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TMAG5170 SBASAF4 – SEPTEMBER 2021

TMAG5170 High-Precision 3D Linear Hall-Effect Sensor With SPI

1 Features 3 Description

• The TMAG5170 is a high-precision linear 3D Hall-

effect sensor designed for a wide range of industrial and personal electronics applications. The high level of integration offers flexibility and accuracy in a variety of position sensing systems. This device features 3 independent Hall sensors at X, Y, and Z axes. •

• • • •

•

• •

• • High-precision linear 3D Hall-effect sensor to optimize position sensing speed and accuracy: – Linear measurement total error: ±2.6%

(maximum at 25°C) – Sensitivity temperature drift: ±2.8% (maximum) – 20-Ksps conversion rate for single axis 10-MHz serial peripheral interface (SPI) with cyclic redundancy check (CRC) Built-in temperature sensor with < ±2°C error Independently selectable X, Y, and Z magnetic ranges:

5-nA (typical) deep sleep mode current Autonomous wake-up and sleep mode for threshold detection consuming only 1.5 µA ALERT function to initiate sensor conversion or indicate conversion complete Integrated diagnostics for fault detection Integrated angle CORDIC calculation with gain and offset adjustment 2.3-V to 5.5-V supply voltage range Operating temperature range: –40°C to +150°C

2 Applications

Robotic arm sensors Mobile robot motor control Proximity sensors Linear motor position sensors Servo drive position sensors Actuators Robotic lawnmowers Vacuum robots Washer & dryers Door & window sensor VDD/VIO SDO µController ALERT CS SCK GND The TMAG5170 can be configured through the SPI to enable any combination of magnetic axes and temperature measurements. Multiple sensor conversion schemes and SPI read frames help optimize throughput and accuracy. A dedicated ALERT pin can act as a system interrupt during low power wake-up and sleep mode, and can also be used by a microcontroller to trigger a new sensor conversion.

The device is offered in two different orderables to support wide magnetic fields ranges from ±25mT to ±300mT.

VCC SDI Integrated angle calculation engine (CORDIC) provides full 360° angular position information for both on-axis and off-axis angle measurement topologies. The angle calculation is performed using two user-selected magnetic axes. The device features magnetic gain and offset correction to mitigate the impact of system mechanical error sources.

The TMAG5170 offers multiple diagnostics features to detect and report both system and device-level failures. The SPI communication features a userenabled cyclic redundancy check to enhance the data integrity.

2.3V to 5.5V TMAG5170 • • • • • • • • • • A precision signal-chain along with an integrated 12- bit ADC enables high accuracy and low drift magnetic field measurements while supporting a sampling of up to 20 ksps. On-chip temperature sensor data is available for system-level drift compensation.

TEST The device performs consistently across a wide ambient temperature range of –40°C to +150°C.

Device Information (1) PART NUMBER TMAG5170

(1)

PACKAGE VSSOP (8)

BODY SIZE (NOM)

For all available packages, see the package option addendum at the end of the data sheet. Application Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

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Table of Contents

1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings ....................................... 4 6.2 ESD Ratings .............................................................. 4 6.3 Recommended Operating Conditions ........................4 6.4 Thermal Information ...................................................4 6.5 Electrical Characteristics ............................................5 6.6 Magnetic Characteristics ............................................6 6.7 Power up Timing ...................................................... 10 6.8 SPI Interface Timing .................................................10 6.9 Typical Characteristics.............................................. 11 7 Detailed Description......................................................15

7.1 Overview................................................................... 15 7.2 Functional Block Diagram......................................... 15 7.3 Feature Description...................................................15 7.4 Device Functional Modes..........................................22 7.5 Programming............................................................ 25 7.6 Register Map.............................................................33 8 Application and Implementation.................................. 45

8.1 Application Information............................................. 45 8.2 Typical Application.................................................... 48 8.3 Do's and Don'ts.........................................................50 9 Power Supply Recommendations................................51 10 Layout...........................................................................51

10.1 Layout Guidelines................................................... 51 10.2 Layout Example...................................................... 52 11 Device and Documentation Support..........................53

11.1 Receiving Notification of Documentation Updates.. 53 11.2 Support Resources................................................. 53 11.3 Trademarks............................................................. 53 11.4 Electrostatic Discharge Caution.............................. 53 11.5 Glossary.................................................................. 53 12 Mechanical, Packaging, and Orderable

Information.................................................................... 53

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

2 DATE REVISION NOTES September 2021 * Initial Release Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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5 Pin Configuration and Functions

SCK 1 8 ALERT SDI 2 7 TEST SDO 3 6 GND CS 4 5 VCC Not to scale

Figure 5-1. DGK Package 8-Pin VSSOP Top View

(1) I = input, O = output, I/O = input and output, G = ground, P = power Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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6 Specifications

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SDO, ALERT V OH Output HIGH voltage, SDO pin I OUT = -2mA V CC –0.4 V CC V V OL Output LOW voltage, SDO pin I OUT = 2mA 0 0.4 V V OL Output LOW voltage, ALERT pin I OUT = 2mA 0 0.4 V t FALL_ALERT ALERT output fall time R PU =10KΩ, C L =20pF, V CC =2.3V to 5.5V 50 ns t ALERT ALERT output pulse width with conversion complete or threshold cross interrupt event

Trigger Mode 5 µs

t ALERT ALERT output pulse width with other interrupt events ALERT_MODE =0b, Interrupt & Trigger Mode 31 µs I OZ Output Leakage current, ALERT pin ALERT pin disabled, V OZ = 5.5V 30 nA 2.1 V DC Power V VCC_UV Under voltage threshold at VCC V VCC_OV Over voltage threshold at VCC 5.9 V I ACT Active mode current from VCC CS high, VCC = 5.5V 3.4 mA I STDBY Stand-by mode current from VCC CS high, VCC = 5.5V 840 µA I CFG Configuration mode current from VCC CS high, VCC = 5.5V 60 µA I SLP Sleep mode current from V CC CS high, VCC = 5.5V 1.5 µA I DEEP_SLP Deep sleep mode current from VCC CS high, VCC = 5.5V 5 nA Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Average Power I VCC_DCM Data active rate 1000Hz, V VCC = 5V Duty-cycle mode current consumption, Data active rate 100Hz, V VCC = 5V one channel enabled, CONV_AVG = Data active rate 10Hz, V VCC = 5V 000

Data active rate 1Hz, V VCC = 5V 245 µA 32 µA 4.5 µA 1.5 µA Data active rate 1000Hz, V VCC = 5V 292 µA Duty-cycle mode current consumption, Data active rate 100Hz, V VCC = 5V two channels enabled, CONV_AVG = Data active rate 10Hz, V VCC = 5V 000

Data active rate 1Hz, V VCC = 5V 39 µA 5 µA 1.6 µA

OPERATING_MODE =010, only one channel enabled (2)

50 µs

OPERATING_MODE =010, only one channel enabled (3)

825 µs Operating Speed t measure Conversion time (1)

f HFOSC Internal high-frequency oscillator speed f LFOSC Internal low-frequency oscillator speed 3 3.2 3.5 MHz

13.5 16 19.5 KHz 170 ℃ 27 ℃ Temperature Sensing T SENS_RANGE Temperature sensing range –40 T SENS_T0 Reference temperature for TADC T0 23 TADC T0 TEMP_RESULT decimal value @ T

SENS_T0 TADC RES Temp sensing resolution NRMS (T) RMS (1 Sigma) temperature noise CONV_AVG = 101 0.06 ℃ NRMS (T) RMS (1 Sigma) temperature noise CONV_AVG = 000 0.35 ℃

(1)

(2) (3)

25

17522

58.2 60.0 61.8 LSB/℃ To calculate the time between conversion request and the availability of the conversion result, add the initialization time to the t measure as explained in Comparing Operating Modes Table. For continuous conversion, the initialization time is applicable only for the first conversion. Add 25µs for each additional channel enabled for conversion with CONV_AVG =000. For conversion with CONV_AVG =101, each axis data is collected 32 times. If an additional channel is enabled with CONV_AVG =101, add 32×25µs = 800µs to the t measure to calculate the conversion time for two axes.

6.6 Magnetic Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TMAG5170A1

SENS ER_25C_A1 Sensitivity error; X, Y, or Z axis, 25mT, T A = 25℃ 50mT range ±0.5% ±2.5% SENS ER_25C_A1 Sensitivity error; X, Y, or Z axis; 100mT T A = 25℃ range ±0.5% ±3.5% SENS DR_A1 (1) Sensitivity Drift from 25℃ value; X, Y, or Z axis; 25mT, 50mT range ±0.9% ±2.8% MAG_TEMPCO = 00b, T A = 25℃ to 125℃ Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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TYP MAX SENS DR_A1 (1) Sensitivity Drift from 25℃ value; X, Y, or Z axis; 25mT, 50mT range PARAMETER

TEST CONDITIONS

SENS DR_A1 (1) Sensitivity Drift from 25℃ value; X, Y, or Z axis; 25mT, 50mT range MAG_TEMPCO = 01b, 10b, 11b; T A = –40℃ to 125℃ ±1.2% ±3.8% SENS DR_A1 (1) Sensitivity Drift from 25℃ value; X, Y, or Z axis; 100mT range T A = 25℃ to 125℃ ±1.0% ±4.0% SENS DR_A1 (1) Sensitivity Drift from 25℃ value; X, Y, or Z axis; 100mT range T A = 25℃ to -40℃ ±1.2% ±4.6% SENS LDR_A1 Sensitivity Lifetime drift, X, Y, Z axis SENS LER_XY_A1 Sensitivity Linearity Error, X, Y-axis SENS LER_Z_A1 Sensitivity Linearity Error, Z axis SENS MS_XY_A1 Sensitivity mismatch among X-Y axes T A = 25℃ ±0.02% ±3.5% SENS MS_YZ_A1 Sensitivity mismatch among Y-Z axes T A = 25℃ ±0.17% ±4.5% SENS MS_XZ_A1 Sensitivity mismatch among X-Z axes T A = 25℃ ±0.15% ±4.0%

MIN UNIT ±0.5% ±0.1% T A = 25℃

±0.05%

B off_DR_A1 (1) Offset drift from 25℃ value; X or Y axis T A = 25℃ to 125℃ 0 ±5.0 µT/°C B off_DR_A1 (1) Offset drift from 25℃ value; Z axis T A = 25℃ to 125℃ 0 ±1.5 µT/°C B off_DR_A1 (1) Offset drift from 25℃ value; X or Y axis T A = 25℃ to –40℃ –6.5 –1.5 2.5 µT/°C B off_DR_A1 (1) Offset drift from 25℃ value; Z axis T A = 25℃ to –40℃ –3.0 –1.0 1.0 µT/°C B off_DR_A1 Offset Lifetime drift N RMS_XY_FAST_A1 RMS (1 Sigma) magnetic noise (X or Y-axis) x_RANGE

