 internal registers made of volatile memory. Table 8-1 includes a summary of the registers. These registers are sequentially accessible.

TABLE 8-1: INTERNAL REGISTERS SUMMARY Address Register Name No. of Bits R/W Description

MCP3561/2/4R

8.1 ADCDATA REGISTER

Name Bits Address Cof ADCDATA 4/24/32 0x0 R REGISTER 8-1: ADCDATA: ADC CHANNEL DATA OUTPUT REGISTER

R-0 ADCDATA[23:0] bit 23 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 23-0 x = Bit is unknown ADCDATA[23:0]: ADC Output code The data are post-calibration if the EN_OFFCAL or EN_GAINCAL bits are enabled. The data can be formatted in 24/32-bit modes depending on the DATA_FORMAT[1:0] settings (see Section 5.6 “ADC Output Data Format”). The ADC Channel Data Output registers always contain the most recent A/D conversion data. The register is updated at each data ready internal signal (it depends on the OSR and CONV_MODE settings). The register is latched at the start of each SPI Read command. The register is double buffered to avoid data loss. There is a small time delay, t DODR , after each data ready, where the user has to wait for the data to be available. Otherwise, data corruption can occur (when the internal data are refreshed). When IRQ_MODE[1:0] = 1x, this register becomes a 4-bit wide register containing the MDAT output codes, which are the outputs of the modulator that are represented by four comparator outputs (COMP[3:0], see Section 5.4.2 “Modulator Output Block”).

DS20006391C-page 90  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

8.2 CONFIG0 REGISTER

Name Bits Address Cof CONFIG0 8 0x1 R/W

REGISTER 8-2: CONFIG0 REGISTER

R/W-1 R/W-1 VREF_SEL CONFIG0[6] R/W-0 R/W-0 R/W-0

CLK_SEL[1:0] R/W-0 R/W-0 CS_SEL[1:0] R/W-0 ADC_MODE[1:0] bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 VREF_SEL: Internal Voltage Reference Bit

1 = Internal voltage reference is selected and buffered internally. REFIN+/OUT pin voltage is set at

2.4V (default). 0 = External Voltage reference is selected and not buffered internally. The internal voltage reference

buffer is shut down. bit 6 CONFIG0[6]: If CONFIG0 = 0x0, the device goes into Partial Shutdown mode. This bit does not have

any other function. bit 5-4 CLK_SEL[1:0]: Clock Selection

11 = Internal clock is selected and AMCLK is present on the analog master clock output pin. 10 = Internal clock is selected and no clock output is present on the CLK pin. 01 = External digital clock 00 = External digital clock (default) bit 3-2 CS_SEL[1:0]: Current Source/Sink Selection Bits for Sensor Bias (source on V IN+ /Sink on V IN- )

11 = 15 A is applied to the ADC inputs 10 = 3.7 A is applied to the ADC inputs 01 = 0.9 A is applied to the ADC inputs 00 = No current source is applied to the ADC inputs (default) bit 1-0 ADC_MODE[1:0]: ADC Operating Mode Selection

11 = ADC Conversion mode 10 = ADC Standby mode 01 = ADC Shutdown mode 00 = ADC Shutdown mode (default)

 2020-2021 Microchip Technology Inc. DS20006391C-page 91

MCP3561/2/4R

8.3 CONFIG1 REGISTER

Name Bits Address Cof CONFIG1 8 0x2 R/W

REGISTER 8-3:

R/W-0

CONFIG1: CONFIGURATION REGISTER 1

R/W-0 R/W-0 PRE[1:0] R/W-0 R/W-1 R/W-1 R/W-0

OSR[3:0] R/W-0 RESERVED[1:0] bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 PRE[1:0]: Prescaler Value Selection for AMCLK

00 = AMCLK = MCLK (default) bit 5-2 OSR[3:0]: Oversampling Ratio for Delta-Sigma A/D Conversion

bit 1-0 RESERVED[1:0]: Should always be set to ‘00’ DS20006391C-page 92 x = Bit is unknown  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

8.4 CONFIG2 REGISTER

Name Bits Address Cof CONFIG2 8 0x3 R/W

REGISTER 8-4:

R/W-1

CONFIG2: CONFIGURATION REGISTER 2

R/W-0 R/W-0 BOOST[1:0] R/W-0 R/W-1 GAIN[2:0] R/W-0 R/W-1 R/W-1 AZ_MUX AZ_REF RESERVED bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 BOOST[1:0]: ADC Bias Current Selection

