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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet

Features and Benefits

Description

The MLX90363 is a monolithic magnetic sensor IC featuring the Tria⊗is® Hall technology. Conventional planar Hall technology is only sensitive to the flux density applied orthogonally to the IC surface. The Tria⊗is® Hall sensor is also sensitive to the flux density applied parallel to the IC surface. This is obtained through an Integrated Magneto-Concentrator (IMC) which is deposited on the CMOS die.

The MLX90363 is sensitive to three (B X , B Y and B Z ) components of the flux density applied to the IC. This allows the MLX90363 to sense any magnet moving in its surrounding and decode its position through an appropriate signal processing.

Using its Serial Interface the MLX90363 can transmit a digital output (SP – 64 bits per frame).

TSSOP-16

Applications

   Absolute Contacless Position Sensor Steering Wheel Position Sensor 3D Joystick Position Sensor The MLX90363 is intended for Embedded Position Sensor applications (vs. Stand-Alone “Remote” Sensor) for which the output is directly provided to a microcontroller (Master) close to the magnetometer IC MLX90363 (Slave). The SPI protocol confirms this intent.

The MLX90363 is using full duplex SPI protocol and requires therefore the separated SPI signal lines: MOSI, MISO, /SS and SCLK.

V DD V DEC 3V3 Regulator

DSP

Triaxis ® V X V Y V

ZRAM

MUX SOIC-8 G ADC EEPROM Output Stage

14 bit SPI Angle µC

14 bit SPI XYZ ROM - Firmware MISO

MOSI

SCLK

SS V SS MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

1. Ordering Information

Product Code Temperature Code Package Code Option Code Packing Form Code MLX90363 E DC ABB-000 RE MLX90363 E GO ABB-000 RE MLX90363 K DC ABB-000 RE MLX90363 K GO ABB-000 RE MLX90363 L DC ABB-000 RE MLX90363 L GO ABB-000 RE

Legend:

Temperature Code: E: from -40 Deg.C to 85 Deg.C

K: from -40 Deg.C to 125 Deg.C L: from -40 Deg.C to 150 Deg.C Package Code: “DC” for SOIC-8 package

“GO” for TSSOP-16 package (dual die) Option Code: ABB-xxx: die version

xxx-000: standard Packing Form: “RE” for Reel

“TU” for Tube Ordering Example: MLX90363LGO-ABB-000-RE

Table 1 - Legend REVISION 006 – DEC 2016 Page 2 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

Contents

Features and Benefits ................................................................................................................................... 1 Applications .................................................................................................................................................. 1 Description ................................................................................................................................................... 1 1. Ordering Information ............................................................................................................................... 2 2. Functional Diagram .................................................................................................................................. 6 3. Glossary of Terms ..................................................................................................................................... 6 4. Pinout ....................................................................................................................................................... 7 5. Pin Description ......................................................................................................................................... 8 6. Absolute Maximum Ratings ...................................................................................................................... 8 7. Electrical Specification .............................................................................................................................. 9 8. Isolation Specification ............................................................................................................................. 10 9. Timing Specification................................................................................................................................ 10

9.1. Timing Specification for 5V Application ......................................................................................... 10 9.2. Timing Specification for 3V3 Application ....................................................................................... 11 10. Accuracy Specification .......................................................................................................................... 12 11. Magnetic Specification ......................................................................................................................... 14 12. CPU & Memory Specification ............................................................................................................... 15 13. Serial Interface ..................................................................................................................................... 15

13.1. Electrical Layer and Timing Specification .................................................................................... 15 13.2. Serial Protocol .............................................................................................................................. 17 13.3. Message General Structure ......................................................................................................... 18 13.4. Regular Messages ........................................................................................................................ 20 13.4.1. Note for the regular message “X – Y – Z – diagnostic” (Marker = 2) .................................... 21 13.5. Trigger Mode 1 ............................................................................................................................. 21 13.6. Trigger Mode 2 ............................................................................................................................. 23 13.7. Trigger Mode 3 ............................................................................................................................. 24 13.8. Trigger Modes Timing Specifications ........................................................................................... 26 13.8.1. 5V Application ........................................................................................................................ 26 13.8.2. 3V3 Application ...................................................................................................................... 27 13.9. Opcode Table ............................................................................................................................... 29 13.10. Timing specifications per Opcode, and next allowed messages ............................................... 29 REVISION 006 – DEC 2016 Page 3 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet 13.11. NOP Command and NOP Answer .............................................................................................. 30 13.12. OscCounterStart and OscCounterStop Commands .................................................................. 31 13.13. Protocol Errors Handling............................................................................................................ 33 13.14. Ready, Error and NTT Messages ................................................................................................ 34 13.15. DiagnosticsDetails commands ................................................................................................... 35 13.16. MemoryRead message .............................................................................................................. 36 13.17. EEWrite Message ....................................................................................................................... 37 13.18. Reboot ........................................................................................................................................ 40 13.19. Standby ...................................................................................................................................... 40 13.20. Start-up Sequence (Serial Communication) .............................................................................. 41 13.21. Allowed sequences .................................................................................................................... 42 14. Traceability Information ....................................................................................................................... 43 15. End-User Programmable Items ............................................................................................................ 44 16. Description of End-User Programmable Items ..................................................................................... 45

16.1. User Configuration: Device Orientation ...................................................................................... 45 16.2. User Configuration: Magnetic Angle Formula ............................................................................. 45 16.3. User Configuration: 3D = 0 formula trimming parameters SMISM and ORTH_B1B2 ................ 45 16.3.1. Magnetic Angle ∠XY .............................................................................................................. 46 16.3.2. Magnetic Angle ∠XZ and ∠YZ ............................................................................................... 46 16.4. User Configuration: 3D = 1 formula trimming parameters KALPHA, KBETA, KT ........................ 47 16.5. User Configuration: Filter ............................................................................................................ 47 16.6. Virtual Gain Min and Max Parameters ........................................................................................ 47 16.7. Hysteresis Filter ............................................................................................................................ 48 16.8. EMC Filter on SCI Pins .................................................................................................................. 48 16.9. Identification & FREE bytes .......................................................................................................... 48 16.10. Lock ............................................................................................................................................ 48 17. Self Diagnostic ...................................................................................................................................... 49 18. Firmware Flowcharts ............................................................................................................................ 51

18.1. Start-up sequence ........................................................................................................................ 51 18.2. Signal Processing (GETx) .............................................................................................................. 52 18.3. Fail-safe Mode ............................................................................................................................. 52 Fail-safe mode – entry conditions ..................................................................................................... 53 18.4. Automatic Gain Control ............................................................................................................... 53 REVISION 006 – DEC 2016 Page 4 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet 19. Recommended Application Diagrams .................................................................................................. 54

19.1. MLX90363 in SOIC-8 Package and 5V Application ...................................................................... 54 19.2. MLX90363 in SOIC-8 Package and 3V3 Application .................................................................... 54 19.3. MLX90363 in TSSOP-16 Package and 5V Application ................................................................. 55 19.4. MLX90363 in TSSOP-16 Package and 3V3 Application ............................................................... 55 20. Standard information regarding manufacturability of Melexis products with different soldering

processes ............................................................................................................................................... 56 21. ESD Precautions .................................................................................................................................... 56 22. Package Information ............................................................................................................................. 57

22.1. SOIC-8 - Package Dimensions ...................................................................................................... 57 22.2. SOIC-8 - Pinout and Marking ....................................................................................................... 57 22.3. SOIC-8 - IMC Positionning ............................................................................................................ 58 22.4. TSSOP-16 - Package Dimensions ................................................................................................. 59 22.5. TSSOP-16 - Pinout and Marking ................................................................................................... 60 22.6. TSSOP-16 - IMC Positionning ....................................................................................................... 60 23. Disclaimer ............................................................................................................................................. 62 24. Contact ................................................................................................................................................. 62 REVISION 006 – DEC 2016 Page 5 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

2. Functional Diagram

V DEC V DD 3V3 Regulator

DSP V X V Y V Z RAM

MUX

Triaxis ®

G ADC EEPROM Output Stage

14 bit SPI Angle µC

14 bit SPI XYZ ROM - Firmware MISO

MOSI

SCLK

SS V SS Figure 1 – Block Diagram

3. Glossary of Terms

Gauss (G), Tesla (T) TC NC Byte Word ADC LSB MSB DNL INL RISC ASP DSP ATAN IMC CoRDiC EMC FE RE MSC FW HW Units for the magnetic flux density - 1 mT = 10 G Temperature Coefficient (in ppm/Deg.C.) Not Connected 8 bits

Table 2 – Glossary of Terms REVISION 006 – DEC 2016 Page 6 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

4. Pinout

REVISION 006 – DEC 2016 Page 7 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

5. Pin Description

Name Direction Type Function / Description V DD Supply Analog Supply (5V and 3V3 applications) MISO OUT Digital Master In Slave Out Test I/O Both Test Pin SCLK IN Digital Clock /SS IN Digital Slave Select MOSI IN Digital Master Out Slave In

5V Application V DEC I/O Analog Decoupling Pin 3V3 Application

Supply (Shorted to V DD ) V SS (Ground) GND Analog Ground

6. Absolute Maximum Ratings

Parameter Value Supply Voltage, V DD + 18 V Reverse V DD Voltage - 0.3 V Supply Voltage, V DEC + 3.6 V Reverse V DEC Voltage - 0.3 V Positive Input Voltage + 11 V Reverse Input Voltage - 11 V Positive Output Voltage V DD + 0.3 V Reverse Output Voltage - 0.3 V Operating Ambient Temperature Range, T A - 40 Deg.C … + 150 Deg.C Storage Temperature Range, T S - 40 Deg.C … + 150 Deg.C Magnetic Flux Density ± 700 mT Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximumrated conditions for extended periods may affect device reliability.