N RMS_XY_FAST_A1 RMS (1 Sigma) magnetic noise (X or Y-axis) x_RANGE

N RMS_XY_SLOW_A1 RMS (1 Sigma) magnetic noise (X or Y-axis) x_RANGE

N RMS_XY_SLOW_A1 RMS (1 Sigma) magnetic noise (X or Y-axis) x_RANGE

N RMS_Z_FAST_A1 RMS (1 Sigma) magnetic noise (Z axis) Z_RANGE = 00b; CONV_AVG = 000b, T

A = 25℃ 61 76 µT

N RMS_Z_FAST_A1 RMS (1 Sigma) magnetic noise (Z axis) Z_RANGE = 00b; CONV_AVG = 000b, T

A = 125℃ 70 84 µT

N RMS_Z_SLOW_A1 RMS (1 Sigma) magnetic noise (Z axis) Z_RANGE = 00b; CONV_AVG = 101b, T

A = 25℃ 11 14.2 µT

N RMS_Z_SLOW_A1 RMS (1 Sigma) magnetic noise (Z axis) Z_RANGE = 00b; CONV_AVG = 101b, T

A = 125℃ 13 15.2 µT

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over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT A ERR_Y_Z_00_101_A1 Y-Z Angle error in full 360 degree (3) rotation, 25℃

A ERR_X_Z_00_101_A1 X-Z Angle error in full 360 degree (3) rotation, 25℃

A ERR_X_Y_00_101_A1 X-Y Angle error in full 360 degree (3) rotation, 25℃

TMAG5170A2 B IN_A2 Linear magnetic range SENS 150 _A2 SENS 75_A2 Sensitivity, X, Y, or Z axis SENS 300_A2

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PARAMETER TEST CONDITIONS TYP MAX

B off_DR_A2 (1) Offset drift from value at T A = 25℃; X or Y axis; 75mT, 150mT range T A = 25℃ to –40℃ –3.0 2.0 µT/°C B off_DR_A2 (1) Offset drift from value at T A = 25℃; Z axis; 75mT, 150mT range T A = 25℃ to –40℃ –0.4 ±5.0 µT/°C B off_DR_A2 (1) Offset drift from value at T A = 25℃; 300mT range T A = –40℃ to 125℃ ±2.5 ±12.0 µT/°C B off_DR_A2 Offset Lifetime drift

B off_A2 Offset; 75mT, 150mT range B off_A2 Offset; 300mT range B off_DR_A2 (1) Offset drift from value at T A = 25℃; X or Y axis; 75mT, 150mT range

B off_DR_A2 (1)

MIN –8.0 ±50 N RMS (X, Y) RMS (1 Sigma) magnetic noise (X or Y-axis) x_RANGE

N RMS (X, Y) RMS (1 Sigma) magnetic noise (X or Y-axis)

N RMS (X, Y)

UNIT

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over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE COMPENSATION TC Temperature compensation (no compensation) MAG_TEMPCO =00b 0 %/°C TC Temperature compensation (for NdBFe magnet) MAG_TEMPCO =01b 0.12 %/°C TC Temperature compensation (for SmCo MAG_TEMPCO =10b magnet) 0.03 %/°C (1)

(2) (3)

Drift at any temperature can be calculated from drift values at 125°C or –40°C. For example, drift at 85℃ = ((85 – 25) / (125 – 25)) ×

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PARAMETER TEST CONDITIONS MIN TYP MAX UNIT t pd_soen Delay time: Time delay from falling edge of CS to data valid at SDO 45 ns t pd_sodis Delay time: Time delay from rising edge of CS to SDO transition to tristate 55 ns t su_si SDI setup time: Setup time of SDI before the rising edge of SCK 25 ns t h_si Hold time: Time between the rising edge of SCK to SDI valid 25 ns t pd_so Propagation delay from falling edge of SCK to SDO t w_cs SPI transfer inactive time (time between two transfers) during which CS must remain high. t spi_sleep Setup time between CS going low and SCK start during sleep mode 45

ns

ns 8 10 µs

6.9 Typical Characteristics

100 200 RMS Noise (T)

75 50 −40C 0C 20C 85C 125C 150C 175

150 RMS Noise (T)

−40C 0C 20C 85C 125C 150C 25 125

100

75

50

25

0 0 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-1. Z-Axis Noise vs. Conversion Average, 25-mT Range 0 8 12 16 20

Conversion Average 24 28 32 Figure 6-2. X, Y-Axis Noise vs. Conversion Average, 25-mT

Range

100 200 50 25 −40C 0C 20C 85C 125C 150C 175

150 RMS Noise (T)

−40C 0C 20C 85C 125C 150C 75 RMS Noise (T)

4 125

100

75

50

25

0 0 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-3. Z-Axis Noise vs. Conversion Average, 50-mT Range 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-4. X, Y-Axis Noise vs. Conversion Average, 50-mT

Range Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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6.9 Typical Characteristics (continued)

100 200 RMS Noise (T)

75 50 −40C 0C 20C 85C 125C 150C 175

150 RMS Noise (T)

−40C 0C 20C 85C 125C 150C 25 125

100

75

50

25

0 0 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-5. Z-Axis Input vs. Conversion Average, 75-mT Range 0 8 12 16 20

Conversion Average 24 28 32 Figure 6-6. X, Y-Axis Noise vs. Conversion Average, 75-mT

Range

100 200 50 −40C 0C 20C 85C 125C 150C 175

150 RMS Noise (T)

−40C 0C 20C 85C 125C 150C 75 RMS Noise (T)

4 25 125

100

75

50

25

0 0 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-7. Z-Axis Noise vs. Conversion Average, 100-mT

Range 0 8 12 16 20

Conversion Average 24 28 32 Figure 6-8. X, Y-Axis Noise vs. Conversion Average, 100-mT

Range

100 200 50 25 −40C 0C 20C 85C 125C 150C 175

150 RMS Noise (T)

−40C 0C 20C 85C 125C 150C 75 RMS Noise (T)

4 125

100

75

50

25

0 0 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-9. Z-Axis Noise vs. Conversion Average, 150-mT

Range 12 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-10. X, Y-Axis Noise vs. Conversion Average, 150-mT

Range Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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6.9 Typical Characteristics (continued)

125 250 RMS Noise (T)

100 75 50 25 100 0 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-11. Z-Axis Noise vs. Conversion Average, 300-mT

Range 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-12. X, Y-Axis Noise vs. Conversion Average, 300-mT

Range 0.2 4500 4000 0.1 3500 0 3000 -40 0 4 8 12 16 20

Conversion Average 24 28 32 Figure 6-13. Temperature Sensor Noise vs. Conversion Average

Average I RMS Noise 150 50 0 -20 0 20 40 60 80 100

Temperature [C] 120 140 160 Figure 6-14. Active Mode Supply Current vs. Temperature

Average

Average −40C 0C 20C 85C 125C 150C 200 RMS Noise (T)

−40C 0C 20C 85C 125C 150C 500

100 0 -40 -20 0 20 40 60 80 100

Temperature [C] 120 140 160 Figure 6-15. Standby Mode Supply Current vs. Temperature 0 -40 -20 0 20 40 60 80 100

Temperature [C] 120 140 160 Figure 6-16. Configuration Mode Supply Current vs.

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6.9 Typical Characteristics (continued)

5

Average I CC (A)

4 3 2 1 0 -40 1 1

0.8 0.8

0.6 0.6

0.4

0.2

0

-0.2

-0.4 20 40 60 80 100

Temperature [C] 120 140 160 0.4

0.2

0

-0.2

-0.4

-0.6 -0.6

-0.8 -0.8

-1 0 Figure 6-18. Deep Sleep Mode Supply Current vs. Temperature Angle Error (Degree)

Angle Error (Degree)

Figure 6-17. Sleep Mode Supply Current vs. Temperature -20 -1 0 50 100 150 200 250

Forced Angle (Degree)

300 350 Figure 6-19. Angle Error at 25℃, X-Y Configuration, 50-mT

Range 0 50 100 150 200 250

Forced Angle (Degree)

300 350 Figure 6-20. Angle Error at 25℃ , X-Z Configuration, 50-mT

Range

1

0.8 Angle Error (Degree)

0.6

0.4

0.2

0

-0.2

-0.4

-0.6

-0.8

-1

0 50 100 150 200 250

Forced Angle (Degree)

300 350 Figure 6-21. Angle Error at 25℃ , Y-Z Configuration, 50-mT Range 14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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7 Detailed Description

7.1 Overview

The TMAG5170 IC is based on the Hall-effect technology and precision mixed signal circuitry from Texas Instruments. The output signals (raw X, Y, Z Magnetic data and Die temperature data) is provided through the SPI. The device can be configured in multiple settings through user access registers through the SPI. The IC consists of the following functional and building blocks: • The Power Management & Oscillator block contains a low-power oscillator, biasing circuitry, undervoltage and overvoltage detection circuitry, and a fast oscillator. • The sensing and temperature measurement block contains the Hall biasing, Hall sensors with multiplexers, noise filters, integrator circuit, temperature sensor, and the ADC. The Hall sensor data and temperature data are multiplexed through the same ADC. • The Interface block contains the SPI control circuitry, ESD protection circuits, and all the I/O circuits. The TMAG5170 supports SPI along with integrated cyclic redundancy check (CRC). • The diagnostic blocks are embedded in the circuitry to enable mandatory and user-enabled diagnostic checks.

7.2 Functional Block Diagram

V CC SCK Power Management and Oscillator Result Registers Z

XSDO

• Gain and Filtering MUX ADC Interface SDI Y

– Config Registers Temperature sensor CS Digital Core

ALERT GND

7.3 Feature Description

7.3.1 Magnetic Flux Direction The TMAG5170 is sensitive to the magnetic field component in X, Y, and Z directions. The X and Y fields are in plane with the package. The Z filed is perpendicular to the top of the package. The device is sensitive to both magnetic north and south poles in each axis. As shown in Figure 7-1, the device will generate positive ADC codes in response to a magnetic south pole in the proximity. Similarly, the device will generate negative ADC codes if magnetic north poles approach from the same directions.

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2

3

4

Figure 7-1. Direction of Applied Magnetic South Pole to Generate Positive ADC Codes

7.3.2 Sensor Location Figure 7-2 shows the location of X, Y, Z Hall elements inside the TMAG5170.

1.54-mm Y

X Z 0.32-mm 1.77-mm Figure 7-2. Location of X, Y, Z Hall Elements 16 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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7.3.3 Magnetic Range Selection Table 7-1 shows the magnetic range selection for the TMAG5170 device. Each axis range can be independently selected irrespective of the others.