11 = ADC channel has current x 2 10 = ADC channel has current x 1 (default) 01 = ADC channel has current x 0.66 00 = ADC channel has current x 0.5 bit 5-3 GAIN[2:0]: ADC Gain Selection

bit 2 AZ_MUX: Auto-Zeroing MUX Setting

1 = ADC auto-zeroing algorithm is enabled. This setting multiplies the conversion time by two and

does not allow Continuous Conversion mode operation (which is then replaced by a series of consecutive One-Shot mode conversions). 0 = Analog input multiplexer auto-zeroing algorithm is disabled (default). bit 1 AZ_REF: Auto-Zeroing Reference Buffer Setting

1 = Internal voltage reference buffer chopping algorithm is enabled. This setting has no effect when external voltage reference is selected (VREF_SEL = 0) (default). 0 = Internal voltage reference buffer chopping auto-zeroing algorithm is disabled. bit 0 RESERVED: Should always be equal to ‘1’  2020-2021 Microchip Technology Inc. DS20006391C-page 93

MCP3561/2/4R

8.5 CONFIG3 REGISTER

Name Bits Address Cof CONFIG3 8 0x4 R/W

REGISTER 8-5:

R/W-0 R/W-0 CONV_MODE[1:0]

CONFIG3: CONFIGURATION REGISTER 3

R/W-0 R/W-0 DATA_FORMAT[1:0] R/W-0 R/W-0 R/W-0 R/W-0 CRC_FORMAT EN_CRCCOM EN_OFFCAL EN_GAINCAL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 CONV_MODE[1:0]: Conversion Mode Selection

11 = Continuous Conversion mode or continuous conversion cycle in SCAN mode. 10 = One-shot conversion or one-shot cycle in SCAN mode. It sets ADC_MODE[1:0] to ‘10’ (standby) at

the end of the conversion or at the end of the conversion cycle in SCAN mode. 0x = One-shot conversion or one-shot cycle in SCAN mode. It sets ADC_MODE[1:0] to ‘0x’ (ADC

Shutdown) at the end of the conversion or at the end of the conversion cycle in SCAN mode (default). bit 5-4 DATA_FORMAT[1:0]: ADC Output Data Format Selection

11 = 32-bit (25-bit right justified data + Channel ID): CHID[3:0] + SGN extension (4 bits) + 24-bit ADC

data. It allows overrange with the SGN extension. 10 = 32-bit (25-bit right justified data): SGN extension (8-bit) + 24-bit ADC data. It allows overrange with

the SGN extension. 01 = 32-bit (24-bit left justified data): 24-bit ADC data + 0x00 (8-bit). It does not allow overrange (ADC

code locked to 0xFFFFFF or 0x800000). 00 = 24-bit (default ADC coding): 24-bit ADC data. It does not allow overrange (ADC code locked to

0xFFFFFF or 0x800000). bit 3 CRC_FORMAT: CRC Checksum Format Selection on Read Communications

(it does not affect CRCCFG coding) 1 = 32-bit wide (CRC-16 followed by 16 zeros).

bit 2 EN_CRCCOM: CRC Checksum Selection on Read Communications

(it does not affect CRCCFG calculations) 1 = CRC on communications enabled. 0 = CRC on communications disabled (default). bit 1 EN_OFFCAL: Enable Digital Offset Calibration

bit 0 EN_GAINCAL: Enable Digital Gain Calibration

DS20006391C-page 94  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

8.6 IRQ REGISTER

Name Bits Address Cof IRQ 8 0x5 R/W

REGISTER 8-6:

U-0 — R-1

IRQ: INTERRUPT REQUEST REGISTER

R-1 R-1 DR_STATUS CRCCFG_STATUS POR_STATUS R/W-0 R/W-0 IRQ_MODE[1:0] (1)

R/W-1 R/W-1 EN_FASTCMD EN_STP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6 DR_STATUS: Data Ready Status Flag

1 = ADCDATA has not been updated since last reading or last reset (default). 0 = New ADCDATA ready for reading. bit 5 CRCCFG_STATUS: CRC Error Status Flag Bit for Internal Registers

1 = CRC error has not occurred for the Configuration registers. (default) 0 = CRC error has occurred for the Configuration registers. bit 4 POR_STATUS: POR Status Flag

1 = POR has not occurred since the last reading (default). 0 = POR has occurred since the last reading. bit 3-2 IRQ_MODE[1:0]: Configuration for the IRQ/MDAT Pin (1)

IRQ_MODE[1]: IRQ/MDAT Selection 1 = MDAT output is selected. Only POR and CRC interrupts can be present on this pin and take priority

over the MDAT output. 0 = IRQ output is selected. All interrupts can appear on the IRQ/MDAT pin. IRQ_MODE[0]: IRQ Pin Inactive State Selection 1 = The Inactive state is logic high (does not require a pull-up resistor to DV DD ). 0 = The Inactive state is high-Z (requires a pull-up resistor to DV DD ) (default). bit 1 EN_FASTCMD: Enable Fast Commands in the COMMAND Byte

1 = Fast commands are enabled (default). 0 = Fast commands are disabled. bit 0 EN_STP: Enable Conversion Start Interrupt Output

Note 1: When IRQ_MODE[1:0] = 10 or 11, the modulator output codes (MDAT stream) are available at both the

MDAT pin and ADCDATA register (0x0).