REVISION 006 – DEC 2016 Page 8 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

7. Electrical Specification

0.4 V 20 30 mA 25 30 mA For the dual version, the supply current is multiplied by 2 Above the MT8V threshold, no SPI communication is possible REVISION 006 – DEC 2016 Page 9 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

8. Isolation Specification

Only valid for the package code GO i.e. dual die version.

Parameter Symbol Isolation Resistance Test Conditions Min Between dice 4 Typ Max Units

MΩ

9. Timing Specification

9.1. Timing Specification for 5V Application

DC Operating Parameters at V DD = 5V (unless otherwise specified) and for T A as specified by the Temperature suffix (E, K or L).

Parameter Main Clock Frequency Symbol Test Conditions

Ck Min Typ 15.2 Trigger Mode 1 (Trg. Mod. 1),

Frame Rate Watchdog time-out FR Markers 0&2, SCI 2MHz

All other modes, markers and SCI Frequencies Units 18.8 MHz 1000 s -1 500 s -1 20 ms Wd See Section 17 15.3 Power On to First SCI message (Start-up Time) tStartUp See Section 13.20 20 ms SCI protocol: Slave-select rising-edge to falling-edge tShort 120 µs SCI protocol: EEWrite Time teewrite 32 ms Trimmed oscillator 18.8 Max Diagnostic Loop Time Internal 1MHz signal

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Parameter Symbol Test Conditions Min Typ Max Units

Sinewave Flux Density (3)

9.2. Timing Specification for 3V3 Application

DC Operating Parameters at V DD = 3.3V (unless otherwise specified) and for T A as specified by the Temperature suffix (E, K or L).

Parameter Main Clock Frequency Symbol Test Conditions

Ck Min Typ 13.1 Trigger Mode 1 (Trg. Mod. 1),

Frame Rate Watchdog time-out FR Markers 0&2, SCI 2MHz

All other modes, markers and SCI Frequencies Max Units 18.8 MHz 862 s -1 430 s -1 23.2 ms Wd See Section 17 15.3 Power On to First SCI message (Start-up Time) tStartUp See Section 13.20 23.2 ms SCI protocol: Slave-select rising-edge to falling-edge tShort 139 µs SCI protocol: EEWrite Time teewrite 37 ms Trimmed oscillator Diagnostic Loop Time Internal 1MHz signal tDiag t1us

3 Sensitivity monitors enabled (See section 17). Beyond that frequency, the Sensitivity monitor must be disabled. Contact Melexis for more details. 4 Limitation linked to the Automatic Gain Control. Beyond that frequency, there is a reduced immunity to norm change (e.g. through vibration). See also Section 18.4 REVISION 006 – DEC 2016 Page 11 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Parameter Symbol Test Conditions Min Typ Max Units MISO Rise Time C L = 30 pF, R L = 10 kΩ 35 60 ns MISO Fall Time C L = 30 pF, R L = 10 kΩ 35 60 ns

Magnetic Flux Density Frequency

10. Accuracy Specification

DC Operating Parameters at V DD = 5V (5V Application) or V DD = 3.3V (3V3 Application) and for T A as specified by the Temperature suffix (E, K or L).

Parameter Symbol ADC Resolution on the raw signals X, Y and Z R ADC Serial Interface Resolution R SI Offset on the Raw Signals X, Y and Z X0, Y0, Z0 Test Conditions Min Typ Max Units 14 bit On the angle value 14 bit On the X,Y,Z values 12 bit

Mismatch on the Raw Signals X, Y and Z SMISM XY SMISM XZ SMISM YZ Between X and Z (6) -30 30 % Between Y and Z (6) -30 30 %

Magnetic Angle Phase Error ORTH XY ORTH XZ

ORTH YZ Between X and Y -0.3 0.3 Deg. Between X and Z (7) -10 10 Deg. Between Y and Z (7) -10 10 Deg.

5 Limitation linked to the Automatic Gain Control. Beyond that frequency, there is a reduced immunity to norm change (e.g. through vibration). See also Section 18.4 6 The Mismatch between X or Y and Z can be reduced through the calibration of the SMISM (or k) factor in the end application. See section 16.3.2 for more information 7 The Magnetic Angle Phase error X or Y and Z can be reduced through the calibration of the ORTH_B1B2 factor in the end application. See section 16.3.2 for more information REVISION 006 – DEC 2016 Page 12 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Parameter Symbol Test Conditions Min Typ Max Units -1 1 Deg. -20 20 Deg.

-0.1 0.1 Deg.

20 mT -0.8 0.8 Deg. 50 mT -0.4 0.4 Deg.

20 mT -1 1 Deg. 50 mT -0.6 0.6 Deg. Temperature suffix E and K -30 30 LSB 14 Temperature suffix L -45 45 LSB 14

XY axis, XZ axis, YZ axis Temperature suffix E and K -0.5 0.5 % Temperature suffix L -0.7 0.7 % XY axis, XZ axis, YZ axis -0.1 0.1 Deg.

Intrinsic Linearity Error (8) Le Magnetic Angle ∠ XY

Magnetic Angle ∠ XZ, ∠ YZ (9) 5V Application

3V3 Application

Supply Dependency Temperature suffix E and K Temperature suffix L Thermal Offset Drift (10)

Thermal Drift of Sensitivity Mismatch (11)

Thermal Drift of Magnetic Angle Phase Error 8 The Intrinsic Linearity Error is a consolidation of the IC errors (offset, sensitivity mismatch, phase error) taking into account an ideal rotating field. Once associated to a practical magnetic construction and the associated mechanical and magnetic tolerances, the output linearity error increases. 9 The Intrisic Linearity Error for Magnetic Angle ∠ XZ, ∠ YZ can be reduced through the programming of the SMISM (or k) factor and ORTH_B1B2. By applying the correct compensation, a non linearity error of +/-1 Deg. can be reached. See section 16.3.2 for more information 10 For instance, Thermal Offset Drift equal ± 30 LSB

14 yields to max. ± 0.32 Deg. error. This is only valid if the Virtual Gain is not fixed (See Section 18.4). See Front End Application Note for more details 11 For instance, Thermal Drift of Sensitivity Mismatch equal ± 0.4 % yields to max. ± 0.1 Deg. error. See Front End Application Note for more details REVISION 006 – DEC 2016 Page 13 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Parameter Symbol Test Conditions Min Typ Max Units 20mT, No Filter 0.2 Deg. 50mT, No Filter 0.1 Deg.

20mT, No Filter 0.25 Deg. 50mT, No Filter 0.12 Deg.

20mT, No Filter 12 LSB 14 50mT, No Filter 6 LSB 14 50mT, FILTER = 1 4 LSB 14 20mT, No Filter 14 LSB 14 50mT, No Filter 7 LSB 14 50mT, FILTER = 1 4 LSB 14 Temperature suffix E and K Magnetic Angle Noise (12) Temperature suffix L Temperature suffix E and K Raw signals X, Y, Z Noise (12) Temperature suffix L

11. Magnetic Specification

DC Operating Parameters at V DD = 5V (5V Application) or V DD = 3.3V (3V3 Application) and for T A as specified by the Temperature suffix (E, K or L).