Table 7-1. Magnetic Range Selection X Axis Field Y Axis Field Z Axis Field RANGE REGISTER SETTING TMAG5170A1 TMAG5170A2

COMMENT X_RANGE = 01b ±25 mT ±75 mT Best resolution case X_ RANGE = 10b ±100 mT ±300 mT Highest range, best SNR case

Y_RANGE = 01b ±25 mT ±75 mT Best resolution case Y_RANGE = 10b ±100 mT ±300 mT Highest range, best SNR case

MODE REGISTER SETTING

X, Y, Z Axis X, Y, Z Axis X, Y, Z Axis UPDATE RATE SINGLE AXIS TWO AXIS THREE AXIS CONV_AVG = 000b 20 ksps 13.3 ksps 10 ksps CONV_AVG = 001b 13.3 ksps 8.0 ksps 5.7 ksps CONV_AVG = 010b 8.0 ksps 4.4 ksps 3.1 ksps X, Y, Z Axis CONV_AVG = 011b 4.4 ksps 2.4 ksps 1.6 ksps X, Y, Z Axis CONV_AVG = 100b 2.4 ksps 1.2 ksps 0.8 ksps X, Y, Z Axis CONV_AVG = 101b 1.2 ksps 0.6 ksps 0.4 ksps COMMENT Fastest update rate Best SNR case 7.3.5 ALERT Function The ALERT pin of the TMAG5170 supports multiple operating modes targeting different applications. 7.3.5.1 Interrupt and Trigger Mode With ALERT_MODE at default value of 0b, the ALERT output can be configured to generate an interrupt signal for microcontroller when a user-defined event occurs. A user-defined event can be a conversion completion or an error from diagnostic tests. The ALERT pin can also be used in this mode to trigger a conversion start using the TRIGGER_MODE register bit. 7.3.5.2 Magnetic Switch Mode With ALERT_MODE set at 1b, the ALERT output is configured as a magnetic switch. One or multiple magnetic channels can be selected in the ALERT_CONFIG register. The magnetic switch thresholds are determined by the *_THRX_CONFIG register bits setting. If the measured magnetic field is greater than *_HI_THRESHOLD, or smaller than *_LO_THRESHOLD, the ALERT output will assert low. Figure 7-3 shows the magnetic switch function using the X-axis magnetic field as an example.

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Field (mT)

X_HI_THRESHOLD (mT)

X_LO_THRESHOLD (mT)

ALERT (V)

time Magnetic field crossing X_HI_THRESHOLD & X_LO_THRESHOLD levels X Channel Magnetic

Field (mT)

X_HI_THRESHOLD (mT)

X_LO_THRESHOLD (mT)

ALERT (V)

time Magnetic field crossing only X_HI_THRESHOLD levels Figure 7-3. ALERT Pin Working as Magnetic Switch

7.3.6 Threshold Count The THRX_COUNT bits in the ALERT_CONFIG register offer robust noise filtering and immunity against false tripping while the TMAG5170 implements the ALERT function for a specific magnetic or temperature threshold crossing. With THRX_COUNT at default 00b, only one measured value must cross the threshold to be considered a valid threshold crossing event. With THRX_COUNT at 11b, four successive measured values must cross the threshold to be considered a valid threshold crossing. An internal counter tracks and records the number of threshold crossing for a given sensor. The counter resets if any of the below events occur: • The device meets the threshold cross count for the specified number per the THRX_COUNT bits, the

corresponding *CH_THX bit(s) are set, and the SPI read of the SYS_STATUS register has occurred • If a measured result does not cross the threshold When the ALERT pin is configured to work as a magnetic switch, the threshold count is active for both low-tohigh and high-to-low transitions, offering noise immunity in both directions of the threshold cross.

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7.3.7 Diagnostics The TMAG5170 supports several device and system level diagnostics features to detect, monitor, and report failures during the device operation. In the event of a failure, the TMAG5170 reports back to the controller through the following mechanisms: • ERROR_STAT bit during the SDO read frame • Direct read of the status registers through the SPI • ALERT pin response to indicate a failure, if enabled • No response through SDO line, or CRC error during SPI communication The TMAG5170 performs the following device and system level checks: 7.3.7.1 Memory CRC Check This diagnostic mechanism checks the content of the internal memory by comparing a calculated CRC of the read content against a factory-programmed expected CRC value. During runtime, when the internal memory is read again for configuration for different channels, the CRC is checked again, providing detection of memory errors even during runtime.

Run Mode Continuous

Configuration Register(s) N/A

Fault Register Bit TRIM_STAT

Impact if disabled N/A. Cannot be disabled 7.3.7.2 ALERT Integrity Check This diagnostic mechanism checks and compares the read back value of the ALERT pin to the value that is driven by the device. This will check the presence of an external short on ALERT pin to a higher voltage such as VCC which will prevent device to indicate a fault. When the controller is driving the ALERT pin to trigger a measurement, it can read the ALRT_LVL bit to check if the correct polarity of the ALERT was detected by the device, thus checking any failures on the pin.

Run Mode Continuous Configuration Register(s) N/A Fault Register Bit ALRT_DRV and ALRT_LVL Impact if disabled When driven by device N/A. Cannot be disabled. When driven by controller, device may not detect a new

measurement command and still report old measurement data.

7.3.7.3 VCC Check This diagnostic mechanism continuously checks the external voltage supply on VCC pin and flags a fault if the supply is out of range.

Run Mode Continuous Data Sheet Parameters V VCC_UV , V VCC_OV Fault Register Bit VCC_UV and VCC_OV Impact if disabled N/A. Cannot be disabled.

7.3.7.4 Internal LDO Under Voltage Check This diagnostic mechanism continuously monitors the internal regulator that supplies the critical analog blocks and Hall sensor biasing, and flags a fault if the internal regulator falls below a threshold after which the accuracy of the magnetic field measurement cannot be guaranteed.

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7.3.7.5 Digital Core Power-on Reset Check This diagnostic mechanism continuously monitors the internal regulator that supplies the internal digital core, and puts the device in reset if the digital core cannot function reliably. The occurrence of the fault is detected by reading the CFG_RESET bit which can only be set at power up or if the digital core was reset.

7.3.7.6 SDO Output Check This diagnostic mechanism continuously compares the internally driven value by device on the SDO pin to the read-back value on SDO pin to detect any shorts to ground or power supply.

Run Mode Continuous, every time a SPI transaction is initiated Data Sheet Parameters N/A Fault Register Bit SDO_DRV Impact if disabled N/A. Cannot be disabled.

7.3.7.7 Communication CRC Check This diagnostic mechanism for every SPI transaction will compute the CRC of the received SPI frame from the controller and check the CRC against the CRC value transmitted by the controller, and flag a fault if the values do not match. The device also embeds a CRC value as part of the SPI frame in the response for the controller to check the integrity of the received data. This check detects faults with SPI communication block in digital core and the SPI I/O buffers and also controller to check for any faults on the SPI external to the device. Another check is also run in the background that counts the number of SPI clocks in a SPI frame and flags a fault if the number of clocks sent by the controller is not same as the expected value. This can help controller detect any issues with the SPI.

Run Mode Continuous, every time a SPI transaction is initiated Configuration Register(s) CRC_DIS to disable CRC in the SPI protocol Fault Register Bit CRC_STAT, FRAME_STAT Impact if disabled If CRC is disabled, then any fault with SPI communication will not be detected and incorrect value of measured

field can be reported.

7.3.7.8 Oscillator Integrity Check This diagnostic mechanism allows the controller to check any hardware fault with the internal oscillator. With this check, any drift of internal oscillators can be checked. The high-frequency oscillator is critical for precision measurement of the magnetic field and low-power oscillator is critical to control wake-up and sleep mode and other state machine control. To run this check, external software code on the controller is required. The controller has to instate the check by setting the OSC_CNT_CTL bits to select a particular oscillator and start the internal count on the device. At the same time, the controller should also start a counter using its own timebase. After a pre-determined time, the controller should issue a stop to the oscillator count by setting OSC_CNT_CTL=0x3 and read the OSC_COUNT. The read value of the OSC_COUNT should not exceed the value based off maximum f HFOSC , f LFPOSC in the specification section. Variation of controller clock speed and SPI communication timing need to be considers while calculating the error margin for the OSC_COUNT.

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TMAG5170 www.ti.com SBASAF4 – SEPTEMBER 2021 Configuration Register(s) OSC_CNT_CTL Fault Register Bit OSC_COUNT Impact if disabled If the controller decides not to run this test, then any drift of HF oscillator can impact the accuracy of the reported

sensor data

7.3.7.9 Magnetic Field Threshold Check This diagnostic mechanism allows the controller to monitor the external applied field. The controller can use this check to determine if a magnetic field is present within specified thresholds. This check, though used as check at system level, can also indicate any gross problems with the signal path if a field much outside the expected range is detected and reported. To run this check, the controller must enable the check separately for each axis and also set the thresholds for each axis independently. The user can configure the ALERT pin to toggle if the threshold crossed, which is also reported in the user register.

Run Mode Every time a magnetic measurement is initiated and completed Configuration Register(s) X_HLT_EN, Y_HLT_EN, Z_HLT_EN to enable test. X_THRX_CONFIG, Y_THRX_CONFIG, Z_THRX_CONFIG to

set threshold Fault Register Bit XCH_THX, YCH_THX, ZCH_THX Impact if disabled If disabled, it does not have impact on device-level failure detection but at system level. Examples of system

failure would be loss of magnet, magnet too far, or too close to the sensor.

7.3.7.10 Temperature Alert Check This diagnostic mechanism allows the controller to monitor the junction temperature of the die, which is also an indication of the ambient temperature as the device does not generate significant self-heating. This is useful to monitor the temperature at the system level accurately and alert the controller if the temperature is exceeded. It can also be used to warn the controller if the die temperature due to some internal failure has increased beyond the expected range. To run this check, the controller must enable the temperature check and set the threshold. The user can configure the ALERT pin to toggle if the threshold crossed, which is also reported in the user register.

Run Mode Every time a magnetic measurement is initiated and completed Configuration Register(s) T_HLT_EN to enable test. T_THRX_CONFIG to set threshold Fault Register Bit TEMP_THX Impact if disabled If disabled, it does not have impact on device-level failure detection but at system level increase or decrease of

temperature.

7.3.7.11 Analog Front-End (AFE) Check This diagnostic mechanism allows the controller to check the performance of the analog signal path. In this check, the device disconnects the Hall sensor from the signal path and uses an alternate resistance bridge to create a known, predetermined signal as an input to the signal path. This mechanism then checks if the measured digital value compared to a fixed value from the factory is within a pre-programmed, factorydetermined value. This mechanism can detect issues with multiplexers, offset cancellation mechanism, the gain stages, the low-pass filter, and the ADC, as well. To run this check, the controller must enable the check and set the scheduling for the run. During this check, the AFE is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an error is detected. This error is also reported in the user register.

Run Mode Every time a magnetic measurement is initiated and completed Configuration Register(s) DIAG_EN to enable test. DIAG_SEL to schedule when the test is run Fault Register Bit SENS_STAT Impact if disabled If disabled, any failures or drift with the analog front-end signal path may not be detected.