 2020-2021 Microchip Technology Inc. DS20006391C-page 95

MCP3561/2/4R

8.7 MULTIPLEXER (MUX) REGISTER

Name Bits Address Cof MUX 8 0x6 R/W

REGISTER 8-7:

R/W-0 MUX: MULTIPLEXER REGISTER

1110 = Internal Temperature Sensor Diode M (Temp Diode M) (1) 1101 = Internal Temperature Sensor Diode P (Temp Diode P) (1)

1010 = Reserved (do not use)

Bit 3-0 MUX_VIN- Input Selection (2,3)

1110 = Internal Temperature Sensor Diode M (Temp Diode M) (1) 1101 = Internal Temperature Sensor Diode P (Temp Diode P) (1)

1010 = Reserved (do not use)

Note 1:

2:

3:

x = Bit is unknown Selects the internal temperature sensor diode and forces a fixed current through it. For a correct temperature reading, the MUX[7:0] selection should be equal to 0xDE. For MCP3562R, the codes, ‘0111/0110/0101/0100’, correspond to a floating input and should be avoided. For MCP3561R, the codes, ‘0111/0110/0101/0100/0011/0010’, correspond to a floating input and should be avoided.

DS20006391C-page 96  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

8.8 SCAN REGISTER

Name Bits Address Cof SCAN 24 0x7 R/W REGISTER 8-8:

R/W-0 SCAN: SCAN MODE SETTINGS REGISTER

R/W-0 R/W-0 DLY[2:0] R/W-0 U-0 RESERVED — bit 23 bit 16 R/W-0 R/W-0 R/W-0 R/W-0 OFFSET VCM AV DD TEMP R/W-0 R/W-0 R/W-0 R/W-0

SCAN_DIFF_CH[D:A] bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

SCAN_SE_CH[7:0] bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Bit 23-21 DLY[2:0]: Delay Time (T DLY_SCAN ) Between Each Conversion During a SCAN Cycle

Bit 20 RESERVED: Should be set to ‘0’ Bit 19-16 Unimplemented: Read as ‘0’ Bit 15-0 SCAN Channel Selection (see Table 5-15 for a complete description)

 2020-2021 Microchip Technology Inc. DS20006391C-page 97

MCP3561/2/4R

8.9 TIMER REGISTER

Name Bits Address Cof TIMER 24 0x8 R/W REGISTER 8-9: TIMER: TIMER DELAY VALUE REGISTER

R/W-0 TIMER[23:0] bit 23 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 23-0 x = Bit is unknown TIMER[23:0]: Selection Bits for the Time Interval (T TIMER_SCAN ) Between Two Consecutive SCAN Cycles

0xFFFFFF: T TIMER_SCAN = 16777215 * DMCLK periods 0xFFFFFE: T TIMER_SCAN = 16777214 * DMCLK periods • • • 0x000002: T TIMER_SCAN = 2 * DMCLK periods 0x000001: T TIMER_SCAN = 1 * DMCLK periods

DS20006391C-page 98  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

8.10 OFFSETCAL REGISTER

Name Bits Address Cof OFFSETCAL 24 0x9 R/W REGISTER 8-10: OFFSETCAL: OFFSET CALIBRATION REGISTER

R/W-0 OFFSETCAL[23:0] bit 23 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 23-0

8.11

x = Bit is unknown OFFSETCAL[23:0]: Offset Error Digital Calibration Code (two’s complement, MSb first coding) See Sections 5.13 “Digital System Offset and Gain Calibrations”.

GAINCAL REGISTER

Name Bits Address Cof GAINCAL 24 0xA R/W REGISTER 8-11: GAINCAL: GAIN CALIBRATION REGISTER

R/W-1 R/W-0

GAINCAL[23:0] bit 23 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 23-0 x = Bit is unknown GAINCAL[23:0]: Gain Error Digital Calibration Code (unsigned, MSb first coding) The GAINCAL default value is 800000, which provides a gain of 1x. See Section 5.13 “Digital System Offset and Gain Calibrations”.