Parameter Symbol Magnetic Flux Density in X or Y Min Typ Max Units B X , B Y 20 50 70 (13) mT Magnetic Flux Density in Z B Z 24 75 126 mT

Magnet Temperature Coefficient TCm -2400

IMC Gain in X and Y (14) GainIMC XY 1.2 IMC Gain in Z (14) GainIMC Z 1.1 k factor k Test Conditions GainIMC XY / GainIMC Z 1 ppm/ 0 1.4 Deg.C 1.8 1.3 1.2 1.5 12 Noise is defined by ± 3 σ for 1000 successive acquisitions. The application diagram used is described in the recommended wiring (Section 20). For detailed information, refer to section Filter in application mode (Section 16.5). 13 Above 70 mT, the IMC starts saturating yielding to an increase of the linearity error. 14 This is the magnetic gain linked to the Integrated Magneto Concentrator structure. This is the overall variation. Within one lot, the part to part variation is typically ± 10% versus the average value of the IMC gain of that lot.

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet

12. CPU & Memory Specification

The digital signal processing is based on a 16 bit RISC µController featuring

 ROM & RAM  EEPROM with hamming codes (ECC)  Watchdog  C Compiler

Parameter Symbol Test Conditions Min Typ Max Units ROM 14 KB RAM 256 B EEPROM 64 B 3.5 MIPS CPU MIPS Ck = 15 MHz

13. Serial Interface

The MLX90363 serial interface allows a Master device to operate the position sensor. The MLX90363 interface allows Multi-Slave applications and synchronous start of the data acquisition among the Slaves. The interface offers 2 Mbps data transfer bit rate and is full duplex. The interface accepts messages of 64 bits wide only, making the interfacing robust.

In this document, the words message, frame and packet refer to the same concept.

13.1. Electrical Layer and Timing Specification

Message transmissions start necessarily at a falling edge on /SS and end necessarily at a rising edge on the /SS signal. This defines a message. The serial interface counts the number of transmitted bits and declares the incoming message invalid when the bit count differs from 64. The Master must therefore ensure the flow described below:

1. Set pin /SS Low 2. Send and receive 8 bytes or 4 words 3. Set pin /SS High

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet The MISO and MOSI signals change on SCLK rising edge and are captured on SCLK falling edge. The mostsignificant-bit of the transmitted byte or word comes first (15) .

30 ns 15 For instance, for Master compatible w/ the Motorola SPI protocol, the configuration bits must be CPHA=1, CPOL=0, LSBFE=0.

REVISION 006 – DEC 2016 Page 16 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Parameter /SS FE to SCLK RE /SS FE to MISO Low Impedance SCLK FE to /SS RE /SS RE to MISO High Impedance Sync Pulse Duration Symbol t1 t2 Test Conditions Min

tSyncPulse Max Units

t3 t4 Typ 225 ns

Table 3 – Serial Interface Timing Specifications

Melexis recommends using the Multi-Slave application diagram as shown on the right.

The SCLK, MISO and MOSI wires interconnect the Slaves with the Master. A Slave is selected by its dedicated /SS input. A Slave MISO output is in high-impedance state when the Slave is not selected.

Slave 1 Master

SCLK MOSI MISO SS1 SS2 SS3 SCLK MOSI MISO SS

Slave 2 SCLK MOSI MISO SS Slave 3 Slaves can be triggered synchronously by sending Sync pulses on the different /SS. The pulses must not overlap to avoid electrical short-circuits on the MISO bus.

SCLK MOSI MISO SS

13.2. Serial Protocol

The serial protocol of MLX90363 allows the SPI Master device to request the following information:

 Position (magnetic angle Alpha)  Raw field components (X,Y and Z)  Self-Diagnostic data

It allows customizing the calibration of the sensor, when needed, at the end-of-line, through EEPROM programming.

The serial protocol offers a transfer rate of 1000 messages/sec. A regular message holds position and diagnostic information. The data acquisition start and processing is fully under the control of the SPI Master. The user configuration bits, stored in EEPROM, are programmable with this protocol.

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Data integrity is guaranteed in both directions by an 8 bit CRC covering the content of the incoming and outgoing messages.

13.3. Message General Structure

A message has a unique Opcode. The general structure of a message consists of 8 bytes (byte #0, transmitted first, to byte #7 transmitted last).

Byte #7 (the last byte transmitted) holds an 8 bit CRC. The byte #6 holds a Marker plus either an Opcode or a rolling counter (6 bit Roll Counter).

1 7 (4)

6 5 4 3 3 1 0

(3)

0 7 (2)

6 5 4 3 2 1 2 5 7 2 0

(1) (5) 4 CRC 6 Marker Opcode or Roll Counter

Table 4 – General Structure of a message and bit naming convention

(1) This bit is named Byte0[0] (2) This bit is named Byte0[7]

(3) This bit is named Byte1[0] (4) This bit is named Byte1[7]

(5) This bit is named Byte2[0]

A blank cell refers necessarily to a bit 0.

In a byte, the most-significant-bit is transmitted first (for instance, Byte0[7] is transmitted first, Byte0[0] transmitted last).

Parameter CRC[7:0] is Byte7[7:0], Parameter Marker[1:0] is Byte6[7:6],

Parameter Opcode[5:0] (or Roll Counter[5:0]) is Byte6[5:0]

CRCs are encoded and decoded according the following algorithm (language-C):

crc = 0xFF; crc = cba_256_TAB[ Byte0 ^ crc ]; crc = cba_256_TAB[ Byte1 ^ crc ]; crc = cba_256_TAB[ Byte2 ^ crc ]; crc = cba_256_TAB[ Byte3 ^ crc ]; crc = cba_256_TAB[ Byte4 ^ crc ]; crc = cba_256_TAB[ Byte5 ^ crc ]; crc = cba_256_TAB[ Byte6 ^ crc ]; crc = ~crc;

The Table 5 corresponds to the CRC-8 polynomial “0xC2”.

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MLX90363 Magnetometer IC with High Speed Serial Interface

Table 5 – cba_256_TAB Look-up table Polynomial “C2” REVISION 006 – DEC 2016 Page 19 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet # 1 7 6 5 4 3

0xFF 2 1 0 #

0 7 6 5 4 3

0xC1 3 0xFF 2 0x16 5 0xFF 4 0xD4 7 0x23 6 0x86 2 1 0 Table 6 – Example of valid CRC

13.4. Regular Messages

The MLX90363 offers three types of regular messages:

 “α” – diagnostic  “α – β” – diagnostic  X – Y – Z – diagnostic

1 7 E1 6 E0 5 4 3 2 1

ALPHA [13:8] 0 #

0 7 6 5 4 3 2

ALPHA [7:0] 3 0 2 0 5 0 4 VG[7:0] 7 CRC 6 0 0 1 0 ROLL

Table 7 – “α” message # 1 7 E1 6 E0 5 3 4 3 2 1

ALPHA [13:8] 0 #

0 BETA [13:8] 2 5 0 4 7 CRC 6 7 6 5 4 3 2

ALPHA [7:0] 1 0 BETA [7:0] VG[7:0] 0 1 ROLL

Table 8 – “α – β” message # 1 7 E1 6 E0 5 4 3 2 1

X COMPONENT [13:8] 0 #

0 7 6 5 4 3 2

X COMPONENT [7:0] 3 Y COMPONENT [13:8] 2 Y COMPONENT [7:0] 5 Z COMPONENT [13:8] 4 Z COMPONENT [7:0] 7 CRC 6 1 0 1 0 ROLL Table 9 – “X – Y – Z” message

The bits Byte6[7] and Byte6[6] are markers. They allow the Master to recognize the type of regular message (00b, 01b, 10b). The marker is present in all messages (incoming and outgoing). The marker of any message which is not a regular message is equal to 11b.

The bits E1 and E0 report the status of the diagnostics (4 possibilities) as described in the Table 10 – See section 17 for more details.

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MLX90363 Magnetometer IC with High Speed Serial Interface

Table 10 - Diagnostics Status Bits

13.4.1. Note for the regular message “X – Y – Z – diagnostic” (Marker = 2)

In the case of Marker = 2d, the X, Y, Z components are given after offset compensation and filtering (see signal processing in section 18.2). These components are gain dependent (see also section 18.4).

Although being 12 bit resolution signals, the X, Y, Z components are coded on 14 bits. For proper decoding, the values must be shifted twice to the left in order to get a 16 bit signed value (2’s complementary).

The sensitivity in the X and Y direction is always higher than the Z direction by the IMC Gain factor (see parameter k factor in section 11). Melexis therefore recommends multiplying the Z component by the k factor inside the Master in order to use the MLX90363 as a 3D magnetometer.

13.5. Trigger Mode 1

The Master sends a GET1 command to initiate the magnetic field acquisition and post-processing. It waits tSSREFE, issues the next GET1 and receives at the same time the regular message resulting from the previous GET.