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7.3.7.12 Hall Resistance and Switch Matrix Check This diagnostic mechanism allows the controller to check if the sensitivity of the Hall sensor is within the factory-determined limits by checking the resistance of the Hall-effect sensor. In this check, the biasing and multiplexing control of all directions of the Hall sensor (X, Y and Z) are also checked. To run this check, the controller must enable the check and set the scheduling for the run. During this check, the Hall sensor is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an error is detected. This error is also reported in the user register.

Run Mode Every time a magnetic measurement is initiated and completed Configuration Register(s) DIAG_EN to enable test. DIAG_SEL to schedule when the test is run Fault Register Bit ZHS_STAT, YHS_STAT and XHS_STAT Impact if disabled If disabled, any failures or drift in the Hall-effect sensor properties and biasing will not be detected, leading to

potentially incorrect magnetic field conversion

7.3.7.13 Hall Offset Check This diagnostic mechanism allows the controller to check if the offset of the Hall sensor is within the factorydetermined limits and the offset cancellation circuitry is working properly. To run this check, the controller must enable the check and set the scheduling for the run. During this check, the AFE is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an error is detected. This error is also reported in the user register.

Run Mode Every time a magnetic measurement is initiated and completed Configuration Register(s) DIAG_EN to enable test. DIAG_SEL to schedule when the test is run Fault Register Bit SENS_STAT Impact if disabled If disabled, any failures with offset cancellation mechanism or large drift of Hall-effect sensor may not be

detected, leading to potentially incorrect magnetic field conversion.

7.3.7.14 ADC Check This diagnostic mechanism checks ADC functionality and conversion. This check is done by converting a known bandgap voltage, which is completely independent of the ADC reference, and comparing the voltage against the factory-determined tolerance limits. To run this check, the controller must enable the check and set the scheduling for the run. During this check the AFE is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an error is detected. This error is also reported in the user register.

Run Mode Every time a magnetic measurement is initiated and completed Configuration Register(s) DIAG_EN to enable test. DIAG_SEL to schedule when the test is run Fault Register Bit TEMP_STAT Impact if disabled If disabled, any failures with ADC conversion will not be detected, leading to potentially incorrect errors in the

converted magnetic field values.

7.4 Device Functional Modes

7.4.1 Operating Modes The TMAG5170 supports multiple operating modes for wide array of applications as explained in Figure 7-4. The device starts powering up after the VCC supply crosses the minimum threshold as specified in the Recommended Operating Conditions table. Any particular operating mode can be selected by setting the corresponding OPERATING_MODE register bits.

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Deep Sleep Mode t start_power_up Wake-up & Sleep Mode Sleep Mode t start_deep_sleep Trigger Mode Available Configuration Mode (Default Power-up Mode)

Stand-by Mode SPI Communication & User Registers Accessible t start_sleep t stand_by t measure Active Hall/ Temp Measure Figure 7-4. TMAG5170 Power-Up Sequence

Table 7-3 shows different power saving modes of the TMAG5170.

Table 7-3. Comparing Operating Modes

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Table 7-3. Comparing Operating Modes (continued) OPERATING MODE DEVICE FUNCTION INITIALIZATION TIME TO START CONVERSION (1) DATA CONVERSION Deep-sleep Mode Device does not retain key configuration settings, and last measurement data t start_deep_sleep + t stand_by + 35 µs No conversion start is supported during deep-sleep mode

(1) The timing numbers are typical parameters. Their value may vary depending on the internal oscillator frequency.

7.4.1.1 Active Mode The TMAG5170 converts the magnetic sensor or temperature data during active mode. Active mode supports both continuous conversion and trigger mode conversion based off the OPERATING_MODE setting. Continuous operation at this mode is useful for applications where the fastest data conversion is required, and power budget is not stringent. In the Active trigger mode, a controller can trigger a conversion through one of several trigger mechanisms as described in the TRIGGER_MODE register bits. When the conversion started, the time it takes to finish a conversion is denoted by t measure . The conversion time can vary widely based off the MAG_CH_EN, CONV_AVG, DIAG_SEL, and DIAG_EN register bits setting. The average current consumption during the active conversion is I ACT . 7.4.1.2 Standby Mode In the standby mode, the TMAG5170 is ready to start sensor conversion with a trigger command from a controller. Several trigger methods are supported as defined in the TRIGGER_MODE register bits. During this operating mode the relevant analog and digital support circuitry remain active to enable a faster conversion start. The average current consumption during this mode is denoted by I STDBY . The time it takes for the device to go to standby mode from configuration mode is denoted by t stand_by . 7.4.1.3 Configuration Mode (DEFAULT) At power up, the TMAG5170 goes into the default configuration mode. In this mode, the SPI communication and user register access are enabled. A controller may configure the device to select the desired operating mode, sensor data conversion, enable/ disable diagnostic features, and so forth. The average current consumption during this mode is denoted by I CFG . Similar to the standby mode, the configuration mode also supports sensor conversion start with a trigger. However, the configuration mode takes longer time to start the sensor conversion, and consumes approximately ten times less current compared to standby mode. 7.4.1.4 Sleep Mode The TMAG5170 supports the sleep mode where it retains the user configuration settings and previous conversion results. A controller can wake up the device from sleep mode through either the SPI communication or the ALERT signal. The average power consumption in this mode is denoted by I SLP . The time it takes for the device to go to the configuration mode from the sleep mode is denoted by t start_sleep . 7.4.1.5 Wake-Up and Sleep Mode The TMAG5170 supports the wake-up and sleep mode where the device is configured to wake up at a certain time interval, and perform the sensor conversion as defined in the SENSOR_CONFIG register setting. When the sensor conversion is complete, an ALERT signal can be generated to notify the controller that the new conversion data is ready. It is possible to generate an ALERT signal only in the event a particular magnetic or temperature threshold is exceeded. Detail setting on ALERT signal is specified in the ALERT_CONFIG register. A controller can wake up the TMAG5170 and access the conversion data at any time. The average power consumption in the wake-up and sleep mode is denoted by I VCC_DCM . The time it takes for the device to go to configuration mode from wake-up and sleep mode is denoted by t start_sleep . 7.4.1.6 Deep-Sleep Mode For ultra-low power system, the TMAG5170 supports a deep-sleep mode to conserve power. In this mode, the TMAG5170 does not retain the user configuration or previous result data. The device reverts back to factory setting in this mode. The average power consumption in this mode is I DEEP_SLP . The time it takes for the device to go to the configuration mode from the deep-sleep mode is denoted by t start_sleep .

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7.5 Programming

7.5.1 Data Definition 7.5.1.1 Magnetic Sensor Data The X, Y, and Z magnetic sensor data are stored in the X_CH_RESULT, Y_CH_RESULT, and Z_CH_RESULT registers, respectively. The 12-bit ADC output is stored in 16-bit result registers in 2's complement format as shown in Figure 7-5. With fastest conversion (CONV_AVG = 000b), the ADC output loads the 12 MSB bits of the 16-bit result register along with 4 LSB bits as zeros. With CONV_AVG ≠ 000b, all the 16 bits are used to store the results. With DATA_TYPE = 00b, the 16-bit magnetic sensor data can be accessed through regular 32-bit SPI read. Use Equation 1 to calculate the measured magnetic field.

where • • •

B is magnetic field in mT. D i is the data bit as shown in Figure 7-5. B R is the magnetic range in mT for the corresponding channel.

12-bit data when CONV_AVG = 000b D03 D02 D01 D00 D04 D07 D06 D05 D11 D10 D09 D08 D12 D15 D14 D13 Additional 4-bit LSB data when CONV_AVG B 000b Figure 7-5. Magnetic Sensor Data Definition

With DATA_TYPE ≠ 00b, the 12 MSB bits (D04 to D15) from the magnetic result registers can be accessed. In this mode, use Equation 2 to calculate the measured magnetic field.

The TMAG5170 temperature sensor will measure temperature from –40°C to 170°C. Figure 7-6 shows the temperature stored in the 16-bit TEMP_RESULT register. With DATA_TYPE = 00b, the 16-bit temperature data can be accessed through regular 32-bit SPI read. Use Equation 3 to calculate the temperature.

where • • • •

• T is the measured temperature in degree Celsius. T SENS_T0 is the reference temperature in degree Celsius as listed in the Electrical Characteristics table. TADC RES is the change in ADC code per degree Celsius as listed in the Electrical Characteristics table. TADC T0 is the TEMP_RESULT decimal value at reference temperature, T SENS_T0 as listed in the Electrical Characteristics table. TADC T is the measured TEMP_RESULT decimal value for temperature T.

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With DATA_TYPE ≠ 00b, the 12 MSB bits from the TEMP_RESULT register can be accessed. In this mode, use Equation 4 to calculate the temperature.

D03 D02 D01 D00 D04 D07 D06 D05 D11 D10 D09 D08 D12 D15 D14 D13 Binary data for temperature Figure 7-6. Temperature Sensor Data Definition

7.5.1.3 Magnetic Sensor Offset Correction Figure 7-7 shows that the TMAG5170 can enable offset correction for a pair of magnetic axes. The magnetic axes and order are selected based off the ANGLE_EN register bit settings. The MAG_OFFSET_CONFIG register stores the offset values to be corrected in 2's complement data format. The selection and order of the sensors are defined in the ANGLE_EN register bits setting. The default value of these offset correction registers are set as zero.

Δ Offset 0mT Reference Axis Figure 7-7. Magnetic Sensor Data Offset Correction

Use Equation 5 and Equation 6 to calculate the amount of offset for each axis. As an example, with a ±50mT magnetic range for X and Z axes, MAG_OFFSET_CONFIG set at 1110 0000 0011 0000b, ANGLE_EN set at 11b. With these conditions the offset correction for the X axis is −1.56mT and Z axis is 1.17mT. The offset values are added to the sensor conversion results before loading into the corresponding result registers.

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Δ Offset_Value1 is the amount of offset correction (in mT) to be applied for first axis. Δ Offset_Value2 is the amount of offset correction (in mT) to be applied for second axis. D i is the data bit in the offset MAG_OFFSET_CONFIG register. B R is the magnetic range in mT for the corresponding channel. 7.5.1.4 Angle and Magnitude Data Definition The TMAG5170 calculates the angle based off the ANGLE_EN register bit settings. Figure 7-8 shows that the ANGLE_RESULT register stores the angle information in the 13-LSB bits. Bits D04-D12 store angle integer value from 0 to 360 degree. Bits D00-D03 store fractional angle value with a resolution of 1/16 degree. The 3-MSB bits are always populated as b000. The TMAG5170 CORDIC offers angle resolution of 1/4 degree. An external CORDIC may be used if higher angle resolution is required. Use Equation 7 to calculate the angle.

A is the angle measured in degree. D i is the data bit as shown in Figure 7-8. For example: a 354.50 degree is populated as 0001 0110 0010 1000b and a 17.25 degree is populated as 0000 0001 0001 0100b. With DATA_TYPE ≠ 00b, the D01-D12 bits from the ANGLE_RESULT register can be accessed. In this mode, the angle fractional value is represented by 3 bit with resolution of 1/8 degree. Use Equation 8 to calculate the angle in degree.