 2020-2021 Microchip Technology Inc. DS20006391C-page 99

MCP3561/2/4R

8.12 RESERVED REGISTER

Name Bits Address Cof RESERVED 24 0xB R/W REGISTER 8-12: RESERVED REGISTER

R/W-0x900000 RESERVED[23:0] bit 23 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 23-0

8.13

x = Bit is unknown RESERVED[23:0]: Should be set to 0x900000

RESERVED REGISTER

Name Bits Address Cof RESERVED 8 0xC R/W REGISTER 8-13: RESERVED REGISTER

R/W-0x30 RESERVED[7:0] bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 7-0 x = Bit is unknown RESERVED[7:0]: Should be set to 0x30 DS20006391C-page 100  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

8.14 LOCK REGISTER Name Bits Address Cof LOCK 8 0xD R/W

REGISTER 8-14:

R/W-1

LOCK: SPI WRITE MODE LOCKING PASSWORD VALUE REGISTER

R/W-0 R/W-1 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1

LOCK[7:0] bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 7-0 8.15 x = Bit is unknown LOCK[7:0]: Write Access Password Entry Code 0xA5 = Write access is allowed on the full register map. CRC on register map values is not calculated

Any code except 0xA5 = Write access is not allowed on the full register map. Only the LOCK register is writable. CRC on register map is calculated continuously only when DMCLK is running.

RESERVED REGISTER Name Bits Address Cof RESERVED 16 0xE R/W

REGISTER 8-15: RESERVED REGISTER

R/W (default depends on product denomination)

RESERVED[15:0] bit 15 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 15-0 x = Bit is unknown RESERVED[15:0]: Should be set to MCP3561R: 0x000C MCP3562R: 0x000D MCP3564R: 0x000F  2020-2021 Microchip Technology Inc. DS20006391C-page 101

MCP3561/2/4R

8.16 CRCCFG REGISTER Name Bits Address Cof CRCCFG 16 0xF R

REGISTER 8-16: CRCCFG: CRC CONFIGURATION REGISTER

R-0 CRCCFG[15:0] bit 15 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared Bit 15-0 x = Bit is unknown CRCCFG[15:0]: CRC-16 Checksum Value CRC-16 checksum is continuously calculated internally based on the register map configuration settings when the device is locked (LOCK[7:0] ≠ 0xA5).

DS20006391C-page 102  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

9.0 PACKAGING INFORMATION

9.1 Package Marking Information (1)

20-Lead UQFN (3 x 3 x 0.55 mm)

PIN 1 Example

XXX YYWW NNN PIN 1 AAJ 2053 256

Part Number Code SPI Device Address MCP3561RT-E/NC AAJ 01 (2) MCP3562RT-E/NC AAK 01 (2) MCP3564RT-E/NC AAL 01 (2)

(3) 20-Lead TSSOP (6.5 x 4.4 x 1 mm) Example

XXXXXXXX XXXXXNNN MCP564R EST e 3 256 YYWW 2053

Legend: XX...X

YYY WW NNN e 3 * Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package.

Note 1: In the event the full Microchip part number cannot be marked on one line, it

will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2: Denotes the device default SPI Address option. The device only responds

to SPI commands if CMD[7:6] matches the SPI device address for each command (see Section 6.2.2, Device Address Bits (CMD[7:6])). Contact Microchip Sales for other device address option ordering procedure. 3: The 20-Lead TSSOP package allows up to 8 characters per line as shown

here. Currently only 7 characters are being used, as shown in the example.

 2020-2021 Microchip Technology Inc. DS20006391C-page 103

MCP3561/2/4R

20-Lead Ultra Thin Plastic Quad Flat, No Lead Package 1& - 3x3 mm Body [UQFN] (Formerly Q3DE; SST Legacy Package)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging D NOTE 1 A B N 1

2

E(DATUM B) (DATUM A) 2X

0.075 C 2X

TOP VIEW 0.075 C 0.10 C C SEATING

PLANE A1 A

20X (A3) SIDE VIEW 0.08 C 0.10 C A B D2 0.10 See Detail A C A B

e2 E2

2

1 NOTE 1 K

N

20X b

0.10 0.05 e C A B C BOTTOM VIEW

Microchip Technology Drawing C04-264A Sheet 1 of 2 DS20006391C-page 104  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

20-Lead Ultra Thin Plastic Quad Flat, No Lead Package 1& - 3x3 mm Body [UQFN] (Formerly Q3DE; SST Legacy Package)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging (b) b1 L DETAIL A Units Dimension Limits N Number of Terminals e Pitch A Overall Height Standoff A1 A3 Terminal Thickness Overall Length D Exposed Pad Length D2 E Overall Width E2 Exposed Pad Width b Terminal Width (Inner) b1 Terminal Width (Outer) L Terminal Length K Terminal-to-Exposed-Pad MIN 0.50 0.00 1.60 1.60 0.15 0.35 0.20 MILLIMETERS