The field sensing, acquisition and post-processing is starting on /SS rising edge events.

Although GET1 commands are preferably followed by another GET1 command or a NOP command, any other commands are accepted by the Slave.

FW SPI HW background Get

tSSREFE SPI ASP DSP SPI ASP DSP SPI ASP DSP SPI Get Get NOP

XFigure 4 – Trigger Mode 1 REVISION 006 – DEC 2016 Page 21 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Message Sequence Chart Single Slave - Mode 1

Slave Master

GET1 ( à ) NTT ( ß )

Loop

GET1 ( à ) Regular Packet ( ß )

NOP ( à ) Regular Packet ( ß )

Figure 5 – Trigger Mode 1 Message Sequence Chart # 1 7 3 5 7 6 5 4 3 2 1 0

RST Time – Out CRC # 0 2 4 6 7 6 5 4 3 2 1 0 0 1 1 Value Marker 0 1 0 Table 11 – GET1 MOSI Message (Opcode = 19d)

Note: The NOP message is described at section 13.11.

The parameter Marker defines the regular data packet type expected by the Master:

 Marker = 0 refers to frame type “ALPHA + Diagnostic”.  Marker = 1 refers to frame type “ALPHA + BETA + Diagnostic”.  Marker = 2 refers to frame type “Components X + Y + Z +Diagnostic”.

The parameter RST (Byte1[0]) when set, resets the rolling counter attached to the regular data packets.

The parameter TimeOutValue tells the maximum life time of the Regular Data Message.

The time step is t1us (See table in Section 9), the maximum time-out is 65535 * t1us. The time-out timer starts when the message is ready, and stops on the /SS rising edge of the next message.

On time-out occurrence, there are two possible scenarios:

 Scenario 1: /SS is high, there is no message exchange. In this case, a NTT message replaces the

regular message in the SCI buffer.  Scenario 2: /SS is low, the regular packet is being sent out. In this case, the timeout violation is

reported on the next message, this later being an NTT message.

The master must handle the NTT errors as described in Table 30 – Protocol Errors Handling (Master standpoint).

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet

13.6. Trigger Mode 2

The Trigger Mode 1 works without Sync pulses, as the GET1 command plays the role of a sync pulse. When a delay between the regular message readback and the start of acquisition is needed, or when two or more Slaves should be triggered synchronously, the use of a sync pulse is required, and this is the meaning of the Trigger Mode 2.

Principle: The Master first enables the trigger mode 2 by issuing a GET2 command.

The Master then sends a Sync Pulse, at the appropriate time, to initiate the magnetic field acquisition and post-processing.

Finally the Master reads the response message with a NOP or a GET2. The GET2 command re-initiates a sync pulse triggered acquisition, whereas the NOP command would just allow the Master to receive the latest packet.

tSyncFE Figure 6 – Trigger Mode 2 – Single Slave Approach

A timing constraint between GET2 and the Sync pulse (tRESync) should be met.

When this timing is smaller than the constraint, the sync pulse might not be taken in account, causing the next GET2 to return a NTT packet.

GET1 and GET2/Sync pulse can be interlaced.

Multi-Slave approach: The way of working described below fits the Multi-Slave applications where synchronous acquisitions are important. GET2 commands are sent one after the other to the Slaves. Then the Sync pulses are sent almost synchronously (very shortly one after the other).

FW1 SPI HW1 FW2 SP background

Get2 for Slave 1 and Get2 for Slave 2 do not overlap

Figure 7 – Trigger Mode 2 – Multi-Slave approach, example for two Slaves REVISION 006 – DEC 2016 Page 23 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Message Sequence Chart Dual Slave - Mode 2 (Sync pulses)

Slave2 Slave1 Master

GET2 ( à ) NTT ( ß )

GET2 ( à ) NTT ( ß ) Sync Pulse Loop GET2 ( à )

Regular Packet ( ß )

GET2 ( à ) Regular Packet ( ß ) Sync Pulse NOP ( à ) Regular Packet ( ß )

NOP ( à ) Regular Packet ( ß )

Figure 8 – Trigger Mode 2 Message Sequence Chart # 1 7 6 5 3 5 7 4 3 2 Time – Out CRC 1 0

RST # 0 2 4 6 7 6 5 4 3 2 1 0 1 0 0 Value Marker 0 1 0 Table 12 – GET2 MOSI Message (Opcode = 20d)

Parameter definition: See GET1 (Section 13.5).

13.7. Trigger Mode 3

Principle: The acquisition sequences are triggered by a GET message, but unlike the Mode 1, the resulting data (position …) is buffered. The MISO messages contain the buffered data of the previous GET message, and not the newly computed values corresponding to the current GET MOSI request. The buffering releases constraints on the SCI clock frequency (SCLK). The Mode 3 offers frame rates as high as Mode 1, if not higher, with slower SCLK frequencies. When the clock frequency is limited (400 kbps or less), and when it matters to reach a certain frame rate, Mode 3 is preferred over Mode 1. In any other cases, for instance when the shortest response time represents the main design criteria, Mode 1 is preferred.

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet FW background SPI HW ASP SPI SP DSP SPI ASP ASP I DSP Get3 Get3

DSP DSP ASP SPI Get3 tSSREFE_ SPI DSP NOP Roll=1 X Roll=2 Figure 9 – Trigger Mode 3

GET3 sequences must end with a NOP.

Message Sequence Chart Single Slave - Mode 3

Master Slave

GET3 ( à ) X ( ß ) GET3 ( à ) Get3Ready ( ß )

Loop GET3 ( à )

Regular Packet ( ß )

NOP ( à ) Regular Packet ( ß )

Figure 10 – Trigger Mode 3 Message Sequence Chart # 1 7 6 5 4 3 2 1 0

RST Time – Out 3 5 7 # 0 2 4 6 CRC 7 6 5 4 3 2 1 0 1 0 1 Value Marker 0 1 0 Table 13 – GET3 MOSI Message (Opcode = 21d)

Parameter definition: See GET1 (Section 13.5)

1 3 5 7 7 6 5 4 3 CRC 2 1 0

0 2 4 6 7 6 5 4 3 2 1 0 1 1 1 0 1 1 0 1 Table 14 – Get3Ready MISO Message (Opcode = 45d)

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MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

13.8. Trigger Modes Timing Specifications

/SS Pin GET1 GET1 tREFE_mod1 SCI Internal state High: NTT Low: Ready tReady_mod1 Figure 11 – Trigger Mode 1 timing diagram /SS Pin SyncPulse GET2 GET2

tRESync SCI Internal state High: NTT Low: Ready tSyncFE tReady_mod2

Figure 12 – Trigger Mode 2 timing diagram /SS Pin GET3 SCI Internal state High: NTT Low: Ready GET3 tREFE_mod3 tReady_FEmod3 tRERE_mod3 tReady_REmod3 High: DSP Ongoing

Figure 13 – Trigger Mode 3 timing diagram

13.8.1. 5V Application

Table 15 – Trigger Mode 1 Timing Specification (V DD =5V)

REVISION 006 – DEC 2016 Page 26 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet Items tSyncFE tReady_mod2 tRESync Definition Sync Pulse (RE) to Get2 Falling Edge Sync Pulse (RE) to SO Answer ReadyToTransmit Marker Min Typ Max Unit

REVISION 006 – DEC 2016 Page 27 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet Items tSyncFE tReady_mod2 tRESync Definition Sync Pulse (RE) to Get2 Falling Edge Sync Pulse (RE) to SO Answer ReadyToTransmit Marker Min Typ Max Unit

0 1014 μs 1 1165 μs 2 1014 μs 0 1014 μs 1 1165 μs 2 1014 μs Get2 SS Rising Edge to Sync Pulse (RE) 93 μs

Table 19 – Trigger Mode 2 Timing Specification (V DD =3.3V)

Items tRERE_mod3 Definition Get3 SS RE to RE tReadyRE_mod3 Get3 SS RE to DSP Completion tREFE_mod3 Get3 SS Rising to Falling tReadyFE_mod3 Get3 SS RE to SO Answer ReadyToTransmit Marker Min Typ Max Unit

0 1102 μs 1 1253 μs 2 1102 μs 0 1102 μs 1 1253 μs 2 1102 μs

105 μs

105 μs

Table 20 – Trigger Mode 3 Timing Specification (V DD =3.3V)

REVISION 006 – DEC 2016 Page 28 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

tSyncFE GET2, MemoryRead, DiagDetails, NOP tREFE_mod3 GET3, MemoryRead, DiagDetails, NOP Page 29 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet Op MOSI Message tREFE Next allowed MOSI message 1d MemoryRead tShort MemoryRead, DiagDetails, NOP 3d EEWrite tShort EEReadChallenge 5d EEChallengeAns teewrite NOP 15d EEReadChallenge tShort EEChallengeAns 16d NOP / Challenge tShort All commands 22d DiagnosticDetails tShort All commands 24d OscCounterStart tShort OscCounterStop 26d OscCounterStop tShort NOP 47d Reboot tStartup See Startup Sequence 49d Standby tShort All commands

Table 22 – Response time and Next allowed MOSI messages

13.11. NOP Command and NOP Answer

1 3 5 7 7 6 5 4 3 2 1 KEY [15:8] CRC 0

0 2 4 6 7 6 5 4 3 2 1 0 0 0 0 KEY [7:0] 1 1 0 1 0 Table 23 – NOP (Challenge) MOSI Message (Opcode = 16d)

MSC NOP Master Slave

NOP(Challenge) ( à )

X ( ß ) Next Cmd ( à ) Challenge Echo ( ß )

Figure 15 – NOP Message Sequence Chart

Note: the message X means “unspecified valid answer” and typically contains the answer of the previous command.