9-bit Angle integer value 4-bit Angle fraction value D03 D02 D01 D00 D04 D07 D06 D05 D11 D10 D09 D08 D12 D15 D14 D13 0 0 0 Figure 7-8. Angle Data Definition

During the angle calculation, use Equation 9 to calculate the resultant vector magnitude.

(9)

where • MADC Ch1 , MADC Ch2 are the ADC codes of the two magnetic channels selected for the angle calculation.

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Figure 7-9 shows the magnitude value stored in the MAGNITUDE_RESULT register. This value should be constant during 360 degree angle measurements.

Reserved bits 13-bit Magnitude result data D03 D02 D01 D00 D04 D07 D06 D05 D11 D10 D09 D08 D12 D15 D14 D13 0 0 0 Figure 7-9. Magnitude Result Data Definition

The magnitude result can be accessed through SPI in 16-bit or 12-bit formats. In the 12-bit format, bit D01 to bit D12 are sent through the SPI. 7.5.2 SPI Interface The Serial Peripheral Interface (SPI) is a synchronous serial communication interface used for short distance communication, usually between devices on a printed circuit board (PCB) assembly. The TMAG5170 supports a 4-wire SPI interface. The primary communication between the device and the external microcontroller is through the SPI bus that provides full-duplex communication. The external microcontroller works as the SPI controller that sends command requests on the SDI pin and receives device responses on the SDO pin. The TMAG5170 device works as the SPI peripheral device that receives command requests and sends responses (such as status and measured values) to the external microcontroller over the SDO line. The TMAG5170 supports a fixed 32-bit frame size to communicate with a controller device. However, the 32-bit frame can be configured through DATA_TYPE register bits to support a regular single register read data packet, or a special packet to read two-channel data simultaneously. 7.5.2.1 SCK The Serial Clock (SCK) represents the controller clock signal. This clock determines the speed of data transfer and all receiving and sending are done synchronously to this clock. The output data on the SDO pin transitions on the falling edge of the SCK and input data on the SDI pin is latched on the rising edge of the SC. 7.5.2.2 CS The CS activates the SPI interface at the SPI. As long as the CS signal is at high level, the TMAG5170 will not accept the SCK signal or the Serial-data-in (SDI), and the Serial-data-out (SDO) is in high impedance. Hold CS low for the duration of a communication frame without toggling to ensure proper communication. The SPI is disabled each time CS is brought from low to high. 7.5.2.3 SDI The Serial-data-in (SDI) line is used by the controller to configure the user access registers, start a new conversion, or send a read command. The SDI bits are transmitted with each SCK rising edge when the CS pin is low. Figure 7-10 explains the SDI frame details. There are 4 command bits in the SDI line to select the status bit for the next frame or start a new conversion.

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en,

don’t care during read command

Command bits to instruct read type and start new conversion CRC bits

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Product Folder Links: TMAG5170 29 TMAG5170 www.ti.com SBASAF4 – SEPTEMBER 2021 Last eight status bits Sixteen bit data First four status bits CRC bits CR3 CR2 CR1 CR0 STAT0 STAT2 STAT1 D03 D02 D01 D00 STAT3 D04 D07 D06 D05 D11 D10 D09 D08 D12 STAT4 D15 D14 D13 STAT6 STAT5 STAT8 STAT7 STAT10 STAT9 STAT11

CR3 CR2 CR1 CR0 STAT0 STAT2 STAT1 STAT3 CH1-3 CH1-2 CH1-1 CH1-0 CH2-0 CH2-3 CH2-2 CH2-1 CH1-7 CH1-6 CH1-5 CH1-4 CH1-8 CH2-4 CH1-11 CH1-10 CH1-9 CH2-6 CH2-5 CH2-8 CH2-7 CH2-10 CH2-9 CH2-11 SDO: Special 32-bit Read (DATA_TYPE
000b)

• ERROR_STAT indicates if there is any error bit set in the device

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7.5.2.5 SPI CRC The TMAG5170 performs mandatory CRC for SPI communication. The Data integrity is maintained in both directions by a 4-bit CRC covering the content of the incoming and outgoing 32-bit messages. The four LSB bits of each 32-bit SPI frame are dedicated for the CRC. The CRC code is generated by the polynomial x 4 + x + 1. Initialize the CRC bits with b1111. During the SDI write frame, the TMAG5170 reads for the CRC data before executing a write instruction. The write instruction from the controller is ignored if there is any CRC error present in the frame. During the SDI regular read frame, the TMAG5170 starts to deliver the requested data through SDO line in the same frame and notifies the controller of any error occurrence through the ERROR_STAT bit. If the device detects a CRC error in the SDI line, the device will invert the last bit of the SDO CRC in the same frame to promptly signal to a controller that the SPI communication is compromised. A controller can also determine the presence of a CRC error in the SDI frame by checking the Status11 bit in the next regular read frame.

Note The TMAG5170 default mode at power up is CRC-enabled. With CRC enabled, the device will ignore all the SDI commands if proper CRC codes are not received. To disable the CRC at the SDI line, send the SPI SDI command x0F000407.

4-Bit LSB Zeros . . d[4] CRC Polynomial

x 4 +x +1

& CRC Initialization Bits

28-Bit Source Data d[31]

. . . .

. . d[4] 4-Bit CRC 28-Bit Source Data d[31]

. . . .

crc[3] crc[2] crc[1] crc[0]

Figure 7-13. 4-Bit CRC Calculation

Use the following XOR function equations to calculate the 4-bit CRC. Figure 7-13 describes the notations of these equations.

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The following shows example codes for calculating the 4-bit CRC.

function logic [3:0] calculate_crc4;

input logic [27:0] frame;

logic [31:0] logic [3:0] logic integer padded_frame;

frame_crc; inv;

i;

begin

frame_crc = 4'hf; // initial value

return frame_crc; end endfunction 7.5.2.6 SPI Frame With the flexible definition of the 32-bit frames, the TMAG5170 supports a wide array of application requirements catering to multiple user-specific data throughout. Two different frame examples are shown in this section to illustrate the complete SPI bus communication: • 32-Bit Read Frame • 32-Bit Write Frame

7.5.2.6.1 32-Bit Read Frame

Figure 7-14 shows both regular and special SDO frames during SDI read command. The TMAG5170 implements in-frame communication. When the controller sends a register read command during a regular read cycle, the corresponding 16-bit register data is sent through the SDO line in the same frame. During the special read cycle, the TMAG5170 ignores the address and data bits of the SDI line and sends the two channel data set

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7.5.2.6.2 32-Bit Write Frame

Figure 7-15 shows both regular and special SDO frames during SDI write command. During a regular 32-bit frame write command through SDI, the SDO delivers '0's in place of 16-bit data placeholders. During the special frame write cycle through SDI line, the TMAG5170 will continue to send the two channel data through SDO line

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Table 7-4. TMAG5170 Registers (continued) Offset Acronym Register Name

Fh TEST_CONFIG Test Configuration Register Section

Go 10h OSC_MONITOR Conversion Result Register Go 11h MAG_GAIN_CONFIG Configure Device Operation Modes Go 12h MAG_OFFSET_CONFIG Configure Device Operation Modes Go 13h ANGLE_RESULT Conversion Result Register Go 14h MAGNITUDE_RESULT Conversion Result Register Go Complex bit access types are encoded to fit into small table cells. Table 7-5 shows the codes that are used for access types in this section.

Table 7-5. TMAG5170 Access Type Codes Access Type Code Description R R Read RC R

CRead to Clear W Write Read Type Write Type W Reset or Default Value - n Value after reset or the default value

DEVICE_CONFIG is shown in Table 7-6. Return to the Summary Table.

Table 7-6. DEVICE_CONFIG Register Field Descriptions 34 Bit Field Type Reset Description 15 RESERVED R 0h Reserved 14-12 CONV_AVG R/W 0h Enables additional sampling of the sensor data to reduce the noise

effect (or to increase resolution)

6h = Code not used, defaults to 000b if selected 7h = Code not used, defaults to000b if selected 11-10 RESERVED R 0h Reserved 9-8 MAG_TEMPCO R/W 0h Temperature coefficient of sense magnet

0h = 0%/ deg C (Current sensor applications)

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Table 7-6. DEVICE_CONFIG Register Field Descriptions (continued) Bit Field Type Reset Description 6-4 OPERATING_MODE R/W 0h Selects operating mode

0h = Configuration mode, Default (TRIGGER_MODE active)

2h = Active measure mode (Continuous conversion) 3h = Active trigger mode (TRIGGER_MODE active) 4h = Wake-up and sleep mode (duty-cycled mode) 5h = Sleep mode 6h = Deep sleep mode (wakes up at CS signal from controller) 7h = Code not used, defaults to 000b if selected 3 T_CH_EN R/W 0h Enables data acquisition of the temperature channel

0h = Temp channel disabled, Default 1h = Temp channel enabled 2 T_RATE R/W 0h Temperature conversion rate. It is linked to the CONV_AVG field

0h = Same as other sensors per CONV_AVG, Default 1h = Once per conversion set 1 T_HLT_EN R/W 0h Enables temperature limit check

0h = Temperature limit check off, Default 1h = Temperature limit check on 0 RESERVED R 0h Reserved

SENSOR_CONFIG is shown in Table 7-7. Return to the Summary Table.

Table 7-7. SENSOR_CONFIG Register Field Descriptions Bit Field Type Reset Description 15-14 ANGLE_EN R/W 0h Enable angle calculation using two axis data

0h = No angle calculation (default) 1h = X-Y-angle calculation enabled 2h = Y-Z-angle calculation enabled 3h = X-Z-angle calculation enabled 13-10 SLEEPTIME R/W 0h Selects the time spent in low power mode between conversions

Ah = Code not used, defaults to 0000b if selected Bh = Code not used, defaults to 0000b if selected Ch = Code not used, defaults to 0000b if selected Dh = Code not used, defaults to 0000b if selected Eh = Code not used, defaults to 0000b if selected Fh = Code not used, defaults to 0000b if selected Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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Table 7-7. SENSOR_CONFIG Register Field Descriptions (continued) Bit Field Type Reset Description 9-6 MAG_CH_EN R/W 0h Enables data acquisition of the magnetic axis channel(s)

0h = All magnetic channels of OFF, DEFAUT 1h = X channel enabled 2h = Y channel enabled 3h = X, Y channel enabled 4h = Z channel enabled 5h = Z, X channel enabled 6h = Y, Z channel enabled 7h = X, Y, Z channel enabled 8h = XYX channel enabled 9h = YXY channel enabled Ah = YZY channel enabled Bh = ZYZ channel enabled Ch = ZXZ channel enabled Dh = XZX channel enabled Eh = XYZYX channel enabled Fh = XYZZYX channel enabled 5-4 Z_RANGE R/W 0h Enables different magnetic ranges to support magnetic fields from

3h = Code not used, defaults to 00b if selected 3-2 Y_RANGE R/W 0h Enables different magnetic ranges to support magnetic fields from

3h = Code not used, defaults to 00b if selected 1-0 X_RANGE R/W 0h Enables different magnetic ranges to support magnetic fields from

3h = Code not used, defaults to 00b if selected

SYSTEM_CONFIG is shown in Table 7-8. Return to the Summary Table.