NOM 20 0.40 BSC

0.55 0.02 0.15 REF 3.00 BSC

1.70 3.00 BSC

1.70 0.15 REF

0.20 0.40

• MAX 0.60 0.05 1.80 1.80 0.25 0.45

• Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-264A Sheet 2 of 2  2020-2021 Microchip Technology Inc. DS20006391C-page 105

MCP3561/2/4R

20-Lead Ultra Thin Plastic Quad Flat, No Lead Package 1& - 3x3 mm Body [UQFN] (Formerly Q3DE; SST Legacy Package)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging C1

X2 EV 20 ØV 1 2 C2 Y2 EV

G1 Y1 X1

E SILK SCREEN

RECOMMENDED LAND PATTERN

Units Dimension Limits Contact Pitch E X2 Optional Center Pad Width Optional Center Pad Length Y2 Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Width (X20) X1 Contact Pad Length (X20) Y1 Contact Pad to Center Pad (X20) G1 Thermal Via Diameter V Thermal Via Pitch EV MIN MILLIMETERS

NOM 0.40 BSC MAX 1.80 1.80 3.00 3.00

0.20 0.80 0.20

0.30 1.00 Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process Microchip Technology Drawing C04-2264A DS20006391C-page 106  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

 2020-2021 Microchip Technology Inc. DS20006391C-page 107

MCP3561/2/4R

DS20006391C-page 108  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging  2020-2021 Microchip Technology Inc. DS20006391C-page 109

MCP3561/2/4R

NOTES:

DS20006391C-page 110  2020-2021 Microchip Technology Inc.

MCP3561/2/4R

APPENDIX A: REVISION HISTORY Revision C (April 2021) The following is the list of modifications: • Updated package size for TSSOP. • Updated references to Effective Resolution throughout the document. • Updated Section 9.0 “Packaging Information”. • Minor editorial corrections. Revision B (December 2020) The following is the list of modifications: • Updated Section 5.10.2 “Partial Shutdown Mode”. • Updated Section 8.2 “CONFIG0 Register”. Note: The SPI standard uses the terminology “Master” and “Slave.” The equivalent Microchip terminology used in this document is “Host” and “Client,” respectively. Revision A (August 2020) • Initial release of this document.

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MCP3561/2/4R

NOTES:

 2020-2021 Microchip Technology Inc. DS20006391C-page 112

MCP3561/2/4R

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office .

PART NO. X (1)

Device Tape and

Reel X /XX

Temperature

Range Package

Examples:

a) MCP3561RT-E/NC:

Device: MCP3561/2/4R: One/Two/Four Differential Channel,

High-Precision 24-bit Delta-Sigma ADCs with SPI device address ‘01’.

Tape and Reel: T = Tape and Reel

Blank = Standard packaging (tube or tray)

Temperature Range:

E

b) MCP3562RT-E/NC:

c) MCP3564RT-E/NC:

ST = = -40°C to +125°C (Extended)

Ultra Small, No Lead Package (UQFN), 3 x 3 x 0.55 mm, 20-Lead Plastic Thin Shrink Small Outline (TSSOP), 6.5 x 4.4 x 1 mm, 20-Lead d) MCP3561RT-E/ST:

e) MCP3562R-E/ST:

f) MCP3564R-E/ST:

Note  2020-2021 Microchip Technology Inc.

Single-Channel ADC Tape and Reel, Extended Temperature, 20LD UQFN. Dual-Channel ADC Tape and Reel, Extended Temperature, 20LD UQFN. Quad-Channel ADC Tape and Reel, Extended Temperature, 20LD UQFN. Single-Channel ADC Tape and Reel, Extended Temperature, 20LD TSSOP. Dual-Channel ADC Standard Packaging, Extended Temperature, 20LD TSSOP. Quad-Channel ADC Standard Packaging, Extended Temperature, 20LD TSSOP.

1: Tape and Reel identifier only appears in the

catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2: Device SPI Address ‘01’ is the default

address option. Contact Microchip Sales for other device address option ordering procedure.

DS20006391C-page 113

MCP3561/2/4R

NOTES:

DS20006391C-page 114  2020-2021 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specifications contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip

devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip's intellectual property rights.

• Microchip is willing to work with any customer who is concerned about the integrity of its code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not

mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications.

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE.

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.

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