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet  Parameter KEY: any 16 bit number

1 3 7 6 5 4 3 2 1 0 KEY_ECHO [15:8] # 0 2 5 INVERTED KEY_ECHO [15:8] 4 7 CRC 6 7 6 5 4 3 2 1 0 0 1 KEY_ECHO [7:0] INVERTED KEY_ECHO [7:0] 1 1 0 1 0 0 Table 24 - Challenge Echo MISO Message (Opcode = 17d)

 Parameter KEY_ECHO = KEY  Parameter INVERTED KEY_ECHO = 65535 - KEY (meaning bit reversal).

13.12. OscCounterStart and OscCounterStop Commands

The SCI Master can evaluate the Slave’s internal oscillator frequency by the use of the OscCounterStart and OscCounterStop commands. This first command enables in the MLX90363 a software counter whereas the second command stops it and returns the counter value.

0 2 4 6 7 6 5 4 3 2 1 0 1 1 CounterValue[7:0] 1 1 0 1 1 0 Table 28 – OscCounter MISO message (opcode 27d)

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Parameter CounterValue represents the time between the two events OscCounterStart Slave Select Rising Edge and OscCounterStop Slave Select Rising Edge, in µs, and for an oscillator frequency equal to 19MHz exactly.

The oscillator frequency can be calculated using the formula:

Message Sequence Chart Oscillator Frequency Diagnostic

Slave Master

OscCounterStart ( à ) Challenge Echo ( ß )

OscCounterStop ( à )

OscStartAck ( ß )

X ( à ) OscCounter ( ß )

Figure 16 – Oscillator Frequency Diagnostic Message Sequence Chart SI SO SS OscStart OscStop X StartAck OscCounter X tOscCounter

Figure 17 – Oscillator Frequency Diagnostic Timing Diagram (SCI)

Parameter Symbol

tOscCounter REVISION 006 – DEC 2016 Test Condition Min Typ Max Unit

500 1000 30000 µs Page 32 of 62

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Datasheet

13.13. Protocol Errors Handling

Error Item Error definition Condition Detection Slave Actions MISO Message IncorrectBitCount MOSI Message bit

all modes FW reads the HW

bit counter Ignore Message + Reinit Protocol Error Message (incorrect

IncorrectCRC MOSI Message

has a CRC Error all modes FW computes CRC Ignore

Message + Reinit Protocol Error Message (incorrect CRC = 1) IncorrectOpcode Invalid MOSI

Message all modes FW Ignore

Message + Reinit Protocol Error Message (incorrect

NTT + Re-init Protocol NTT message Table 29 – Protocol Errors Handling (Slave standpoint)

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Error Items/Events Associated Slave

Event Master recommended actions Associated Slave Actions Next MISO message Receive NTT Receive NTT Protocol re-

initialization Protocol reinitialization Error Message *

Receive Incorrect CRC / Receive Incorrect Opcode undetected event Protocol re-

initialization none Normal message Receive Error Message Send Error Message Protocol re-

initialization none Normal message Receive an unexpected DiagDetails message Run in fail-safe mode Protocol reinitialization + Slave reset none DiagDetails

message Table 30 – Protocol Errors Handling (Master standpoint)

Notes

 On NTT or Error messages, Master should consider that the last command is ignored by the Slave,

and it should therefore, either resend the command, or more generally re-initialize the protocol.  After protocol re-initialization, Master can diagnose the communication with a NOP command.  A MISO Error message implicitly means that the Slave has re-initialized the communication and is

therefore ready to receive any commands.

13.14. Ready, Error and NTT Messages

After power-on-reset, the first MISO message is a Ready message.

1 3 5 7 7 6 5 4 3 2

FWVersion[15:8] 1 0 CRC # 0 2 4 6 7 6 5 4 3 2

HWVersion[7:0] 1 0 1 1 1 0 0 0 1 1 Table 31 – Ready MISO Message (Opcode = 44d)

The MLX90363 reports protocol errors using the Error message defined below. Diagnostics Errors (as opposed to protocol errors) are reported with the bits E1 and E0 of the regular message.

1 3 5 7 7 6 5 4 3 CRC 2 1 0

0 2 4 6 7 6 5 1 1 1 4 3 2 ERROR CODE 1 1 1 1 0 0 1 Table 32 – Error Message MISO (Opcode = 61d)

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Datasheet The description of the parameter ErrorCode is give in the table below.

Code Description of Error CODE 1 Incorrect BitCount 2 Incorrect CRC Answer = NTT message 3

Two reasons: Answer Time-Out or Answer not Ready OPCODE not valid 4 In most of the timing violations, the Slave answers with a NTT message. A NTT message is stored in the Slave’s ROM (as opposed to the Slave’s RAM). NTT messages are typically seen in case of timing violation: either the firmware is still currently processing the previous SCI command, or a time-out occurred (see GET). In normal operation, NTT messages are not supposed to be observed: the Master is supposed to respect the protocol timings defined.

1 7 6 3 1 5 1 5 1 4 3 2 1

1 0 1 1 1 7 # 0 7 6 2 1 4 CRC 6 5 4

1 1 1 1 1 3 1 1 1 2 1 0

1 1 1 1 1 1 1 1 1 0 Table 33 – NTT (Nothing To Transmit) Message (Opcode = 62d)

13.15. DiagnosticsDetails commands

This is the only function that can be combined with a regular message.

1 3 5 7 7 6 5 4 3 2 1 0 CRC # 0 2 4 6 7 6 5 4 3 2 1 0 1 1 0 1 0 1 1 0 Table 34 – DiagnosticsDetails MOSI Command (Opcode = 22d)

Use DiagnosticDetails to get a detailed analysis of the diagnostics.

1 3 5 7 7 D15 6 D14 FSMERC 5 D13 4 D12 3 D11 2 D10 ANADIAGCNT CRC 1 D9 0 D8 # 0 7 D7 6 D6 5 D5 4 D4 3 D3 2 D2 1 D1 0 D0 2 4 6 0 0 0 D20 D19 D18 D17 D16 1 1 0 1 0 1 1 1 Table 35 – Diagnostics DiagnosticDetails MISO message (Opcode = 23d)

Diagnostic bit Dx: see Section 17

Parameter ANADIAGCNT is a sequence loop counter referring to the analog-class diagnostics (all others).

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Datasheet If FSMERC = 3, ANADIAGCNT takes another meaning:

 193 protection error interruption happened  194 invalid address error interruption happened  195 program error interruption happened  196 exchange error interruption happened  197 not connected error interruption happened  198 Stack Interrupt  199 Flow Control Error

Parameter FSMERC reports the root-cause of entry in fail-safe mode

 FSMERC = 0: the chip is not in fail-safe mode  FSMERC = 1: BIST error happened and the chip is in fail-safe mode  FSMERC = 2: digital diagnostic error happened and the chip is in fail-safe mode  FSMERC = 3: one of the 5 error interruptions listed above happened and the chip is in fail-safe mode

13.16. MemoryRead message

1 7 3 5 7 6 5 4 3 2

ADDR0[15:8] ADDR1[15:8] CRC 1 0 #

0 2 4 6 7 6 5 4 3 2

ADDR0[7:0] 1 0 0 1 ADDR1[7:0] 1 1 0 0 0 0 Table 36 – MemoryRead MOSI Message (Opcode = 1d)

MemoryRead returns two EEPROM or RAM words respectively pointed by the parameters ADDR0, ADDR1.