Table 7-8. SYSTEM_CONFIG Register Field Descriptions 36 Bit Field Type Reset Description 15-14 RESERVED R 0h Reserved 13-12 DIAG_SEL R/W 0h Selects a diagnostic mode run

0h = Run all data path diagnostics all together, Default 1h = Run only enabled data path diagnostics all together 2h = Run all data path diagnostics in sequence 3h = Run only enabled data path diagnostics in sequence 11 RESERVED R 0h Reserved 10-9 TRIGGER_MODE R/W 0h Selects a condition which initiates a single conversion based

off already configured registers. A running conversion completes before executing a trigger. Redundant triggers are ignored. TRIGGER_MODE is available only during the modes explicitly mentioned in OPERATING_MODE. 0h = Conversion start at SPI command, Default 1h = Conversion start at CS pulse 2h = Conversion start at ALERT pulse 3h = Code not used, defaults to 00b if selected Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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Table 7-8. SYSTEM_CONFIG Register Field Descriptions (continued) Bit Field Type Reset Description 8-6 DATA_TYPE R/W 0h Data Type to be accessed from results registers via SPI

0h = Default 32-bit register access 1h = 12-Bit XY data access 2h = 12-Bit XZ data access 3h = 12-Bit ZY data access 4h = 12-Bit XT data access 5h = 12-Bit YT data access 6h = 12-Bit ZT data access 7h = 12-Bit AM data access 5 DIAG_EN R/W 0h Enables user controlled AFE diagnostic tests

0h = Execution of AFE diagnostics is disabled, Default 1h = Execution of AFE diagnostics is enabled 4-3 RESERVED R 0h Reserved 2 Z_HLT_EN R/W 0h Enables magnetic field limit check on Z axis

0h = Z axis limit check off, Default 1h = Z axis limit check on 1 Y_HLT_EN R/W 0h Enables magnetic field limit check on Y axis

0h = Y axis limit check off, Default 1h = Y axis limit check on 0 X_HLT_EN R/W 0h Enables magnetic field limit check on X axis

0h = X axis limit check off, Default 1h = X axis limit check on

ALERT_CONFIG is shown in Table 7-9. Return to the Summary Table.

Table 7-9. ALERT_CONFIG Register Field Descriptions Bit Field Type Reset Description 15-14 RESERVED R 0h Reserved 13 ALERT_LATCH R/W 0h Latched ALERT mode select

0h = ALERT sources are not latched. ALERT is asserted only while the source of the ALERT response is present 1h = ALERT sources are latched. ALERT response is latched when the source of the ALERT is asserted until cleared on Read of the corresponding status register (AFE_STATUS, SYS_STATUS, or result registers) 12 ALERT_MODE R/W 0h ALERT mode select

0h = Interrupt mode 1h = Switch mode. This mode overrides any interrupt function (ALERT trigger is also disabled), and implements Hall switch function based off the *_THRX_ALRT settings. In the switch mode the corresponding X_HLT_EN, Y_HLT_EN, Z_HLT_EN need to be set. 11 STATUS_ALRT R/W 0h Enable ALERT response when any flag in the AFE_STATUS or

SYS_STATUS registers are set 0h = ALERT is not asserted when any of the AFE_STATUS or SYS_STATUS bit is set 1h = ALERT output is asserted when any of the AFE_STATUS or SYS_STATUS bit is set 10-9 RESERVED R 0h Reserved 8 RSLT_ALRT R/W 0h Enable ALERT response when the configured set of conversions is

complete 0h = ALERT is not used to signal when the configured set of conversions are complete 1h = ALERT output is asserted when the configured set of conversions are complete Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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Table 7-9. ALERT_CONFIG Register Field Descriptions (continued) Bit Field Type Reset Description 7-6 RESERVED R 0h Reserved 5-4 THRX_COUNT R/W 0h Number of conversions above the HIGH threshold or below the LOW

threshold before the ALERT response is initiated

3 T_THRX_ALRT R/W 0h Temperature threshold ALERT enable

0h = ALERT is not used to signal when temperature thresholds are crossed 1h = ALERT output is asserted when temperature thresholds are crossed 2 Z_THRX_ALRT R/W 0h Z-Channel threshold ALERT enable

0h = ALERT is not used to signal when Z-Axis magnetic thresholds are crossed 1h = ALERT output is asserted when Z-Axis magnetic thresholds are crossed 1 Y_THRX_ALRT R/W 0h Y-Channel threshold ALERT enable

0h = ALERT is not used to signal when Y-Axis magnetic thresholds are crossed 1h = ALERT output is asserted when Y-Axis magnetic thresholds are crossed 0 X_THRX_ALRT R/W 0h X-Channel threshold ALERT enable

0h = ALERT is not used to signal when X-Axis magnetic thresholds are crossed 1h = ALERT output is asserted when X-Axis magnetic thresholds are crossed

X_THRX_CONFIG is shown in Table 7-10. Return to the Summary Table.

Table 7-10. X_THRX_CONFIG Register Field Descriptions Bit Field Type Reset Description 15-8 X_HI_THRESHOLD R/W 7Dh X-Axis maximum magnetic field threshold. User input as 2's

complement 8-bit binary number. The threshold in mT can be calculated as: (X_RANGE/128)*X_HI_THRESHOLD. Default to 98% of the full-scale 7-0 X_LO_THRESHOLD R/W 83h X-Axis minimum magnetic field threshold. User input as 2's

complement 8-bit binary number. The threshold in mT can be calculated as: (X_RANGE/128)*X_LO_THRESHOLD. Default to -98% of the full-scale

Y_THRX_CONFIG is shown in Table 7-11. Return to the Summary Table.

Table 7-11. Y_THRX_CONFIG Register Field Descriptions 38 Bit Field Type Reset Description 15-8 Y_HI_THRESHOLD R/W 7Dh Y-Axis maximum magnetic field threshold. User input as 2's

complement 8-bit binary number. The threshold in mT can be calculated as: (Y_RANGE/128)*Y_HI_THRESHOLD. Default to 98% of the full-scale.

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Table 7-11. Y_THRX_CONFIG Register Field Descriptions (continued) Bit Field Type Reset Description 7-0 Y_LO_THRESHOLD R/W 83h Y-Axis minimum magnetic field threshold. User input as 2's

complement 8-bit binary number. The threshold in mT can be calculated as: (Y_RANGE/128)*Y_LO_THRESHOLD. Default to -98% of the full-scale.

Z_THRX_CONFIG is shown in Table 7-12. Return to the Summary Table.

Table 7-12. Z_THRX_CONFIG Register Field Descriptions Bit Field Type Reset Description 15-8 Z_HI_THRESHOLD R/W 7Dh Z-Axis maximum magnetic field threshold. User input as 2's

complement 8-bit binary number. The threshold in mT can be calculated as:(Z_RANGE/128)*Z_HI_THRESHOLD. Default to 98% of the full-scale 7-0 Z_LO_THRESHOLD R/W 83h Z-Axis minimum magnetic field threshold. User input as 2's

complement 8-bit binary number. The threshold in mT can be calculated as: (Z_RANGE/128)*X_LO_THRESHOLD. Default to -98% of the full-scale

T_THRX_CONFIG is shown in Table 7-13. Return to the Summary Table.

Table 7-13. T_THRX_CONFIG Register Field Descriptions Bit Field Type Reset Description 15-8 T_HI_THRESHOLD R/W 67h Temperature maximum threshold. User input as 2's complement 8-

bit binary number. Each LSB in this field corresponds to 4.267°C. Default value of 67h represents 172°C. 7-0 T_LO_THRESHOLD R/W 32h Temperature minimum threshold. User input as 2's complement 8-

bit binary number. Each LSB in this field corresponds to 4.267°C. Default value of 32h represents -53°C.

CONV_STATUS is shown in Table 7-14. Return to the Summary Table.

Table 7-14. CONV_STATUS Register Field Descriptions Bit Field Type Reset Description 15-14 RESERVED R 0h Reserved 13 RDY R 0h Conversion data buffer is ready.

0h = Conversion data not valid (result registers hold previous conversion value) 1h = Conversion data valid 12 A R 0h Angle/Magnitude data from current conversion

0h = Data is not current 1h = Data is current 11 T R 0h Temperature data from current conversion

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Table 7-14. CONV_STATUS Register Field Descriptions (continued) Bit Field Type Reset Description 10 Z R 0h Z-Channel data from current conversion

0h = Z-Channel data is not current 1h = Z-Channel data is current 9 Y R 0h Y-Channel data from current conversion

0h = Y-Channel data is not current 1h = Y-Channel data is current 8 X R 0h X-Channel data from current conversion

0h = X-Channel data is not current 1h = X-Channel data is current 7 RESERVED R 0h Reserved 6-4 SET_COUNT R 0h Rolling count of conversion data sets 3-2 RESERVED R 0h Reserved 1-0 ALRT_STATUS R 0h State of ALERT response

0h = No ALERT conditions 1h = AFE status flag set 2h = SYS status flag set 3h = Flags set in both AFE and SYS status registers

X_CH_RESULT is shown in Table 7-15. Return to the Summary Table.

Table 7-15. X_CH_RESULT Register Field Descriptions Bit Field Type Reset Description 15-0 X_CH_RESULT R 0h X-Channel data conversion results

Y_CH_RESULT is shown in Table 7-16. Return to the Summary Table.

Table 7-16. Y_CH_RESULT Register Field Descriptions Bit Field Type Reset Description 15-0 Y_CH_RESULT R 0h Y-Channel data conversion results

Z_CH_RESULT is shown in Table 7-17. Return to the Summary Table.

Table 7-17. Z_CH_RESULT Register Field Descriptions Bit Field Type Reset Description 15-0 Z_CH_RESULT R 0h Z-Channel data conversion results

TEMP_RESULT is shown in Table 7-18. Return to the Summary Table.

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Table 7-18. TEMP_RESULT Register Field Descriptions Bit Field Type Reset Description 15-0 TEMP_RESULT R 0h Temperature sensor data conversion results

AFE_STATUS is shown in Table 7-19. Return to the Summary Table.

Table 7-19. AFE_STATUS Register Field Descriptions Bit Field Type Reset Description 15 CFG_RESET RC 1h Device power up status. This bit is reset when microcontroller reads

the AFE_STATUS register. 0h = Device reset has been acknowledged and cleared 1h = Device has experienced a hardware reset after a power down or brown-out 14-13 RESERVED R 0h Reserved 12 SENS_STAT RC 0h Analog front end sensor diagnostic status

0h = No error detected 1h = Analog front end sensor diagnostic test failed 11 TEMP_STAT RC 0h Temperature sensor diagnostic status

0h = No error detected 1h = Analog front end temperature sensor diagnostic test failed 10 ZHS_STAT RC 0h Z-Axis hall sensor diagnostic status

0h = No error detected 1h = Z-Axis hall sensor diagnostic test failed 9 YHS_STAT RC 0h Y-Axis hall sensor diagnostic status

0h = No error detected 1h = Y-Axis hall sensor diagnostic test failed 8 XHS_STAT RC 0h X-Axis hall sensor diagnostic status

0h = No error detected 1h = X-Axis hall sensor diagnostic test failed 7-2 RESERVED R 0h Reserved 1 TRIM_STAT RC 0h Trim data error

0h = No trim data errors were detected 1h = Trim data error was detected 0 LDO_STAT RC 0h LDO error

0h = No faults in the internal LDO supplied power were detected 1h = A fault in the internal LDO supplied power was detected

SYS_STATUS is shown in Table 7-20. Return to the Summary Table.

Table 7-20. SYS_STATUS Register Field Descriptions Bit Field Type Reset Description 15 ALRT_LVL R 0h Reflects the current state of the ALERT pin feed-back path

0h = The input ALERT logic level is low 1h = The input ALERT logic level is high 14 ALRT_DRV RC 0h Each time the open drain ALERT signal is driven, the feedback

circuit checks if the ALERT output goes Low. An error flag is generated at the ALRT_DRV bit if the output doesn't go Low. 0h = No ALERT drive error detected 1h = ALERT drive error detected Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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Table 7-20. SYS_STATUS Register Field Descriptions (continued) Bit Field Type Reset Description 13 SDO_DRV RC 0h The Logic value driven output on SDO was not the value of the SDO

Pin Feed-back path when SDO is being driven by the device 0h = No SDO drive error detected 1h = SDO drive error detected 12 CRC_STAT RC 0h Cyclic redundancy check error

0h = No cyclic redundancy check error was detected 1h = Cyclic redundancy check error was detected for a SPI transaction 11 FRAME_STAT RC 0h Incorrect number of clocks in SPI frame

0h = No frame error was detected 1h = Incorrect number of clocks detected for a SPI transaction 10-8 OPERATING_STAT R 0h Reports the status of operating mode

0h = Config state 1h = Standby state 2h = Active measure (Continuous Mode) state 3h = Active triggered mode state 4h = DCM active state 5h = DCM Sleep state 6h = Sleep state 7-6 RESERVED R 0h Reserved 5 VCC_OV RC 0h VCC over-voltage detection in active or stand-by mode

0h = No over-voltage detected on VCC 1h = VCC was detected to be over-voltage 4 VCC_UV RC 0h VCC under voltage detection in active or stand-by mode

0h = No under-voltage was detected on VCC 1h = VCC was detected to be under-voltage 3 TEMP_THX RC 0h Temperature threshold crossing detected

0h = No temperature threshold crossing detected 1h = Temperature threshold crossing detected 2 ZCH_THX RC 0h Z-Channel threshold crossing detected

0h = No Z-Axis magnetic field threshold crossing detected 1h = Z-Axis magnetic field threshold threshold crossing detected 1 YCH_THX RC 0h Y-Channel threshold crossing detected

0h = No Y-Axis magnetic field threshold crossing detected 1h = Y-Axis magnetic field threshold crossing detected 0 XCH_THX RC 0h X-Channel threshold crossing detected

0h = No X-Axis magnetic field threshold crossing detected 1h = X-Axis magnetic field threshold crossing detected

TEST_CONFIG is shown in Table 7-21. Return to the Summary Table.

Table 7-21. TEST_CONFIG Register Field Descriptions 42 Bit Field Type Reset Description 15-6 RESERVED R 1h Reserved 5-4 VER R X Indicates the version of the device

3 RESERVED R 0h Reserved 2 CRC_DIS R/W 0h Enable or disable CRC in SPI communication

0h = CRC enabled in SPI communication (Default) 1h = CRC disabled in SPI communication Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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Table 7-21. TEST_CONFIG Register Field Descriptions (continued) Bit Field Type Reset Description 1-0 OSC_CNT_CTL R/W 0h Oscillator count control - starts, stops, and resets the counter driven

by the HFOSC or LFOSC oscillator to facilitate oscillator frequency and integety checks 0h = Reset OSC counter (default) 1h = Start OSC counter driven by HFOSC 2h = Start OSC counter driven by LFOSC 3h = Stop OSC counter

OSC_MONITOR is shown in Table 7-22. Return to the Summary Table.

Table 7-22. OSC_MONITOR Register Field Descriptions Bit Field Type Reset Description 15-0 OSC_COUNT R 0h Oscillator Counter. The number of selected oscillator clock cycles

that have been counted since Oscillator Counter was started. The HFOSC and LFOSC clock roll-over the 16-bit counter once reaching the max value.

MAG_GAIN_CONFIG is shown in Table 7-23. Return to the Summary Table.

Table 7-23. MAG_GAIN_CONFIG Register Field Descriptions Bit Field Type Reset Description 15-14 GAIN_SELECTION R/W 0h Enables the selection of a particular Hall axis for amplitude

correction to get accurate angle measurement 0h = No axis is selected (Default)

13-11 RESERVED R 0h Reserved 10-0 GAIN_VALUE R/W 0h 11-bit gain value determined by controller to adjust the a particular

Hall axis value. The gain value is anywhere between 0 and 2. Gain is calculated as 'user entered value/1024'.

MAG_OFFSET_CONFIG is shown in Table 7-24. Return to the Summary Table.

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Table 7-24. MAG_OFFSET_CONFIG Register Field Descriptions Bit Field Type Reset Description 15-14 OFFSET_SELECTION R/W 0h Enables the selection of a particular Hall axis for offset correction to

get accurate angle measurement: 00b = No axis is selected for offset correction (Default). 01b = Only OFFSET_VALUE1 is used for offset correction. Applied to X axis when ANGLE_EN = 01b or 11b, and to Y axis when ANGLE_EN =10b. No axis is selected if ANGLE_EN =00b. 10b = Only OFFSET_VALUE2 is used for offset correction. Applied to Y axis when ANGLE_EN = 01b, and to Z axis when ANGLE_EN =10b or 11b. No axis is selected if ANGLE_EN =00b. 11b = Both OFFSET_VALUE1 and OFFSET_VALUE2 are used for offset correction. OFFSET_VALUE1 applied to X axis when ANGLE_EN = 01b or 11b, and to Y axis when ANGLE_EN =10b. OFFSET_VALUE2 applied to Y axis when ANGLE_EN = 01b, and to Z axis when ANGLE_EN =10b or 11b. No axis is selected if

13-7 OFFSET_VALUE1 R/W 0h 7-bit, 2' complement offset value determined by controller to adjust a

particular Hall axis value. The range of possible offset valid entries can be +/-64. The offset value is calculated from the user input as the 7 LSB bits of a 11-bit range per SENSOR_CONFIG register setting for the corresponding axis. Default offset value is 0. 6-0 OFFSET_VALUE2 R/W 0h 7-bit, 2' complement offset value determined by controller to adjust a

particular Hall axis value. The range of possible offset valid entries can be +/-64. The offset value is calculated from the user input as the 7 LSB bits of a 11-bit range per SENSOR_CONFIG register setting for the corresponding axis. Default offset value is 0.

ANGLE_RESULT is shown in Table 7-25. Return to the Summary Table.

Table 7-25. ANGLE_RESULT Register Field Descriptions Bit Field Type Reset Description 15-0 ANGLE_RESULT R 0h Angle measurement result in degree. The data is displayed from 0 to

360 degree in 13 LSB bits. The 4 LSB bits allocated for fraction of an angle in the format (xxxx/16).

MAGNITUDE_RESULT is shown in Table 7-26. Return to the Summary Table.

Table 7-26. MAGNITUDE_RESULT Register Field Descriptions 44 Bit Field Type Reset Description 15-0 MAGNITUDE_RESULT R 0h Resultant vector magnitude (during angle measurement) result. This

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8 Application and Implementation

Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Selecting the Sensitivity Option Select the highest TMAG5170 sensitivity option that can measure the required range of magnetic flux density so that the ADC output range is maximized. Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very small magnets at close distances, because magnetic flux density increases exponentially with the proximity to a magnet. TI created an online tool to help with simple magnet calculations under the TMAG5170-Q1 product folder on ti.com. 8.1.2 Temperature Compensation for Magnets The TMAG5170 temperature compensation is designed to directly compensate the average temperature drift of several magnets as specified in the MAG_TEMPCO register bits. The residual induction (B r ) of a magnet typically reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite magnets as the temperature increases. Set the MAG_TEMPCO bit to default 00b if the device temperature compensation is not needed. 8.1.3 Sensor Conversion Multiple conversion schemes can be adopted based off the MAG_CH_EN, CONV_AVG, DIAG_SEL, and DIAG_EN register bit settings. 8.1.3.1 Continuous Conversion The TMAG5170 can be set in continuous conversion mode when OPERATING_MODE is set to 010b. Figure 8-1 shows an example of continuous conversion where only X-axis is selected for conversion. The input magnetic field is processed in two steps. In the first step, the device spins the hall sensor elements and integrates the sampled data. In the second step, the ADC block converts the analog signal into digital bits and stores the signal in the corresponding result register. While the ADC starts processing the first magnetic sample, the spin block can start processing the second magnetic sample. In this mode, the maximum sampling rate is determined by the update interval, not by the conversion time.

HALL Spin & Integration X-Axis (1st)

ADC X-Axis (2nd)

X-Axis (3rd)

X-Axis (4th)

X-Axis (1st)

X-Axis (2nd)

X-Axis (3rd)

Conversion time X-Axis (4th)

Update interval Time Figure 8-1. Continuous Conversion Selecting X Axis Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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8.1.3.2 Trigger Conversion The TMAG5170 supports trigger conversion with OPERATING_MODE set to 00b, 001b, or 011b. During trigger conversion, the initialization time can vary depending on the operating mode as shown in Table 7-3. The trigger event can be initiated through SPI command, ALERT, or CS signal. Figure 8-2 shows an example of trigger conversion with X, Y, Z, and temperature sensors activated.

Initialization time HALL Spin & Integration ADC X-Axis Y-Axis Z-Axis Temp X-Axis Y-Axis Conversion Conversion

start Trigger Z-Axis Conversion

time Time Figure 8-2. Trigger Conversion for X, Y, Z, and Temperature Sensors

8.1.3.3 Pseudo-Simultaneous Sampling In absolute angle measurement, application sensor data from multiple axes are required to calculate an accurate angle. The magnetic field data collected at different times through the same signal chain introduces error in angle calculation. The TMAG5170 offers pseudo-simultaneous sampling data collection modes to eliminate this error. Figure 8-3 shows an example where MAG_CH_EN is set at 1101b to collect XZX data. Equation 14 shows that the time stamps for the X and Z sensor data are the same.

where • t X1 , t Z , t X2 are time stamps for X, Z, X sensor data completion as defined in Figure 8-3.