The parameter ADDRx has three valid ranges: 0x0000 … 0x00FE for RAM access, 0x1000 ... 0x103E for EEPROM access, and 0x4000 … 0x5FFE for ROM access REVISION 006 – DEC 2016 Page 36 of 62

MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet MSC MemoryRead Master Slave

MemoryRead ( à )

X ( ß ) Loop MemoryRead ( à )

MemoryRead ( ß )

Next Cmd ( à ) MemoryRead ( ß )

Figure 18 – MSC for RAM/ROM/EEPROM Memory Read

Note: Enter the loop for complete memory dumps.

MemoryRead MISO Message (opcode 2d)

The address ADDR may be valid or not:

Case of validity: MemoryRead returns normally the data word pointed by ADDR

Case of invalidity: MemoryRead returns DataWord = 0.

Note: FW makes sure that invalid addresses do not cause memory access violation # 1 7 6 3 5 7 5 4 3 2 1 DATA[15:8] AT ADDR0 0 DATA[15:8] AT ADDR1 # 0 2 4 6 CRC 7 6 5 4 3 2

DATA[7:0] AT ADDR0 1 0 1 0 DATA[7:0] AT ADDR1 1 1 0 0 0 0 Table 37 – MemoryRead MISO Message (Opcode = 2d)

13.17. EEWrite Message

1 7 0 6 0 5 4 3 2 1

(16) ADDRESS[5:0] 0 #

0 3 KEY[15:8] 2 5 DATA WORD[15:8] 4 7 CRC 6 7 6 5 4 3 2 1 0 1 1 KEY[7:0] DATA WORD[7:0] 1 1 0 0 0 0 Table 38 – EEWrite MOSI Message (Opcode = 3d)

16 The value of the ADDRESS[5:0] shall be even.

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet The EEPROM data consistency is guaranteed through two protection mechanisms: A and B.

Protection A: The parameter ADDRESS should match the parameter KEY.

The key associated to each address is public. Protection against erroneous write (in the field) is guaranteed as long as the keys are not stored in the Master (ECU), but in the calibration system, which is typically a CAN or LIN Master.

Protection B: Slave challenges the Master with a randomly generated CHALLENGE KEY, expects back this key exclusive-or with 0x1234 MSC EEPROMWrite (Case of Failing Challenge)

MSC EEPROMWrite (Case of Erroneous Key)

MSC EEPROMWrite Slave Master Slave Master Slave Master

EEWrite(Addr,Key)( à )

X ( ß )

EEWrite(Addr,Key)( à )

X ( ß )

EEWrite(Addr,Key)( à )

X ( ß ) EEReadChallenge ( à )

EEChallenge ( ß )

EEReadChallenge ( à ) EEWriteStatus ( ß )

EEReadChallenge ( à )

EEChallenge ( ß ) EEChallengeAns ( à ) EEReadAnswer ( ß )

EEChallengeAnsr ( à ) EEReadAnswer ( ß )

tEEWrite tEEWrite NOP ( à ) EEWriteStatus ( ß ) NOP ( à ) EEWriteStatus ( ß )

Figure 19 – MSCs EEWrite ADDRESS[3:1] ADDRESS[5:4]

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet # 1 3 5 7 7 6 5 4 3 2 1 0 CHALLENGE KEY [15:8] CRC # 0 2 4 6 7 6 5 4 3 2 1 0 0 0 CHALLENGE KEY [7:0] 1 1 0 0 0 1 Table 41 – EEWrite EEChallenge MISO Message (Opcode = 4d)

The parameter CHALLENGE KEY is randomly generated by the sensor, and should be echoed because of the next command # 1 3 7 6 5 4 3 2 1 0 KEY ECHO [15:8] # 0 2 5 INVERTED KEY ECHO [15:8] 4 7 CRC 6 7 6 5 4 3 2 1 0 0 1 KEY ECHO [7:0] INVERTED KEY ECHO [7:0] 1 1 0 0 0 1 Table 42 – EEWrite ChallengeAns MOSI Message (Opcode = 5d)

The parameter KEY ECHO should match CHALLENGE KEY exor’ed with 0x1234.

The parameter INVERTED KEY ECHO should match KEY ECHO after bit reversal.

1 3 4 7 7 6 5 4 3 2 1 0 CRC # 0 2 4 6 7 6 5 4 3 2 1 0 1 1 1 0 1 0 0 0 Table 43 – EEReadAnswer MISO Message (Opcode = 40d)

1 3 4 7 7 6 5 4 3 2 CRC 1 0

0 2 4 6 7 6 5 4 3 2 1

CODE 0 1 1 0 0 1 1 0 1 Table 44 – EEWriteStatus MISO Message (Opcode = 14d)

The parameter Code details the exact cause of EEPROM write failure

 1 Success  2 Erase/Write Fail  4 EEPROM CRC Erase/Write Fail  6 Key Invalid  7 Challenge Fail  8 Odd Address

The command Reboot must be sent after a series of EEPROM writes, to make sure that the new EEPROM parameters are taken into account.

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Datasheet

13.18. Reboot

Reboot is a valid command in the following three cases.

After an EEPROM write In fail-safe mode In standby mode

In normal mode, Reboot reports wrong opcode.

Reboot causes a system reset identical to a true power-on reset. Start-up timings and sequences are applicable for the reboot message.

Reboot, after EEPROM programming

It is meant to force the FW to refresh the EEPROM cache and I/O space after a series of EEPROM write commands. It forces the FW to take into account all the changes (modes enabling, disabling...) including those that are not cached.

Reboot, in fail-safe mode

ECU can issue a Reboot message to exit the fail-safe mode before the watchdog time-out, for a fast recovery.

1 3 4 7 7 6 5 4 3 2 1 0 CRC # 0 2 4 6 7 6 5 4 3 2 1 0 1 1 1 0 1 1 1 1

Table 45 – Reboot (Opcode = 47d)

13.19. Standby

Standby sets the sensor in Standby mode: the digital clock is stopped and some analog blocks are switched off. The SCI clock remains active, allowing the sensor to be responsive to SCI messages. Standby is a valid command only after a NOP or a DiagnosticDetails.

The first SCI message received while in Standby wakes up the sensor. The Standby mode is precisely exited on the SS rising edge. The first message following a Standby message is normally interpreted by the sensor. It can be NOP, a GET or anything else.

1 3 4 7 7 6 5 4 3 CRC 2 1 0

0 2 4 6 7 6 5 4 3 2 1 0 1 1 1 1 0 0 0 1

Table 46 – Standby (Opcode = 49d)

The sensor answer to Standby is StandbyAck (opcode 50). After resuming, the diagnostic status bits (E1, E0) of the 6 following GET messages shall be ignored.

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13.20. Start-up Sequence (Serial Communication)

The MLX90363 serial interface is enabled after the internal start-up initializations and start-up checks.

Note: The start-up sequence of the MLX90363 firmware is described at chapter 18.1.

The recommended SCI start-up sequences (Master – Slave) are depicted in the following message sequence charts, and timing diagrams. It usually starts with a NOP MOSI message. Ready is the first MISO message.

The start-up sequence timing diagram with verification of the oscillator frequency is depicted in Figure 22. It’s not mandatory to perform such check, even from a safety point of view.

Message Sequence Chart Start-up Sequence (Basic Scenario)

Master Slave

NOP(Challenge) ( à )

Ready ( ß )

GETx ( à ) Challenge Echo ( ß )

Loop

GETx ( à ) Regular Packet ( ß )

Figure 20 – MSCs Start-up sequence example VDD POR

SI SO SS NOP GETx Ready Challenge Echo

tPOR tStartUp

Figure 21 – Start-up sequence, basic scenario, timing diagram VDD POR

SI SO SS NOP OscStop DiagDetails GETx OscStart Ready Challenge Echo

tPOR tStartUp StartAck OscCounter DiagDetails tOscCounter Figure 22 – Start-up sequence timing diagram including Oscillator Frequency Check REVISION 006 – DEC 2016 Page 41 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

Notes:

 The timing tStartUp is specified at chapter Timing Specifications (Section 9)  The Slave answers with NTT in case the first MOSI message occurs prior the end of the initial checks.  The NOP - Challenge Echo is meant to diagnose the SCI link.

13.21. Allowed sequences

Only the message sequences described in this datasheet are accepted by the sensor.

A few more are described below; they combine GET1 or GET2 with MemoryRead or DiagDetails.

The particular timings associated to these sequences do not overrule the general timing specifications.

Message Sequence Chart Single Slave - Combi GET1+MemoryRead

Master Loop Slave GET1 ( à ) MemoryReadAns ( ß )

Message Sequence Chart Single Slave - Combi GET1+DiagDetails

Master Loop Slave GET1 ( à ) DiagDetails ( ß )

MemoryRead ( à ) Regular packet ( ß )

DiagDetails ( à ) Regular packet ( ß )

NOP ( à ) MemoryReadAns ( ß )

NOP ( à ) DiagDetails ( ß )

Figure 23 – MSCs Combi sequences GET1 + MemoryRead and GET1 + DiagDetails REVISION 006 – DEC 2016 Page 42 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet Message Sequence Chart Single Slave - Combi GET2+MemoryRead

Master Loop Slave GET2 ( à ) MemoryReadAns ( ß )

Message Sequence Chart Single Slave - Combi GET2+DiagDetails

Master Loop Slave GET2 ( à ) DiagDetails ( ß ) Sync Pulse Sync Pulse

MemoryRead ( à ) Regular packet ( ß )

DiagDetails ( à ) Regular packet ( ß )

NOP ( à ) MemoryReadAns ( ß )

NOP ( à ) DiagDetails ( ß )

Figure 24 – MSCs Combi sequences GET2 + MemoryRead and GET2 + DiagDetails

14. Traceability Information

Every device contains a unique ID that is programmed by Melexis in the EEPROM. Melexis strongly recommends storing this value during the EOL (End-Of-Line) programming to ensure full traceability of the final product.

These parameters shall never be erased during the EOL programming.

Parameter Comments Address (Hex) Default Values Parameter # bit MLX 48 1012[15:0] MLXID Traceability Information 1014[15:0]

1016[15:0] REVISION 006 – DEC 2016 Page 43 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

15. End-User Programmable Items

The list below describes the parameters that are available to the customer during EOL programming. The parameters will be programmed through the EEWrite message (section 13.17).

It must be noted that the data type of EEWrite message is a word, and therefore it is mandatory to first readback the complete contents of the word before changing only the bits corresponding to the parameter.

103E[7:0] Melexis strongly recommends checking the User Identification data (Parameters USERID) during EOL programming.

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16. Description of End-User Programmable Items

16.1. User Configuration: Device Orientation

MAPXYZ Assignment



 Beta = arctan  



  B 1 B 2 extended across B1=0 and B2=0 max 180 Deg.  

16.3. User Configuration: 3D = 0 formula trimming parameters SMISM and ORTH_B1B2

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Datasheet

MAPXYZ 102A[2:0] 1, 2, 4 or 5 1, 2, 4 or 5 If the magnetic angle ∠XZ or ∠YZ is read, Melexis strongly recommends calibrating the front-end parameters in order to reduce the magnetic accuracy error (see Section 10):

Phase Error

Where ORTH_B1B2 is the phase mismatch between the B1 and B2 signals.

Sensitivity Mismatch between B1 and B2

The parameter SMISM is selected in such a way that:

B1 * SMISM[14:0] / 2 15 and B2 have the same amplitude.

B1 and B2 * SMISM[14:0] / 2 15 have the same amplitude.

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Datasheet

16.4. User Configuration: 3D = 1 formula trimming parameters KALPHA, KBETA, KT

The values K APLHA , K BETA and K T are inputs to the 3D formula (see section 16.2) and allow a targeted reduction of the linearity error through a normalization of the raw signals and a correction prior to the ATAN function.

The characteristics of the filters No. 0 to 3 is given in the following table.

Filter No (j) 0 1 2 3 Type Disable Coefficients a 0 … a 5 N/A 110000 111100 122210

No Filter Extra Light Light Medium 90% Response Time 1 2 4 5 Efficiency RMS (dB) 0 3.0 6.0 6.6 Title Finite Impulse Response

16.6. Virtual Gain Min and Max Parameters

The MLX90363 automatic gain control (AGC) loop selects the electrical gain code within the user-defined range VIRTUALGAINMIN … VIRTUALGAINMAX. Setting VIRTUALGAINMIN = VIRTUALGAINMAX means setting a fixed gain. The min and max virtual gain codes influence directly the sensitivity of the diagnostics D17- “Field Magnitude Too High” and D18-“Field Magnitude Too Low”.

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Datasheet

Unit Identification number: 32 bits freely useable by Customer for traceability purpose.

The FREE bytes can also be used for identification or any other purposes.

16.10. Lock

The calibration parameters of the MLX90363 are locked.

To unlock the write, one must follow the write procedure described in section 13.17.

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Datasheet

17. Self Diagnostic

The MLX90363 provides numerous self-diagnostic features which increase the safety integrity level of the IC, by diagnosing and reporting as many as 18 internal and external failure cases.

Temperature < -80 Deg.C

Field magnitude too high (Norm > 99% ADC Span) (19)

17 Reporting is done through the bits E0 and E1 of the regular messages or the bits Dx of the DiagnosticDetails message. See Table 10 for more details. 18 Diagnostic to be disabled in the 3V3 Application Diagram (V DEC =V DD ).

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MLX90363 Magnetometer IC with High Speed Serial Interface

Datasheet Diagnostic Item Action Bit Notes Field magnitude too low (Norm < 20% ADC Span) (19) Report (17) D18 External failure, given that AGC

keeps Norm above 47% ADC clipping (X, Y, Z, two phases each) Report

(17) D19 External failure Supply voltage monitor (V DD ) and Regulator monitor (V DEC ) (18)

Report (17) (Disabled by default) D20 External failure Firmware Flow monitoring Fail-safe mode n/a Read/Write Access out of physical memory Fail-safe mode n/a Stack Overflow Fail-safe mode n/a Write Access to protected area (IO and RAM Words) Fail-safe mode n/a Unauthorized entry in “SYSTEM” Mode Fail-safe mode n/a Serial Interface Protection Error NTT Message

(20) n/a

Watchdog Timeout Reset (21) n/a Oscillator Frequency (Dedicated SCI Command) n/a n/a Diagnostic performed by Master V DD > MT8V MISO is HiZ n/a 100% Hardware detection. No communication possible.

20

21 The NTT Message is followed by an Error Message. Resetting has the same effects as a POR: the next SO message is therefore Ready.

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18. Firmware Flowcharts

18.1. Start-up sequence

The entry in operation mode is preceded by a startup phase or startup sequence, performing the built-in self tests (performed only once), the automatic analog gain adjustment, the temperature acquisition and a first execution of the built-in self diagnostics (also performed continuously afterwards). The start-up sequence ends with the enabling of the serial interface.

Start-up Sequence on POR BIST RAM BIST Watchdog BIST EEPROM CRC+DED RAM and IO Space Initialization SCI, ADC Driver Initialization Automatic Gain Control (6 x Signal Processing) Temperature Acquisition Digital Diagnostics First Pass ROM, RAM, CPU, EE CRC Analog Diagnostics First Pass ADCMonitor, TempMonitors...

Enable SCI Communication

SO = Ready Background Figure 25 – Firmware start-up sequence REVISION 006 – DEC 2016 Page 51 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

18.2. Signal Processing (GETx)

The digital signal processing performed by the firmware is depicted by the following diagram.

Inputs from EEPROM OfsX0 OfsY0 OfsZ0 Xslope Yslope Zslope T25 Tm40 T125 ORTH SMIS

Inputs from ADC

Xadc

• • • FIR/IIR Filter + * X XB

OfsX = ( OfsX0 + XSlope * dT)

• VG / VGMAX Yadc kalpha kbeta kt FIR/IIR Setting + + - ORTH_XY * FIR/IIR Filter + Y Map X,Y,Z on B1,B2 ,B3

ORTH_ B1B2

• • • SMIS YB

OfsY = ( OfsY0 + YSlope * dT)

• VG / VGMAX Zadc + + - * FIR/IIR Filter + DSP Outputs Z B2 B3 If Marker = 1 ALPHA

Digital Signal (Post)-Processing ZB

SCI Message Coding Case Marker = 2 OfsZ = ( OfsZ0 + ZSlope * dT )

• VG / VGMAX

ALPHA T + * -

T25 T125 + - BETA dT ALPHA Tslope 90363 ABB Digital Signal (Pre)-Processing Tm40 VG SCI Message Coding Case Marker = 1 SCI Message Coding Case Marker = 0

Figure 26 – Block Diagram of Signal Processing – Function Model

18.3. Fail-safe Mode

The purpose of fail-safe mode is to increase the safety integrity, by blocking position calculation and reporting whenever a digital-type error (WD error, ROM Checksum, Firmware flow error…) is detected

In fail-safe mode,

 The analog is [set] inactive  The sensor waits for the Master to initiate a reset  Autonomous reset by watchdog after 100ms, i.e. watchdog running but will not be acknowledged  Only SPI driver and communication handler is active. The only supported MOSI commands is

sciREBOOT  Upon all SPI MOSI commands, the MISO message SPI_ERROR ( = DiagDetailAnswer) is sent  Diagnostics (analog and digital) and background are not running REVISION 006 – DEC 2016 Page 52 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

Fail-safe mode – entry conditions

The fail-safe mode is entered upon:

 Critical error during initialization (RAM BIST, WD BIST, ROM Checksum, EEPROM CRC)  Critical error during background/digital diagnostics (RAM continuous test, ROM test, EEPROM CRC)  Exception, i.e. system level interrupts (Stack-overflow, invalid address, protection error, program

error)  FW flow error

18.4. Automatic Gain Control

The Virtual Gain code is updated at every GET message. The new code value is based on the field strength (Norm) of every raw component (X, Y, Z).