HALL Spin & Integration ADC X-Axis Z-Axis X-Axis X-Axis Z-Axis t X1 X-Axis t Z t X1

Time Figure 8-3. XZX Magnetic Field Conversion

The vertical X, Y sensors of the TMAG5170 exhibit more noise than the horizontal Z sensor. The pseudosimultaneous sampling can be used to equalize the noise floor when two set of vertical sensor data are collected against one set of horizontal sensor data, as in examples of XZX or YZY modes.

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8.1.4 Error Calculation During Linear Measurement The TMAG5170 offers independent configurations to perform linear position measurements in X, Y, and Z axes. To calculate the expected error during linear measurement, the contributions from each of the individual error sources must be understood. The relevant error sources include sensitivity error, offset, noise, cross axis sensitivity, hysteresis, nonlinearity, drift across temperature, drift across life time, and so forth. For a 3-axis Hall solution like the TMAG5170, the cross-axis sensitivity and hysteresis error sources are insignificant. Use Equation 15 to estimate the linear measurement error calculation at room temperature.

where • • • • • •

Error LM_25C is total error in % during linear measurement at 25°C. B is input magnetic field. SENS ER is sensitivity error at 25°C. B off is offset error at 25°C.

N RMS_25 is RMS noise at 25°C. In many applications, system level calibration at room temperature can nullify the offset and sensitivity errors at 25°C. The noise errors can be reduced by further digital averaging the sensor data in a microcontroller. Use Equation 15 to estimate the linear measurement error across temperature after calibration at room temperature.

where •

• • • •

Error LM_Temp is total error in % during linear measurement across temperature after room temperature calibration. B is input magnetic field. SENS DR is sensitivity drift from value at 25°C. B off_DR is offset drift from value at 25°C. N RMS_125 is RMS noise across temperature. If room temperature calibration is not performed, sensitivity and offset errors at room temperature must also account for total error calculation across temperature (see Equation 17).

where •

Error LM_Temp_NCal is total error in % during linear measurement across temperature without room temperature calibration. The table below summarizes linear measurement error estimate for z-axis with magnetic field range of ±50mT

Table 8-1. Total Error Examples During Linear Measurement

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Note In this section, error sources such as system mechanical vibration, magnet temperature gradient, nonlinearity, lifetime drift, and so forth, are not considered. The user must take these additional error sources into account while calculating overall system error budgets.

8.1.5 Error Calculation During Angular Measurement The TMAG5170 offers on-chip CORDIC to measure angle data from any of the two magnetic axes. The linear magnetic axis data can be used to calculate the angle using an external CORDIC as well. To calculate the expected error during angular measurement, the contributions from each individual error source must be understood. The relevant error sources include sensitivity error, offset, noise, axis-axis mismatch, nonlinearity, drift across temperature, drift across life time, and so forth. Use the Angle Error Calculation Tool to estimate the total error during angular measurement. Table 8-2 offers an example angular error estimate for X-Y plane with magnetic field range of ±100mT, peak X, Y field of ±80mT, and CONV_AVG =101b. The angle error can be improved by calibrating at room and high temperature, using multi-pole magnet, implementing linearization scheme in the controller, and so forth.

Table 8-2. Error Estimates During Angle Measurement

Angle error for 360° rotation across temperature 2.1° ~1.0° Note In this section, system level error sources such as mechanical misalignment, vibration, magnet temperature gradient, lifetime drift, and so forth, are not considered. The user must take these additional error sources into account while calculating overall system error budgets.

8.2 Typical Application

Magnetic angle sensors are very popular due to contactless and reliable measurements, especially in applications requiring long-term measurements in rugged environments. The TMAG5170 offers an on-chip angle calculator that can provide angular measurement based off any two of the magnetic axes. The two axes of interest can be selected in the ANGLE_EN register bits. The device offers an angle output in complete 360 degree scale. Take several error sources into account for angle calculation, including sensitivity error, offset error, linearity error, noise, mechanical vibration, temperature drift, and so forth.

2.3V to 5.5V VDD/VIO VCC CS SDI SDO µController TMAG5170 ALERT SCK GND TEST Figure 8-4. TMAG5170 Application Diagram 48 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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8.2.1 Design Requirements Use the parameters listed in Table 8-3 for this design example

Table 8-3. Design Parameters DESIGN PARAMETERS ON-AXIS MEASUREMENT OFF-AXIS MEASUREMENT

Device TMAG5170-A1 TMAG5170-A1 VCC 5 V 5 V Magnet Cylinder: 4.7625-mm diameter, 12.7-mm thick, neodymium N52, Br = 1480 Cylinder: 4.7625-mm diameter, 12.7-mm thick, neodymium N52, Br = 1480 Magnetic Range Selection Select the same range for both axes based off the highest possible magnetic field seen

by the sensor Select the same range for both axes based off the highest possible magnetic field seen

by the sensor RPM <600 <600 Desired Accuracy <1° for 360° rotation <1° for 360° rotation 8.2.1.1 Gain Adjustment for Angle Measurement Common measurement topology include angular position measurements in on-axis or off-axis angular measurements shown in Figure 8-5. Select the on-axis measurement topology whenever possible, as this offers the best optimization of magnetic field and the device measurement ranges. The TMAG5170 offers an on-chip gain adjustment option to account for mechanical position misalignments.

On-axis

N

Off-axis S N S

Figure 8-5. On-Axis vs. Off-Axis Angle Measurements

8.2.2 Detailed Design Procedure For accurate angle measurement, the two axes amplitudes must be normalized by selecting the proper gain adjustment value in the MAG_GAN_CONFIG register. The gain adjustment value is a fractional decimal number between 0 and 1. The following steps must be followed to calculate this fractional value:

1. Set the device at 32x average mode and rotate the shaft a full 360 degree. 2. Record the two axes sensor ADC codes for the full 360 degree rotation.

3. Measure the maximum peak-peak ADC code delta for each axis, Ax and Ay, as shown in Figure 8-6 or

Figure 8-7.

4. Calculate the gain adjustment value for X axis:

5. If G X >1, apply the gain adjustment value to Y axis:

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6. Calculate the target binary gain setting at the GAIN_VALUE register bits:

Example 1: If A X = A Y = 60,000, the GAIN_SELECTION resister bits can be set as 00b. The GAIN_VALUE register bits are don't care bits in this case. Example 2: If A X = 60,000, A Y = 45,000, the G X = 45,000/60,000 =0.75. Select 01b for the GAIN_SELECTION register bits. Example 3: If A X = 45,000, A Y = 60,000, the G X = (60,000/45,000) =1.33. Since G X >1, the gain adjustment needs to be applied to Y axis with G Y =1/G X . Select 10b for the GAIN_SELECTION register bits. 8.2.3 Application Curves Ay Ax = Ay Figure 8-6. X and Y Sensor Data for Full 360 Degree Rotation for On-Axis Measurement Figure 8-7. X and Y Sensor Data for Full 360 Degree Rotation for Off-Axis Measurement

8.3 Do's and Don'ts

The TMAG5170 updates the result registers at the end of a conversion. SPI read of the result register needs to be synchronized with the conversion update time to ensure reading the updated result data. The conversion update time, t measure is defined in the Electrical Characteristics table. Figure 8-8 shows examples of correct and incorrect SPI read timings for applications with strict timing budgets. Use the ALERT signal to notify the controller when a conversion is complete.

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Figure 8-8. SPI Read During Continuous Conversion

9 Power Supply Recommendations

A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor with a value of at least 0.01 µF. Connect the TEST pin to ground.

10 Layout

10.1 Layout Guidelines

Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Halleffect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice. Magnetic fields also easily pass through most printed circuit boards (PCBs), which makes placing the magnet on the opposite side of the PCB possible.

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10.2 Layout Example

SCK ALERT SDI TEST SDO GND CS V CC Figure 10-1. Layout Example With TMAG5170 52 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

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11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Support Resources

TI E2E ™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.3 Trademarks

TI E2E ™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable part number (1)

Status Material type

(1) (2)

Package | Pins Package qty | Carrier RoHS

(3)

Lead finish/ Ball material MSL rating/ Peak reflow

(4) (5)

Op temp (°C) Part marking

(6)

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com 9-Nov-2025 OTHER QUALIFIED VERSIONS OF TMAG5170 : • Automotive : TMAG5170-Q1 NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Feb-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1 B0 W Reel Diameter

Cavity

A0 B0 K0 W P1 A0

Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants *All dimensions are nominal

Device Package Package Pins

Type Drawing SPQ Reel Reel A0

Diameter Width (mm)

(mm) W1 (mm) TMAG5170A1QDGKR VSSOP DGK 8 2500 330.0 12.4 TMAG5170A2QDGKR VSSOP DGK 8 2500 330.0 12.4 Pack Materials-Page 1 B0 (mm)

K0 (mm)

P1 (mm)

W Pin1 (mm) Quadrant 5.3 3.4 1.4 8.0 12.0 Q1 5.3 3.4 1.4 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Feb-2024 TAPE AND REEL BOX DIMENSIONS Width (mm)

W L H *All dimensions are nominal

PACKAGE OUTLINE

DGK0008A VSSOP - 1.1 mm max height

SCALE 4.000

SMALL OUTLINE PACKAGE C 5.05 TYP 4.75 A

0.1 C PIN 1 INDEX AREA SEATING

PLANE 6X 0.65 8 1 2X 3.1 2.9 NOTE 3 1.95 4

5

8X

B 3.1 2.9

NOTE 4 0.38 0.25 0.13 C A B 0.23 0.13 SEE DETAIL A

0.25 GAGE PLANE 1.1 MAX 0 -8 0.15 0.05 0.7 0.4

DETAIL A A 20 TYPICAL 4214862/A 04/2023 PowerPAD is a trademark of Texas Instruments. NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-187.

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EXAMPLE BOARD LAYOUT

TM DGK0008A VSSOP - 1.1 mm max height

SMALL OUTLINE PACKAGE SYMM 8X (1.4)

8X (0.45)

(R0.05) TYP 1 8 SYMM 6X (0.65)

5 4 SEE DETAILS (4.4)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 15X SOLDER MASK

OPENING METAL UNDER SOLDER MASK METAL SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX ALL AROUND

NON-SOLDER MASK

DEFINED (PREFERRED)

0.05 MIN ALL AROUND SOLDER MASK

DEFINED SOLDER MASK DETAILS 15.000 4214862/A 04/2023

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

9. Size of metal pad may vary due to creepage requirement.

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EXAMPLE STENCIL DESIGN

TM DGK0008A VSSOP - 1.1 mm max height

SMALL OUTLINE PACKAGE SYMM (R0.05) TYP 8X (1.4)

8X (0.45) 1 8 SYMM 6X (0.65)

5 4 (4.4)

SOLDER PASTE EXAMPLE

SCALE: 15X 4214862/A 04/2023

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

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Last updated 10/2025