The Automatic Gain Control (AGC) makes sure that Norm is between 47% and 63.5%, by controlling the gain code within the range (VIRTUALGAINMIN, VIRTUALGAINMAX).

The algorithm gives a limitation in term flux density frequency, see Section 10 for specification.

It is not recommended to interrupt the GET message sequence, because AGC iterations are triggered by GET messages. If a pause cannot be avoided, the (E1, E0) error bits of the 6 following GET messages shall be ignored.

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19. Recommended Application Diagrams

19.1. MLX90363 in SOIC-8 Package and 5V Application

5 V V DD_IO V SS_IO 8 SPI MASTER 1 C2 100nF

5 4 /SS C1 47nF Figure 27 – Recommended wiring ( 22) for the MLX90363 in SOIC-8 package and 5V Application

19.2. MLX90363 in SOIC-8 Package and 3V3 Application

3V3 V DD_IO V SS_IO V DD V SS MISO V DEC Test MOSI SCLK /SS MLX90363 SCLK MOSI MISO C1 100nF 5 4 /SS 8 1 SPI MASTER Figure 28 – Recommended wiring (22) for the MLX90363 in SOIC-8 package and 3V3 Application 22 Wiring of the SCI signals must be kept short on the PCB. In other cases, Melexis advises to add 100Ω serial resistor on the SCLK, MOSI, MISO and /SS lines. Melexis also recommends doubling the C1 decoupling capacitor REVISION 006 – DEC 2016 Page 54 of 62 MLX90363 Magnetometer IC with High Speed Serial Interface Datasheet

19.3. MLX90363 in TSSOP-16 Package and 5V Application

C3 100nF 5V V DD_IO MLX90363 V SS_IO SPI MASTER

SCLK 14 SCLK 1 V DEC 1 1 6 SCLK 2 V SS 1 2 16 MOSI 1 Test 1 13 MOSI 8 MOSI 2 V DD 1 3 MISO 4 MISO 1 V DEC 2 9

12 MISO 2 V SS 2 10 /SS 1 15 /SS 1 Test 2 5 /SS 2 7 /SS 2 V DD 2 11 C1 47nF C2 47nF Figure 29 – Recommended ( 23) wiring in TSSOP-16 package (dual die) and 5V Application

19.4. MLX90363 in TSSOP-16 Package and 3V3 Application

3V3 V DD_IO MLX90363 V SS_IO

14 SCLK 1 V DEC 1 1 6 SCLK 2 V SS 1 2 SCLK 16 MOSI 1 Test 1 13 MOSI 8 MOSI 2 V DD 1 3 MISO 4 MISO 1 V DEC 2 9

12 MISO 2 V SS 2 10 /SS 1 15 /SS 1 Test 2 5 /SS 2 7 /SS 2 V DD 2 11 SPI MASTER C1 100nF C2 100nF Figure 30 – Recommended (23) wiring in TSSOP-16 package (dual die) and 3V3 Application 23 Wiring of the SCI signals must be kept short on the PCB. In other cases, Melexis advises to add 100Ω serial resistor on the SCLK, MOSI, MISO and /SS lines. Melexis also recommends doubling the C1, C2 decoupling capacitors.

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20. Standard information regarding manufacturability of Melexis products with different soldering processes

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. For further details about test method references and for compliance verification of selected soldering method for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/en/quality-environment/soldering). For all soldering technologies deviating from the one mentioned in above document (regarding peak temperature, temperature gradient, temperature profile etc), additional classification and qualification tests have to be agreed upon with Melexis. For package technology embedding trim and form post-delivery capability, Melexis recommends consulting the dedicated trim&forming recommendation application note: lead trimming and forming recommendations (http://www.melexis.com/en/documents/documentation/application-notes/leadtrimming-and-forming-recommendations). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment.

21. ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

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22. Package Information

22.1. SOIC-8 - Package Dimensions

1.27 TYP

NOTES:

3.81 5.80 3.99** 6.20** 4.80 4.98* All dimensions are in millimeters (angles in degrees). * Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side). ** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side). *** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.

1.37 1.57 1.52 1.72 0.36 0.46*** 0.19 0.25 0.100 0.250 0.41 1.27 0° 8°

22.2. SOIC-8 - Pinout and Marking

5 8 Part Number MLX90363 (3 digits) Die Version (3 digits) /SS MOSI V DEC V SS Marking :

Top 363Axx M12345

Xy-E REVISION 006 – DEC 2016 M12345

Xy-E Bottom

SCLK Test MISO 4 V DD 1 Axx 363 YY Lot number: “M” + 5 digits Split lot number + “-E” (Optional )

WW

Week Date code (2 digits) Year Date code (2 digits)

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22.3. SOIC-8 - IMC Positionning

CW 8 7 6 5

CCW X 0.46 +/- 0.06

1.16 +/- 0.155 1.25 1.65 1 2 1.96 2.26 3 4 Y Angle detection SOIC-8 6 N 2 3 5 8 7 4 1 2 6 5 3 4 5 8 7 6 5 N 3 4 S S N

1 7 6 ~ 270 Deg.* ~ 180 Deg.* 8 S 1 7 ~ 90 Deg.* N 8 S ~ 0 Deg.* 2 3 4 1 2 * No absolute reference for the angular information.

The MLX90363 is an absolute angular position sensor but the linearity error (Le – See section 10) does not include the error linked to the absolute reference 0 Deg.

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22.4. TSSOP-16 - Package Dimensions

0.65 TYP 12 O TYP 0.20 TYP 0.09 MIN 1.0 DIA

4.30 4.50** 6.4 TYP

0.09 MIN

1.0 12 O TYP 1.0 0.50 0.75 0 O 8 O 1.0 TYP 0.85 0.95 4.90 5.10* 1.1 MAX 0.19 0.30*** 0.09 0.20 0.05 0.15 NOTES:

All dimensions are in millimeters (angles in degrees). * Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side). ** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side). *** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.

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22.5. TSSOP-16 - Pinout and Marking

16 1 V DEC 1 MOSI 1

/SS 1 SCLK 1 363Axx M12345 Xy-E V SS 1 V DD 1 MISO 1 Test 2 SCLK 2 Marking : V DD 2 9 MOSI 2 8 /SS 2 Test 1 MISO 2 V SS 2 Part Number MLX90363 (3 digits) Die Version (3 digits) V DEC 2 Top 363 Axx

M12345 Lot number: “M” + 5 digits

Xy-E

Bottom YY Split lot number + “-E” (Optional)

WW

Week Date code (2 digits) Year Date code (2 digits)

22.6. TSSOP-16 - IMC Positionning

CW

X 2 16 9 Die 1 Die 2 Y 2 Y 1 0.30 +/- 0.06 CCW 1.95 2.45 1 0.70 +/- 0.13 8 1.84 2.04 X 1

2.76 2.96 REVISION 006 – DEC 2016 Page 60 of 62

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Datasheet Angle detection TSSOP-16 ~ 180 Deg.*

16 9 Die 2 S S Die 2 9 Die 1 N 1 ~ 90 Deg.*

16 S Die 1 8 ~ 270 Deg.*

9 S 16 Die 2 1 ~ 0 Deg.* ~ 180 Deg.* 9 Die 1 8 1 ~ 270 Deg.*

16 N N Die 1 ~ 90 Deg.* 8 1 Die 2

N~ 0 Deg.* 8 * No absolute reference for the angular information.

The MLX90363 is an absolute angular position sensor but the linearity error (Le – See section 10) does not include the error linked to the absolute reference 0 Deg.

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23. Disclaimer

The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services. The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current. Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a particular purpose. The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights. This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities. The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or life-sustaining equipment are specifically not recommended by Melexis. The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons: 2) civil firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any similar violent situation. The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-conditions.

This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.

Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)

ISO/TS 16949 and ISO14001 Certified

24. Contact

For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our Direct Sales team and get help for your specific needs:

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